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1. general description the 74lv541 is a low-voltage si-gate cmos device that is pin and function compatible with 74hc541 and 74hct541. the 74lv541 has octal non-inverting buffer/line drivers with 3-state outputs. the 3-state outputs are controlled by the output enable inputs oe1 and oe2. a high on oen causes the outputs to assume a high-impedance off-state. 2. features n optimized for low voltage applications: 1.0 v to 3.6 v n accepts ttl input levels between v cc = 2.7 v and v cc = 3.6 v n typical output ground bounce < 0.8 v at v cc = 3.3 v and t amb = 25 c n typical high-level output voltage (v oh ) undershoot: > 2 v at v cc = 3.3 v and t amb =25 c n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n non-inverting outputs n multiple package options n speci?ed from - 40 cto+85 c and from - 40 c to +125 c 3. ordering information 74lv541 octal buffer/line driver; 3-state rev. 03 14 april 2009 product data sheet table 1. ordering information type number package temperature range name description version 74lv541n - 40 c to +125 c dip20 plastic dual in-line package; 20 leads (300 mil) sot146-1 74lv541d - 40 c to +125 c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74lv541db - 40 c to +125 c ssop20 plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 74lv541pw - 40 c to +125 c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 2 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 4. functional diagram 5. pinning information 5.1 pinning fig 1. logic symbol fig 2. iec logic symbol 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 1 19 a0 a1 a2 a3 a4 a5 a6 a7 y0 y1 y2 y3 y4 y5 y6 y7 oe1 oe2 mna900 mna180 9 11 12 13 14 15 16 2 3 4 5 6 7 8 18 17 19 1 & en fig 3. pin con?guration dip20, so20 fig 4. pin con?guration, (t)ssop20 74lv541 oe1 v cc a0 oe2 a1 y0 a2 y1 a3 y2 a4 y3 a5 y4 a6 y5 a7 y6 gnd y7 001aaj964 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 74lv541 oe1 v cc a0 oe2 a1 y0 a2 y1 a3 y2 a4 y3 a5 y4 a6 y5 a7 y6 gnd y7 001aaj965 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 3 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 5.2 pin description 6. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for dip20 packages: above 70 c the value of p tot derates linearly with 12 mw/k. for so20 packages: above 70 c the value of p tot derates linearly with 8 mw/k. for (t)ssop20 packages: above 60 c the value of p tot derates linearly with 5.5 mw/k. table 2. pin description symbol pin description oe1 1 output enable input (active low) a0 to a7 2, 3, 4, 5, 6, 7, 8, 9 data input gnd 10 ground (0 v) y0 to y7 18, 17, 16, 15, 14, 13, 12, 11 data output oe2 19 output enable input (active low) v cc 20 supply voltage table 3. functional table [1] control input output oe1 oe2 an yn ll l l ll h h xh x z hx x z table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +4.6 v i ik input clamping current v i < - 0.5 v or v i >v cc + 0.5 v [1] -20ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v [1] -50ma i o output current v o = - 0.5 v to (v cc + 0.5 v) - 35 ma i cc supply current - 70 ma i gnd ground current - 70 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [2] dip20 - 750 mw so20, ssop20, tssop20 - 500 mw
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 4 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 8. recommended operating conditions [1] the static characteristics are guaranteed from v cc = 1.2 v to v cc = 3.6 v, but lv devices are guaranteed to function down to v cc = 1.0 v (with input levels gnd or v cc ). 9. static characteristics table 5. recommended operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit v cc supply voltage [1] 1.0 3.3 3.6 v v i input voltage 0 - v cc v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 1.0 v to 2.0 v - - 500 ns/v v cc = 2.0 v to 2.7 v - - 200 ns/v v cc = 2.7 v to 3.6 v - - 100 ns/v table 6. static characteristics at recommended operating conditions. voltages are referenced to gnd (ground = 0 v). symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max v ih high-level input voltage v cc = 1.2 v 0.9 - - 0.9 - v v cc = 2.0 v 1.4 - - 1.4 - v v cc = 2.7 v to 3.6 v 2.0 - - 2.0 - v v il low-level input voltage v cc = 1.2 v - - 0.3 - 0.3 v v cc = 2.0 v - - 0.6 - 0.6 v v cc = 2.7 v to 3.6 v - - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il i o = - 100 m a; v cc = 1.2 v - 1.2 - - - v i o = - 100 m a; v cc = 2.0 v 1.8 2.0 - 1.8 - v i o = - 100 m a; v cc = 2.7 v 2.5 2.7 - 2.5 - v i o = - 100 m a; v cc = 3.0 v 2.8 3.0 - 2.8 - v i o = - 8 ma; v cc = 3.0 v 2.4 2.82 - 2.2 - v v ol low-level output voltage v i = v ih or v il i o = 100 m a; v cc = 1.2 v - 0 - - - v i o = 100 m a; v cc = 2.0 v - 0 0.2 - 0.2 v i o = 100 m a; v cc = 2.7 v - 0 0.2 - 0.2 v i o = 100 m a; v cc = 3.0 v - 0 0.2 - 0.2 v i o = 8 ma; v cc = 3.0 v - 0.2 0.40 - 0.50 v i i input leakage current v i =v cc or gnd; v cc = 3.6 v - - 1.0 - 1.0 m a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd; v cc = 3.6 v --5 - 10 m a
