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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto smd ledproduct data sheetLTSA-G6SPVEKT spec no.: ds35-2016-0088effective date: 10/12/2016revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 1. description smd led s from lite - on are available in miniature sizes and special configurations for automated pc board assembly and space - sensitive a pplications. these smd led s are suitable for use in a wide variety of a ftermar k et . 1 . 1 features ? meet rohs ? package in 8mm tape on 7" diameter reels ? preconditioning: accelerate to jedec level 3 ? eia std package ? i.c. compatible ? compatible with automatic placement equipment ? compatible with infrared reflow solder process 1 . 2 applications ? a ftermarket : access o ry applications, 2 . package dimensions part no. lens color source color lt sa - g6spvekt water clear alingap red notes : 1. all dimensions are in millimeters. 2. tolerance is 0.2 mm (.008") unless otherwise noted. 3. anode lead frame is heat sink of led.
2 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 3.2 thermal characteristics parameter symbol typ. max. unit thermal resistance ( junction C ambient ) note rth ja 5 0 - c /w thermal resistance ( junction C solder point) note rth j s 3 0 - c /w junction temperature t j - 1 1 5 c note : rth ja measurement condition substrate: fr4 (t=1.6mm) / pattern size: 16mm 2 3. rating and characteristics 3 . 1 absolute maximum ratings at ta=25 c parameter lt sa - g6spvekt unit power dissipation 530 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 1000 ma dc forward current 20 0 ma operating temperature range - 40 c to + 110 c storage temperature range - 40 c to + 1 1 0 c infrared soldering condition 260 c for 10 seconds
3 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 3.3 suggest ir reflow condition f or pb free process: ir - reflow soldering profile for lead free soldering (a cc. to j - std - 020 )
4 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t n otes : 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve 2. ? 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromatici ty diagram and represents the single wavelength which defines the color of the device . dominate wavelength tolerance is +/ - 1nm . 4. forward voltage tolerance is +/ - 0.1 volt. 5. reverse voltage (vr) condition is applied to ir test only. the device is not designed for reverse operation. 3 . 4 electrical / optical characteristics at ta=25 c parameter symbol part no. lt sa - min. typ. max. unit test condition luminous intensity iv g6spvekt 3.55 - 9.0 cd if = 14 0ma note 1 viewing angle 2 ? 1/2 g6spvekt - 120 - deg note 2 (fig. 5 ) peak emission wavelength ? - 631 - nm measurement @peak (fig.1) dominant wavelength ? 620 - 629 nm if = 14 0ma note 3 spectral line half - width ? ? - 18 - nm forward voltage vf g6spvekt 1.9 - 2 . 65 v if = 14 0ma note 4 reverse current ir g6spvekt - 10 a
5 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 4 . bin rank batch description on label: vf / iv /wd ( ex. g/da/ 1 ) v f ran k forward voltage (vf) unit : v @ 14 0ma bin code min. max. c 1.90 2.05 d 2.05 2.20 e 2.20 2.35 f 2.35 2.50 g 2.50 2.65 tolerance on each voltage bin is +/ - 0.1v ? iv rank luminous intensity (iv) unit : cd @ 14 0ma bin code min. max. cb 3.55 4.5 da 4.5 5.6 db 5.6 7.1 ea 7.1 9.0 tolerance on each intensity bin is +/ - 11% ? wd rank dominant wavelength (wd) unit : nm @ 14 0ma bin code min. max. 1 620 629 tolerance for each dominate wavelength bin is +/ - 1nm
6 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 5 . typical electrical / optical characteristics curves . 25 c ambient temperature unless special noted) fig. 2 spatial distributio n
7 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 6 . user guide 6 . 1 cleaning do not use unspecified chemical liquid to clean led they could harm the package. if cleaning is necessary, immerse the led in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. 6 . 2 recommend printed circuit board attachment pad infrared reflow soldering 6 . 3 package dimensions o f tape and reel n ote : 1. all dimensions are in millimeters.
