VMMK-2203 e-phemt amplifer in a wafer scale package (1 - 10ghz) product brief description avago technologies has combined its industry lead - ing e-phemt technology with a revolutionary chip scale package. the gaascap wafer scale sub-miniature lead - less package is small and ultra thin, yet can be handled and placed with standard 0402 pick and place assembly. this product is easy to use since it requires only positive dc voltages for bias and no matching coefcients are re - quired for impedance matching to 50 systems. applications ? 2.4 ghz, 3.5ghz, 5-6ghz wlan and wimax notebook computer, access point and mobile wireless applications ? 802.16 & 802.20 bwa systems ? military radar, radio and ecm systems gaascap 0402, 1.0mm x 0.5mm x 0.25mm pin connections (top view) figure 1. gain, nf, bypass & oip3 vs. frequency v d d r f o u t r f i n h g l n a 0 5 1 0 1 5 2 0 0 2 4 6 8 1 0 f r e q u e n c y ( g h z ) g a i n , n f , o i p 3 ( d b , m ) g a i n n f o i p 3 features ? sub-miniature 0402 (1mm x 0.5mm) surface mount leadless package ? low height (0.25mm) ? frequency range 1 to 10 ghz ? enhancement mode specifcations (5.0v, 28ma typ. @ 5 ghz) ? 16 db available gain ? 2.3 db noise figure ? 15 dbm output 3rd order intercept VMMK-2203 product dc and rf specifcations symbol parameters/condition unit typ. frequency ghz 1-10 vdd supply voltage v 5 idd supply current ma 28 ga associated gain db 16 nf noise figure db 2.3 s11 input return loss db -10 s22 output return loss db -10 oip3 output 3rd order ip dbm +15
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies limited. all rights reserved. av02-1251en - may 12, 2008 recommended smt attachment the vmmk packaged devices are compatible with high volume surface mount pcb assembly processes. manual assembly for prototypes 1. follow esd precautions while handling packages. 2. handling should be along the edges with tweezers or from topside if using a vacuum collet. 3. recommended attachment is solder paste. please see figure 8 for recommended solder refow profle. conductive epoxy is not recommended. hand soldering is not recommended. 4. apply solder paste using either a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical and electrical performance. excessive solder will degrade rf performance. 5. follow solder paste and vendors recommendations when developing a solder refow profle. a standard profle will have a steady ramp up from room temperature to the pre-heat temp to avoid damage due to thermal shock. 6. packages have been qualifed to withstand a peak temperature of 260oc for 20 to 40 sec. verify that the profle will not expose device beyond these limits. 7. clean of fux per vendors recommendations. 8. clean the module with acetone. rinse with alcohol. allow the module to dry before testing. 0 . 5 m m 1 . 0 5 m m 0 . 2 5 m m b y y y 0 . 2 m m 0 . 3 m m 0 . 7 m m 0 . 8 m m 0 . 5 m m 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 s e c o n d s t e m p e r a t u r e - c r a m p 1 p r e h e a t r a m p 2 r e f l o w p e a k = 2 5 0 5 c m e l t i n g p o i n t = 2 1 8 c c o o l i n g figure 2. suggested lead-free refow profle for snagcu solder paste outline drawing top and side view bottom view notes: 1. ? indicates pin 1 2. dimensions are in millimeters 3. pad material is minimum 5.0 um thick au notes: 1. 0.010 rogers ro4350 suggested pcb material and land pattern . 0 1 4 [ 0 . 3 5 6 ] . 0 1 0 [ 0 . 2 5 4 ] . 0 2 0 [ 0 . 5 0 8 ] . 0 0 5 [ 0 . 1 2 7 ] . 0 0 8 [ 0 . 2 0 3 ] . 0 2 2 [ 0 . 5 5 9 ] . 0 1 4 [ 0 . 3 5 6 ]
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