umx502 - umx812 datasheet surface mount melf pin diodes downloaded from: http:///
surface mount melf pin diodes 2 microsemi corporate headquarters one enterprise, aliso viejo, ca 92656 usa within the usa: +1 (800) 713 - 4113 outside the usa: +1 (949) 380 - 6100 sales: +1 (949) 380 - 6136 fax: +1 (949) 215 - 4996 e - mail: sales.support@microsemi.com www. microsemi.com ? 2016 microsemi corporation. all rights reserved. microsemi and the microsemi logo are trademarks of microsemi corporation. all other trademarks and service marks are the prop erty of their respective owners. microsemi corporation (nasdaq: ms cc) offers a comprehensive portfolio of semiconductor and system solutio ns for communications, defense and security, aerospace, and industrial markets. products include high - performance and radiation- hardened analog mixed - signal integrated circuits, fpgas, socs, and asics; power management products; timing and synchronization devices a nd precise time solutions ; voice processing devices; rf solutions; discrete components; e nterprise s torage and communications solutions; security technologies and scalable ant i- tamper products; ethernet solutions; power - over - ethern et ics and midspans; custom design capabilities and services. microsemi is headquartered in aliso viejo, california and has approximately 4,800 emp loyees worldwide . learn more at www.microsemi.com microsemi makes no warranty, representation, or guarantee reg arding the information contained herein or the suitability of its products and services for any particular purpose, nor does microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. the products sold hereunder and any other products sold by microsemi have been subje ct to limited testing and should not be used in conjunction with mission -c ritical equipment or applications. any performance specifications are believed to be reliable but are not ve rified, and buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end - products. buyer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the buyers responsibility to ind ependently determine suitability of any products and to test and verify the same. the information provided by microsemi hereunder is provided as is, where is and with all faults, and the entire risk as sociated with such information is entirely with the buyer. microsemi does not grant, explici tly or implicitly, to any party any patent rights, licenses, or any ot her ip rights, whether with regard to such information itself or any thing described by such information. information provided in this docum ent is proprietary to microsemi, and microsemi reserves the right to make any changes to the inform ation in this docu ment or to any products and services at any time without notice. downloaded from: http:///
surface mount melf pin diodes 3 revision history 1.1 revision 1.0 revision 1.0 was the first publication of this document. downloaded from: http:///
surface mount melf pin diodes 4 contents revision history .............................................................................................................................. 3 1.1 revision 1.0 ................................................................................................................................................ 3 2 product overview .................................................................................................................... 7 2.1 applications ............................................................................................................................................... 7 2.1.1 key features ................................................................................................................................ 7 2.1.2 appl ications and benefits ............................................................................................................ 7 3 electrical specifications ............................................................................................................ 8 3.1 absolute maximum ratings ....................................................................................................................... 8 3.2 device electrical parameters ...................................................................................................................... 8 3.3 typical rs curves ....................................................................................................................................... 9 4 package outline ...................................................................................................................... 10 downloaded from: http:///
surface mount melf pin diodes 5 list of figures figure 1 typical rs curves ........................................................................................................................................... 9 figure 2 umx502 - umx812 package outlines ............................................................................................................ 10 downloaded from: http:///
surface mount melf pin diodes 6 list of tables table 1 absolute maximum ratings ............................................................................................................................ 8 table 2 device electrical parameters at 25 c ............................................................................................................. 8 table 3 umx502 - umx812 package dimensions ....................................................................................................... 10 downloaded from: http:///
surface mount melf pin diodes 7 2 product overview this line of m etal electrode leadless face ( melf ) high - power pin diodes consist s of hermetically sealed surface mount packaged devices with full - face bonded chips for low - inductance construction. the melf ceramic package has square - end terminations , which are ideal for surface mount and pick - and - place operations. the pin diode chips are coated with a specia l hard glass passivation , which is required both for high - power applications and to enhance the reliability , r esulting in mean time between failures ( mtbfs ) of greater than one million hours. these rohs - compliant products meet the requireme nts of eu directive 2002/95/ec. the standard terminal finish is matte tin unless otherwise specified. alternative terminal finishes are available. consult the factory if you have special requirements. 2.1 applications the melf diodes are used as switching, attenuating , and phase - shif ting elements from hf through 2 ghz , and have breakdown voltage ratings up to 500 v . low - magnetic 1 cer - met melfs are also used as switching elements in magnetic resonance imaging ( mri ). conventional m agnetic melf packages are used in c ellular applications, b eam -s teering units (telephone via satellites) , surface mount applications, and s witch - filter banks f or frequency - hopping radios. 1. rohs versions are supplied with a matte tin finish. 2.1.1 key features ? low -magnetic (ideal for mri applications) ? very low inductance , full -f ace b onding ? hi gh -r el iability hermetic design ? surface mount devices available in tape and reel ? rohs compliant 2 ? esd hmb class 2 2. rohs versions are supplied with a matte tin finish. 2.1.2 applications and benefits ? designed for low-l oss and l ow -distortion a pplications ? switch -f ilter bank ? t/r control ? attenuators ? mri switching downloaded from: http:///
surface mount melf pin diodes 8 3 electrical specifications 3.1 absolute maximum ratings the following table shows the absolute maximum ratings at 25 c unless otherwise specified. table 1 absolute maximum ratings rating symbol value unit maximum l eakage c urrent at 80% of m inimum r ated v b i r 500 na forward c urrent (1 s p ulse) i f 1 a operating t emperature t op C 55 to 1 50 c storage t emperature t stg C55 to 1 50 c maximum s older t emperature 260 c 3.2 device electrical parameters the following table shows the absolute maximum ratings at 25 c . table 2 device electrical parameters at 25 c model number v b (v) i r = 10 a (min) c t (pf) 3 @50 v (max) r s () 4 @100 ma (max) r s () 4 @200 ma (typ) t l ( s) (typ) p (?c/w) t hermal resistance (max) um x502 C f 500 0.5 0.85 0.55 1.5 35 um x504 C f 500 0.6 0.65 0.45 3.0 20 um x508 C f 500 0.9 0.45 0.25 5.0 15 um x509 C f 500 1.2 0.40 0.2 5.5 15 um x512 C f 500 1.5 0.30 0.12 4.0 15 um x812 C f 500 1.3 0.45 0.25 5.5 15 3. capacitance (ct) is measured at f = 1 mhz. 4. series r esistance (rs) is measured at f = 100 mhz. downloaded from: http:///
surface mount melf pin diodes 9 3.3 typical rs curves the following illustration shows the typical rs curves. figure 1 typ ic al rs curves 0.1 1 10 100 1000 10000 0.001 0.01 0.1 1 10 100 series resistance (ohms) forward current (ma) umx502 umx504 umx508 umx509 umx512 umx812 downloaded from: http:///
surface mount melf pin diodes 10 4 package outline the umx502 - umx812 devices have the following package outline specifications. figure 2 umx502 - umx812 package outlines table 3 umx502 - umx812 package dimensions dim inches millimeters min typ max min typ max a 0.080 0.095 2.032 2.413 b 0.115 0.135 2.921 3.429 c 0.008 0.030 0.203 0.762 downloaded from: http:///
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