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? 2005 microchip technology inc. ds21942b-page 1 MCP9700/01 features ? tiny analog temperature sensor ? available packages: sc70-5 ? wide temperature measurement range: - -40c to +125c ? accuracy: 4c (max.), 0c to +70c ? optimized for analog-to-digital converters (adcs): - MCP9700: 10.0 mv/c (typ.) - mcp9701: 19.5 mv/c (typ.) ? wide operating voltage range: - MCP9700: v dd = 2.3v to 5.5v - mcp9701: v dd = 3.1v to 5.5v ? low operating current: 6 a (typ.) ? optimized to drive large capacitive loads typical applications ? hard disk drives and other pc peripherals ? entertainment systems ? home appliance ? office equipment ? battery packs and portable equipment ? general purpose temperature monitoring description the MCP9700/01 linear active thermistor? intergrated circuit (ic) is an analog temperature sen- sor that converts temperature to analog voltage. it?s a low-cost, low-power sensor with an accuracy of 4c from 0c to +70c while consuming 6 a (typ.) of operating current. unlike resistive sensors (s uch as thermistors), the linear active thermistor ic does not require an additional signal-conditioning circuit. therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. the voltage output pin (v out ) can be directly connected to the adc input of a microcontroller. the MCP9700 and mcp9701 temperature coefficients are scaled to provide a 1 c/bit resolution for an 8-bit adc with a reference voltage of 2.5v and 5v, respectively. the MCP9700/01 provides a low-cost solution for applications that require measurement of a relative change of temper ature. when measuring relative change in temperature from +25c, an accuracy of 1c (typ.) can be realized from 0c to +70c. this accuracy can also be achieved by applying system calibration at +25c. in addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. this provides print ed circuit board (pcb) layout design flexibility by enabling the device to be remotely located from the microcontroller. adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. however, capacitive load is not required for sensor output stability. package type typical application circuit gnd v dd v out nc 4 1 2 3 5 sc70-5 nc MCP9700 mcp9701 gnd v dd MCP9700/01 picmicro ? mcu ani mclr v dd 10 k v ss v dd v out c bypass v dd 0.1 f low-power linear active thermistor? ics
MCP9700/01 ds21942b-page 2 ? 2005 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd :...................................................................... 6.0v storage temperature: ........................ -65c to +150c ambient temp. with power applied:.. -40c to +125c junction temperature (t j ):................................. 150c esd protection on all pins (hbm:mm):.... (4 kv:200v) latch-up current at each pi n: ...................... 200 ma ?notice: stresses above those listed under ?maximum ratings? may cause permanent dam age to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics electrical specifications: unless otherwise indicated: MCP9700: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load. mcp9701: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load. parameter sym min typ max unit conditions power supply operating voltage range v dd v dd 2.3 3.1 ? ? 5.5 5.5 v v MCP9700 mcp9701 operating current i dd ? 6 12 a power supply rejection ratio psrr ? 0.1 ? c/v sensor accuracy (notes 1, 2) t a = +25c t a = 0c to +70c t a = -40c to +125c t a = -10c to +125c t acy t acy t acy t acy ? -4.0 -4.0 -4.0 1 ? ? ? ? +4.0 +6.0 +6.0 c c c c MCP9700 mcp9701 sensor output output voltage: t a = 0c t a = 0c v 0c v 0c ? ? 500 400 ? ? mv mv MCP9700 mcp9701 temperature coefficient t c1 t c1 ? ? 10.0 19.5 ? ? mv/c mv/c MCP9700 mcp9701 output non-linearity v onl ?0.5? ct a = 0c to +70c (note 2) output current i out ??100a output impedance z out ?20? i out = 100 a, f = 500 hz output load regulation v out / i out ?1? t a = 0c to +70c, i out = 100 a turn-on time t on ?800? s typical load capacitance ( note 3 )c load ? ? 1000 pf thermal response to 63% t res ? 1.3 ? s 30c (air) to +125c (fluid bath) ( note 4 ) note 1: the MCP9700 accuracy is tested with v dd = 3.3v, while the mcp9701 accuracy is tested with v dd = 5.0v. 2: the MCP9700/01 is characterized using the first-or der or linear equation, as shown in equation 4-2. 3: the MCP9700/01 family is characterized and production-tested with a capacitive load of 1000 pf. 4: thermal response with 1x1 inch, dual-sided copper clad.