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 5 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state [1] typical values are measured at t amb = 25 c. 10. dynamic characteristics i cc supply current v i = v cc or gnd; i o = 0 a; v cc = 3.6 v - - 20 - 160 m a d i cc additional supply current per input; v i = v cc - 0.6 v; v cc = 2.7 v to 3.6 v - - 500 - 850 m a c i input capacitance - 3.5 - - - pf table 6. static characteristics continued at recommended operating conditions. voltages are referenced to gnd (ground = 0 v). symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max table 7. dynamic characteristics voltages are referenced to gnd (groun d = 0 v). for test circuit see figure 7 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max t pd propagation delay an to yn; see figure 5 [2] v cc = 1.2 v - 60 - - - ns v cc = 2.0 v - 20 39 - 46 ns v cc = 2.7 v - 15 29 - 34 ns v cc = 3.0 v to 3.6 v; c l =15pf [3] -10- - -ns v cc = 3.0 v to 3.6 v [3] - 11 23 - 27 ns t en enable time oen to yn; see figure 6 [2] v cc = 1.2 v - 100 - - - ns v cc = 2.0 v - 34 65 - 77 ns v cc = 2.7 v - 25 48 - 56 ns v cc = 3.0 v to 3.6 v [3] - 19 38 - 45 ns t dis disable time oen to yn; see figure 6 [2] v cc = 1.2 v - 100 - - - ns v cc = 2.0 v - 36 66 - 78 ns v cc = 2.7 v - 27 48 - 58 ns v cc = 3.0 v to 3.6 v [3] - 21 39 - 47 ns
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 6 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state [1] all typical values are measured at t amb =25 c. [2] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . [3] typical values are measured at nominal supply voltage (v cc = 3.3 v). [4] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz, f o = output frequency in mhz c l = output load capacitance in pf v cc = supply voltage in volts n = number of inputs switching s (c l v cc 2 f o ) = sum of the outputs. 11. waveforms c pd power dissipation capacitance c l = 50 pf; f i = 1 mhz; v i = gnd to v cc [4] -37- - -pf table 7. dynamic characteristics continued voltages are referenced to gnd (groun d = 0 v). for test circuit see figure 7 . symbol parameter conditions - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 5. propagation delay input (an) to output (yn) mna901 an input yn output t phl t plh gnd v i v m v m v oh v ol
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 7 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. enable and disable times mna902 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high oen input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m table 8. measurement points supply voltage input output v cc v m v m v x v y < 2.7 v 0.5v cc 0.5v cc v ol + 0.1v cc v oh - 0.1v cc 2.7 v to 3.6 v 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 8 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state test data is given in t ab le 9 . de?nitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 7. test circuit for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aae331 v ext v cc v i v o dut c l r t r l r l g table 9. test data supply voltage input load v ext v cc v i t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz < 2.7 v v cc 2.5 ns 50 pf 1 k w open gnd 2v cc 2.7 v to 3.6 v 2.7 v 2.5 ns 15 pf, 50 pf 1 k w open gnd 2v cc
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 9 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 12. package outline fig 8. package outline sot146-1 (dip20) unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec jeita mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot146-1 99-12-27 03-02-13 a min. a max. b z max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2 4.2 0.51 3.2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.078 0.17 0.02 0.13 sc-603 ms-001 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 20 1 11 10 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. (1) (1) (1) dip20: plastic dual in-line package; 20 leads (300 mil) sot146-1
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 10 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state fig 9. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 11 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state fig 10. package outline sot339-1 (ssop20) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p q (1) z y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 0.9 0.7 0.9 0.5 8 0 o o 0.13 1.25 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 sot339-1 mo-150 99-12-27 03-02-19 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 110 20 11 y 0.25 pin 1 index 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 a max. 2
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 12 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state fig 11. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 110 20 11 pin 1 index q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 13 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 13. abbreviations 14. revision history table 10. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74lv541_3 20090414 product data sheet - 74lv541_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name when appropriate. 74lv541_2 19980610 product speci?cation - 74lv541_1 74lv541_1 19970304 product speci?cation - -
74lv541_3 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 03 14 april 2009 14 of 15 nxp semiconductors 74lv541 octal buffer/line driver; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74lv541 octal buffer/line driver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 14 april 2009 document identifier: 74lv541_3 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16 contact information. . . . . . . . . . . . . . . . . . . . . 14 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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