8 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 6 . 4 package dimensions of reel notes: 1. empty co mponent pockets sealed with t o p cover tape. 2. 7 inch reel 1 000 pieces per reel. 3. the maximum number of consecutive missing lamps is two. 4. in accordance with ansi/eia 481 specifications.
9 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 7 . c autions 7 . 1 application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardiz e life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7 . 2 storage the package is sealed: the leds should be stored at 30c or less and 70%rh or less. and the leds are limited to use within one year, while the leds is packed in moisture - proof package wit h the desiccants inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature and 60% relative humidity. it is recommended that leds out of their original packaging are ir - reflowed within 168 hrs . for extended storage o ut of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. leds stored out of their original packaging for more than 168 hrs should be baked at abou t 60 c for at least 48 hours before solder assembly. 7 . 3 cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the led if necessary. 7 . 4 soldering recommended soldering conditions: reflow soldering soldering iron pre - heat pre - heat time peak temperature soldering time 150~200c 120 sec. max. 260c max. 10 sec. max.(max. two times) temperature soldering time 300c max. 3 sec. max. (one time only) notes: because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. however, you can successfully mount your packages to the pcb by following the proper guidelines and pcb - specific characterization. lite - on runs both component - level verification using in - house kyramx98 reflow chambers and board - level assembly. the results of this testing are verified through post - reflow reliability testing.profiles used at lite - on are based on jedec standards to ensure that all packages can be successfully and reliably surface mounted. figure on page3 shows a sample temperature profile compliant to jedec standards. you can use this example as a gener ic target to set up your reflow process. you should adhere to the jedec profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
10 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 7 . 5 drive method a led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown i n circuit a below. circuit model a circuit model b (a) recommended circuit. (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. 7 . 6 esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use of a conductive wrist band or anti - electrostatic glove when handling these leds. ? all devices, equipment, and machinery must be pr operly grounded. ? work tables, storage racks, etc. should be properly grounded. ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handling. esd - damaged leds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no lightup at low currents. to verify for esd damage, check for lightup and vf of the suspect leds at low currents. the vf of go od leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap product. led led
11 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 8 . reliability test 8.1 test item/condition: no. test item test condition reference standard 1 pre - conditioning msl 3 1 25 , 24 hrs baking moisture soak 60 /60% 52 hrs interval: 15mins ~ 4 hours to do ir - reflow jesd22 a - 11 3 2 high temperature forward bias ( htfb) ta= 70 2c if: 200 ma 1000 hrs eiaj ed - 4701/100 (101) 3 high temperature forward bias ( htfb) ta= 110 2c if: 50ma 1000 hrs eiaj ed - 4701/100 (101) 4 low temperature operating life ta= - 40 2c if= 200ma 1000 hrs eiaj ed - 4701/100 (101) 5 high temperature storage ta= 110 2c 1000 hrs eiaj ed - 4701/100 (201) 6 low temperature storage ta= - 40 2c 1000 hrs eiaj ed - 4701/100 (202) 7 high temperature high humidity bias (hthhb) ta=60 , rh=90% if= 200ma 1000 hrs eiaj ed - 4701/100 (102) 8 thermal shock (air to air) - 40 5 ~ 100 5 30min 30min 300cycles eiaj ed - 4701/300 (307) 9 temperature cycle (tc) - 40 c ~ 25 c ~ 1 00 c ~ 25 c 3 0 min 5 min 3 0 min 5 min 3 00 cycles eiaj ed - 4701/100 (105) 10 resistance to solder heat tsld=260 c , 10sec. 3times jesd22a - 111 11 solderability tsld = 2 45 5 c , 5 sec , leas - free solder j - std - 002 jesd22b102
12 / 1 2 part no. : lt sa - g6spvekt bns - od - fc002/a4 smd led lt sa - g6spvekt t 9 . others the appearance and specifications of the product may be modified for improvement without prior notice. 10 . suggested checking list training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workst ation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for ingan led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators ( e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycles? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file?

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