? 2005 microchip technology inc. ds21942b-page 3 MCP9700/01 m temperature characteristics electrical specifications: unless otherwise indicated: MCP9700: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load. mcp9701: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load. parameters sym min typ max units conditions temperature ranges specified temperature range t a -40 ? +125 c MCP9700 ( note ) t a -10 ? +125 c mcp9701 ( note ) operating temperature range t a -40 ? +125 c storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5l-sc70 ja ?331? c/w note: operation in this range must not cause t j to exceed maximum junction temperature (+150c).
MCP9700/01 ds21942b-page 4 ? 2005 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, MCP9700 : v dd = 2.3v to 5.5v; mcp9701 : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-1: accuracy vs. ambient temperature. figure 2-2: accuracy vs. ambient temperature, with v dd . figure 2-3: supply current vs. temperature. figure 2-4: changes in accuracy vs. ambient temperature (due to load). figure 2-5: load regulation vs. ambient temperature. figure 2-6: output impedance vs. frequency. note: the graphs and tables provided following this note ar e a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. -4.0 -2.0 0.0 2.0 4.0 6.0 -50-25 0 255075100125 t a (c) accuracy (c) MCP9700 v dd = 3.3v mcp9701 v dd = 5.0v spec. limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 t a (c) accuracy (c) MCP9700 v dd = 5.5v v dd = 2.3v mcp9701 v dd = 5.5v v dd = 3.1v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 t a (c) i dd (a) MCP9700 mcp9701 -0.2 -0.1 0 0.1 0.2 -50 -25 0 25 50 75 100 125 t a (c) ' accuracy due to load (c) mcp9701 v dd = 5.0v MCP9700 v dd = 3.3v i load = 100 a 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 t a (c) load regulation ' v/ ' i ( : ) MCP9700/01 v dd = 3.3v i out = 50 a i out = 100 a i out = 200 a 1 10 100 1000 0.1 1 10 100 1000 10000 100000 frequency (hz) output impedance ( : ) v dd = 5.0v i out = 100 a t a = 26c 1k 10k 100k 100 10 1 0.1
? 2005 microchip technology inc. ds21942b-page 5 MCP9700/01 note: unless otherwise indicated, MCP9700 : v dd = 2.3v to 5.5v; mcp9701 : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-7: output voltage at 0c (MCP9700). figure 2-8: occurrences vs. temperature coefficient (MCP9700). figure 2-9: power supply rejection ration (psrr) vs. ambient temperature. figure 2-10: output voltage at 0c (mcp9701) . figure 2-11: occurrences vs. temperature coefficient (mcp9701). figure 2-12: power supply rejection ratio (psrr) vs. temperature. 0% 5% 10% 15% 20% 25% 30% 35% 400 420 440 460 480 500 520 540 560 580 600 v 0c (mv) occurrences MCP9700 v dd = 3.3v 108 samples 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 9.5 9.6 9.7 9.8 9.9 10.0 10.1 10.2 10.3 10.4 10.5 t c1 (mv/c) occurrences MCP9700 v dd = 3.3v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 t a (c) normalized psrr (c/v) MCP9700 v dd = 2.3v to 5.5v MCP9700 v dd = 2.3v to 4.0v 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 19.0 19.1 19.2 19.3 19.4 19.5 19.6 19.7 19.8 19.9 20.0 t c1 (mv/c) occurrences mcp9701 v dd = 5.0v 108 samples 0% 5% 10% 15% 20% 25% 30% 35% 300 320 340 360 380 400 420 440 460 480 500 v 0c (mv) occurrences mcp9701 v dd = 5.0v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 t a (c) normalized psrr (c/v) mcp9701 v dd = 3.1v to 5.5v mcp9701 v dd = 3.1v to 4.0v
MCP9700/01 ds21942b-page 6 ? 2005 microchip technology inc. note: unless otherwise indicated, MCP9700 : v dd = 2.3v to 5.5v; mcp9701 : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-13: output voltage vs. power supply. figure 2-14: output vs. settling time to step v dd . figure 2-15: thermal response. figure 2-16: output voltage vs. ambient temperature. figure 2-17: output vs. settling time to ramp v dd . 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.00.51.01.52.02.53.03.54.04.55.05.5 v dd (v) v out (v) t a = 26c 0 2 4 6 8 10 12 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 time (ms) v out (v) -2.5 -1.7 -0.8 0.0 0.8 1.7 2.5 i dd (ma) v dd_step = 5 v t a = 26c i dd v out 30 55 80 105 130 -2024681012141618 time (s) output (c) sc70-5 30c (air) to 125c (fluid bath) 1 in. x 1 in. copper clad 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 t a (c) v out (v) MCP9700 mcp9701 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.00.10.20.30.40.50.60.70.80.91.0 time (ms) v out (v) -42.0 -30.0 -18.0 -6.0 6.0 18.0 30.0 i dd (a) i dd v out v dd_ramp = 5v/ms t a = 26c
