features bidirectional tvs 3.3 v low capacitance - 13 pf esd protection 15 kv 0402 dfn package rohs compliant* applications computers and peripherals communication systems audio & video equipment portable instrumentation handheld portable devices maximum ratings (@ t a = 25 ? unless otherwise noted) cddfn2-t3.3b - surface mount tvs diode *rohs directive 2002/95/ec jan. 27, 2003 including annex and rohs recast 2011/65/eu june 8, 2011. speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. parameter symbol value unit storage temperature t stg -55 to +150 ? operating temperature t opr -55 to +85 ? esd protection per iec 61000-4-2 contact discharge air discharge esd esd 15 15 kv kv eft protection per iec 61000-4-4 (5/50 ns) eft 50 a peak pulse current per iec 61000-4-5 (8/20 ?) i pp 5a general information the bourns model cddfn2-t3.3b low capacitance device provides esd, eft and surge protection for external ports of electronic devices such as cellular phones, handheld electronics and other portable electronic devices. the device measures 1.0 mm x 0.60 mm x 0.55 mm and is available in a dfn-2 package intended to be mounted directly onto an fr4 printed circuit board. the device will t a 0402 footprint. the device is designed to meet iec 61000-4-2 (esd), iec 61000-4-4 (eft) and iec61000-4-5 (surge) protection requirements. electrical characteristics (@ t a = 25 ? unless otherwise noted) parameter symbol min. typ. max. unit working peak voltage v wm -3.3 3.3 v breakdown voltage @ 1 ma v br 4 6.5 v leakage current @ 3.3 v i l 0.1 1.0 a capacitance @ 0 v, 1 mhz c j 13.5 16.5 pf clamping voltage @ i pp = 5 a, 8/20 sv c 6.5 8 v *rohs compliant asia-paci c: tel: +886-2 2562-4117 ?fax: +886-2 2562-4116 emea: tel: +36 88 520 390 ?fax: +36 88 520 211 the americas: tel: +1-951 781-5500 ?fax: +1-951 781-5700 www.bourns.com
speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. cddfn2-t3.3b - surface mount tvs diode product dimensions block diagram this is a molded dfn-2 package with lead free 100 % sn plating on the terminations. it weighs approximately 30 mg. recommended pcb footprint how to order cd dfn2 - t 3.3 b common diode chip diode package dfn2 = dfn-2 package model transient voltage suppressor working peak reverse voltage 3.3 = 3.3 v rwm (volts) su? x b = bidirectional diode typical part marking cddfn2-t3.3b .............................................................................. y dimensions: mm (inches) a top view side view bottom view b f c e 0.125 (0.005) d 0.05 (0.002) 45 0.30 (0.012) 0.60 (0.024) 0.55 (0.022) symbol dimensions min. nom. max. a 0.95 (0.037) 1.00 (0.039) 1.05 (0.041) b 0.55 (0.022) 0.60 (0.024) 0.65 (0.026) c 0.41 (0.016) 0.45 (0.018) 0.50 (0.020) d 0.65 (0.026) e 0.20 (0.008) 0.25 (0.010) 0.30 (0.012) f 0.45 (0.018) 0.50 (0.020) 0.55 (0.022)
speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device perfor mance may vary over time. users should verify actual device performance in their speci c applications. cddfn2-t3.3b - surface mount tvs diode performance graphs pulse waveform tlp i-v plot typical capacitance variation of c in vs v in 20 40 60 80 100 120 0 030 25 20 15 10 5 i pp ? peak pulse current (% of i pp ) t ? time (s) test waveform parameters t r = 8 s t d = 20 s t t t d = t | i pp /2 16 2 4 6 8 10 12 14 0 -4 input capacitance (pf) input voltage (v) -3 -2 -1 0 1 2 3 4 pin 1 to pin 2 f = 1 mhz, t = 25 c 18 -4 -16 -14 -12 -10 -8 -6 -2 0 2 4 6 8 10 12 16 14 -18 -7 -8 device current (a) device voltage (v) -6 -5 -4 -3 -2 -1 -0 1 2 3 4 5 6 78 tlp i dut v dut dut + - 100 ns pin 1 to pin 2
speci cations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. users should verify actual device performance in their speci c applications. cddfn2-t3.3b - surface mount tvs diode packaging information ....... ....... ....... ....... ....... ....... ....... ....... p a f e t 120 d 2 d d 1 w 1 c index hole p 0 p 1 d 1 w b 10 pitches (min.) direction of feed 10 pitches (min.) end trailer device leader start d the surface mount product is packaged in an 8 mm x 4 mm tape and reel format per eia-481 standard. dimensions: mm (inches) item symbol dfn-2 carrier width a 0.70 0.05 (0.028 0.002) carrier length b 1.15 0.05 (0.045 0.002) carrier depth c 0.47 0.05 (0.019 0.002) sprocket hole d 1.55 0.05 (0.061 0.002) reel outside diameter d 179.0 1.00 (7.05 0.04) punch hole d 1 0.4 0.05 0.016 0.002 reel inner diameter d 1 60.0 0.50 2.362 0.02 feed hole diameter d 2 13.0 0.20 (0.512 0.008) sprocket hole position e 1.75 0.10 (0.069 0.004) punch hole position f 3.50 0.05 (0.138 0.002) punch hole pitch p 2.00 0.05 (0.079 0.002) sprocket hole pitch p 0 4.00 0.10 (0.157 0.004) embossment center p 1 2.00 0.05 (0.079 0.002) overall tape thickness t 0.20 0.05 (0.008 0.002) tape width w 8.00 0.10 (0.315 0.004) reel width w 1 14.4 (0.567) max. quantity per reel -- 12,000 rev. 10/31/13
|