APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 1-6 absolute maximum ratings these devices are sensitive to elec trostatic discharge. proper handi ng procedures should be followed. see application note apt0502 on www.microsemi.com g s d k isotop ? symbol parameter max ratings unit v dss drain - source breakdown voltage 500 v t c = 25c 58 i d continuous drain current t c = 80c 43 i dm pulsed drain current 270 a v gs gate - source voltage 30 v r dson drain - source on resistance 65 m ? p d maximum power dissipation t c = 25c 543 w i ar avalanche current (repetitive and non repetitive) 42 a application ? ac and dc motor control ? switched mode power supplies ? power factor correction ? brake switch features ? power mos 8? mosfet - low r dson - low input and miller capacitance - low gate charge - avalanche energy rated ? sic schottky diode - zero reverse recovery - zero forward recovery - temperature independent switching behavior - positive temperature coefficient on vf ? isotop ? package (sot-227) ? very low stray inductance ? high level of integration benefits ? outstanding performance at high frequency operation ? stable temperature behavior ? very rugged ? direct mounting to heatsink (isolated package) ? low junction to case thermal resistance ? easy paralleling due to positive tc of vcesat ? rohs compliant isotop ? boost chopper mosfet + sic chopper diode p ower module k d g s v dss = 500v r dson = 65m ? max @ tj = 25c i d = 58a @ tc = 25c downloaded from: http:///
APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 2-6 all ratings @ t j = 25c unless otherwise specified electrical characteristics symbol characteristic test conditions min typ max unit t j = 25c 250 i dss zero gate voltage drain current v ds = 500v v gs = 0v t j = 125c 1000 a r ds(on) drain C source on resistance v gs = 10v, i d = 42a 65 m ? v gs(th) gate threshold voltage v gs = v ds , i d = 2.5ma 3 4 5 v i gss gate C source leakage current v gs = 30 v 100 na dynamic characteristics symbol characteristic test conditions min typ max unit c iss input capacitance 10800 c oss output capacitance 1164 c rss reverse transfer capacitance v gs = 0v v ds = 25v f = 1mhz 148 pf q g total gate charge 340 q gs gate C source charge 75 q gd gate C drain charge v gs = 10v v bus = 250v i d = 42a 155 nc t d(on) turn-on delay time 60 t r rise time 70 t d(off) turn-off delay time 155 t f fall time resistive switching @ 25c v gs = 15v v bus = 333v i d = 42a r g = 2.2 ? 50 ns sic chopper diode ratings and characteristics symbol characteristic test conditions min typ max unit v rrm maximum peak repetitive reverse voltage 600 v t j = 25c 100 400 i rm maximum reverse leakage current v r =600v t j = 175c 200 2000 a i f dc forward current tc = 100c 20 a t j = 25c 1.6 1.8 v f diode forward voltage i f = 20a t j = 175c 2 2.4 v q c total capacitive charge i f = 20a, v r = 300v di/dt =800a/s 28 nc f = 1mhz, v r = 200v 130 c total capacitance f = 1mhz, v r = 400v 100 pf thermal and package characteristics symbol characteristic min typ max unit mosfet 0.23 r thjc junction to case thermal resistance sic diode 1.35 r thja junction to ambient (igbt & diode) 20 c/w v isol rms isolation voltage, any terminal to case t =1 min, 50/60hz 2500 v t j ,t stg storage temperature range -40 150 t l max lead temp for soldering:0.063 from case for 10 sec 300 c torque mounting torque (mounting = 8-32 or 4mm machine and terminals = 4mm machine) 1.5 n.m wt package weight 29.2 g downloaded from: http:///
APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 3-6 sot-227 (isotop ? ) package outline 31.5 (1.240)31.7 (1.248) dimensions in millimeters and (inches) 7.8 (.307)8.2 (.322) 30.1 (1.185)30.3 (1.193) 38.0 (1.496)38.2 (1.504) 14.9 (.587)15.1 (.594) 11.8 (.463)12.2 (.480) 8.9 (.350)9.6 (.378) hex nut m4 (4 places) 0.75 (.030)0.85 (.033) 12.6 (.496)12.8 (.504) 25.2 (0.992)25.4 (1.000) 1.95 (.077)2.14 (.084) * r = 4.0 (.157) (2 places) 4.0 (.157)4.2 (.165) (2 places) w=4.1 (.161)w=4.3 (.169) h=4.8 (.187)h=4.9 (.193) (4 places) 3.3 (.129)3.6 (.143) emitter terminals are shortedinternally. current handling capability is equal for either emitter terminal. typical mosfet performance curve 0.9 0.7 0.5 0.3 0.1 0.05 single p ulse 0 0.05 0.1 0.15 0.2 0.25 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration (seconds) thermal impedance (c/w) maximum effective transient thermal impedance, junction to case vs p ulse duration source gate drain cathode downloaded from: http:///
APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 4-6 low voltage output characteristics t j =25c t j =125c 0 50 100 150 200 250 0 5 10 15 20 v ds , drain to source voltage (v) i d , drain current (a) v gs =10v low voltage output characteristics 5.5v 6v 6.5v 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25 30 v ds , drain to source voltage (v) i d , drain current (a) v gs =7,8 &10v t j =125c normalized r dson vs. temperature 0.5 1 1.5 2 2.5 25 50 75 100 125 150 t j , junction temperature (c) v gs =10v i d =42a r dson , drain to source on resistance ciss crss coss 10 100 1000 10000 100000 0 50 100 150 200 v ds , drain to source voltage (v) c, capacitance (pf) capacitance vs drain to source voltage transfert characteristics t j =25c t j =125c 0 25 50 75 100 125 01234567 v gs , gate to source voltage (v) i d , drain current (a) v ds > i d (on)xr ds (on)max 250s pulse test @ < 0.5 duty cycle gate charge vs gate to source v ds =100v v ds =250v v ds =400v 0 2 4 6 8 10 12 0 60 120 180 240 300 360 gate charge (nc) v gs , gate to source voltage i d =42a t j =25c downloaded from: http:///
APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 5-6 typical sic diode performance curve maximum effective transient thermal impedance, junction to case vs pulse duration 0.9 0.7 0.5 0.3 0.1 0.05 single pulse 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular pulse duration (seconds) thermal impedance (c/w) forward characteristics t j =25c t j =75c t j =125c t j =175c 0 10 20 30 40 00.511.522.533.5 v f forward voltage (v) i f forward current (a) reverse characteristics t j =25c t j =75c t j =125c t j =175c 0 50 100 150 200 250 300 350 400 200 300 400 500 600 700 800 v r reverse voltage (v) i r reverse current (a) capacitance vs.reverse voltage 0 200 400 600 800 1 10 100 1000 v r reverse voltage c, capacitance (pf) isotop? is a registered trademark of st microelectronics nv downloaded from: http:///
APT58M50JCU2 APT58M50JCU2 C rev 1 october, 2012 www.microsemi.com 6-6 disclaimer the information contained in the document (unless it is publicly available on the web without access restrictions) is proprietary and confidential information of microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of microsemi. if the recipient of this document has entered into a disclosure agreement with microsemi, then the term s of such agreement will also apply. this document and the information contained herein may not be modified, by any person other than authorized personnel of microsemi. no license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication , inducement, estoppels or otherwise. any license under such intellectual property rights must be approved by microsemi in writing signed by an officer of microsemi. microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. this product has been subject to limited testing and should not be used in conjunction with li fe- support or other mission-critical equipment or applications. microsemi assumes no liability whatsoever, and microsemi disclaims any express or implied warranty, relating to sale and/or use of microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or custom ers final application. user or customer shall not rely on any data and performance specifications or parameters provided by microsemi. it is the customers and users responsibility to independently determine suitability of any microsemi product and to test and verify the same. the information contained herein is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the user. microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. the product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp life support application seller's products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the seller's product could create a situation where personal injury, death or property damage or loss may occur (collectively "life support applications"). buyer agrees not to use products in any life support applications and to the extent it does it shall conduct extensive testing of the product in such applications and further agrees to indemnify and hold seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, dam ages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damag e or otherwise associated with the use of the goods in life support applications, even if such claim includes allegations that seller was negligent regarding the design or manufacture of the goods. buyer must notify seller in writing before using sellers products in life support applications. seller will study with buyer alternative solutions to meet buyer application specification based on sellers sales conditions applicable for the new proposed specific part. downloaded from: http:///
|