? 2005 microchip technology inc. ds21942b-page 7 MCP9700/01 3.0 pin descriptions the descriptions of the pins are listed in dc electrical characteristics. table 3-1: pin function table 3.1 power ground pin (gnd) gnd is the system ground pin. 3.2 output voltage pin (v out ) the sensor output can be measured at v out . the voltage range over the oper ating temperature range for the MCP9700 is 100 mv to 1.75v and for the mcp9701, 200 mv to 3v . 3.3 power supply input (v dd ) the operating voltage as s pecified in the dc electrical characteristics table is applied to v dd . pin no. name function 1 nc no connect 2 gnd power ground pin 3v out output voltage pin 4v dd power supply input 5 nc no connect
MCP9700/01 ds21942b-page 8 ? 2005 microchip technology inc. 4.0 applications information the linear active thermistor? ic uses an internal diode to measure temperat ure. the diode electrical characteristics have a te mperature coefficient that provides a change in voltage based on the relative ambient temperature from -40c to 125c. the change in voltage is scaled to a temperature coefficient of 10.0 mv/c (typ.) for the MCP9700 and 19.5 mv/c (typ.) for the mcp9 701. the output voltage at 0c is also scaled to 500 mv (typ.) and 400 mv (typ.) for the MCP9700 and mcp9701, respectively. this linear scale is described in the first-order transfer function shown in equation 4-1. equation 4-1: sensor transfer function 4.1 improving accuracy the MCP9700/01 accuracy can be improved by performing a system calibration at a specific tempera- ture. for example, calibrating the system at +25c ambient improves the measurement accuracy to a 0.5c (typ.) from 0c to +70c, as shown in figure 4-1. therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. figure 4-1: relative accuracy to +25c vs. temperature. the change in accuracy from the calibration tempera- ture is due to the output non-linearity from the first-order equation, as specified in equation 4-2. the accuracy can be further improved by compensating for the output non-linearity. for higher accuracy using a sensor compensation technique, refer to an1001 ?ic temperature sensor accuracy compensation with a picmicro ? microcontroller? (ds01001). the application note shows that if the MCP9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to 0.5c (typ.) accuracy over the operating temperature (figure 4-2). figure 4-2: MCP9700 calibrated sensor accuracy. the compensation technique provides a linear temper- ature reading. a firmware look-up table can be generated to compensate for the sensor error. 4.2 shutdown using microcontroller i/o pin the MCP9700/01 low operating current of 6 a (typ.) makes it ideal for battery-powered applications. however, for applications that require tighter current budget, this device can be powered using a microcon- troller input/output (i/o) pi n. the i/o pin can be toggled to shut down the device. in such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/01 as power supply noise. this switching noise compromises measurement accuracy. therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 layout considerations the MCP9700/01 does not require any additional components to operate. however, it is recommended that a decoupling capacitor of 0.1 f to 1 f be used between the v dd and gnd pins. in high-noise applica- tions, connect the power supply voltage to the v dd pin using a 200 resistor with a 1 f decoupling capacitor. a high-frequency ceramic capacitor is recommended. it is necessary for the capacitor to be located as close as possible to the v dd and gnd pins in order to provide effective noise protection. in addition, avoid tracing digital lines in close proximity to the sensor. v out t c1 t a v 0 c + ? = where: t a = ambient temperature v out = sensor output voltage v 0c = sensor output voltage at 0c t c1 = temperature coefficient -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 t a (c) accuracy (c) v dd = 3.3v 10 samples -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 temperature (c) accuracy (c) + v average - v spec. limits 100 samples
? 2005 microchip technology inc. ds21942b-page 9 MCP9700/01 4.4 thermal considerations the MCP9700/01 measures temperature by monitor- ing the voltage of a diode located in the die. a low-impedance thermal path between the die and the pcb is provided by the pins. therefore, the MCP9700/01 effectively monitors the temperature of the pcb. however, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. this limi- tation applies to plastic-packaged silicon temperature sensors. if the application requires measuring ambient air, the pcb needs to be designed with proper thermal conduction to the sensor pins. the MCP9700/01 is designed to source/sink 100 a (max.). the power dissipation due to the output current is relatively insignificant. the effect of the output current can be described using equation 5-1. equation 4-2: effect of self-heating at t a = +25c (v out = 0.75v) and maximum specifica- tion of i dd =12a, v dd = 5.5v and i out = +100 a, the self-heating due to power dissipation (t j ? t a ) is 0.179c. t j t a ? ja v dd i dd v dd v out ? () + i out () = where: t j = junction temperature t a = ambient temperature ja = package thermal resistance (331c/w) v out = sensor output voltage i out = sensor output current i dd = operating current v dd = operating voltage
MCP9700/01 ds21942b-page 10 ? 2005 microchip technology inc. 5.0 packaging information 5.1 package marking information 5-lead sc-70 ( MCP9700 ) example: xxn (front) yww (back) au2 (front) 548 (back) device code MCP9700 aun mcp9701 avn note: applies to 5-lead sc-70. 5-lead sc-70 ( mcp9701 ) example: xxnn legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e device code MCP9700 aunn mcp9701 avnn note: applies to 5-lead sc-70. av25
? 2005 microchip technology inc. ds21942b-page 11 MCP9700/01 5-lead plastic small outline transistor (lt) (sc-70) 0.30 0.15 .012 .006 b lead width 0.18 0.10 .007 .004 c lead thickness 0.30 0.10 .012 .004 l foot length 2.20 1.80 .087 .071 d overall length 1.35 1.15 .053 .045 e1 molded package width 2.40 1.80 .094 .071 e overall width 0.10 0.00 .004 .000 a1 standoff 1.00 0.80 .039 .031 a2 molded package thickness 1.10 0.80 .043 .031 a overall height 0.65 (bsc) .026 (bsc) p pitch 5 5 n number of pins max nom min max nom min dimension limits millimeters * inches units dimensions d and e1 do not include mold flash or protrusions. mo ld flash or protrusions shall not exceed .005" (0.127mm) per s ide. notes: jeita (eiaj) standard: sc-70 revised 07-19-05 * controlling parameter top of molded pkg to q1 .004 .016 0.10 0.40 lead shoulder bsc: basic dimension. theoretically exact value shown wi thout tolerances. see asme y14.5m l e1 e c d 1 b p a2 a q1 n a1 drawing no. c04-061
MCP9700/01 ds21942b-page 12 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21942b-page 13 MCP9700/01 appendix a: revision history revision b (october 2005) the following is the list of modifications: ? added section 3.0 ?pin descriptions? ? added the linear active thermistor? ic trademark ? removed the 2 nd order temperature equation and the temperature coef icient histogram ? added a reference to an1001 and corresponding verbiage ? added figure 4-2 and corresponding verbiage revision a (march 2005) ? original release of this document.
MCP9700/01 ds21942b-page 14 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21942b-page 15 MCP9700/01 product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: MCP9700t: linear active thermistor? ic, tape and reel, pb free mcp9701t: linear active thermistor? ic, tape and reel, pb free temperature range: e = -40 c to +125 c package: lt = plastic small outline transistor, 5-lead part no. x /xx package temperature range device examples: a) MCP9700t-e/lt:linear active thermistor? ic, tape and reel, -40 c to +125 c, 5ld sc70 package. a) mcp9701t-e/lt:linear active thermistor? ic, tape and reel, -40 c to +125 c, 5ld sc70 package. ?
MCP9700/01 ds21942b-page 16 ? 2005 microchip technology inc. notes:
? 2005 microchip technology inc. ds21942b-page 17 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meet s with your specifications. microchip makes no repr esentations or war- ranties of any kind whet her express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability ar ising from this information and its use. use of microchip?s prod ucts as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microc hip technology incorporated in the u.s.a. and other countries. amplab, filterlab, migratable memory, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzyl ab, in-circuit serial programming, icsp, icepic, linear active thermistor, mpasm, mplib, mplink, mpsim, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance and wiperlock are trademarks of microchip te chnology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2005, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:200 2 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified.
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