wide band gaas mmic amplifier 0.2 - 3.0 ghz rev. v4 maam02350 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? high gain: 19 db typical ? output power: +14 dbm typical ? noise figure: 3.7 db typical ? rohs* compliant description m/a - coms maam02350 is a wide band, mmic amplifier. it includes two integrated gain stages and employs resistive feedback to obtain flat gain and a g o o d , 5 0 o h m i n p u t , a n d o u t p u t impedance match over a very wide bandwidth. the maam02350 operates from a single +6 v supply. it is fully monolithic. the maam02350 functions well as a generic if, driver or buffer amplifier where high gain, low noise figure, excellent linearity and low power consumption are important. because of its wide bandwidth, the maam02350 can be used in numerous commercial and government system applications, such as wireless communications, ew and radar. the maam02350 is manufactured in - house using a reliable, 0.5 - micron, gaas mesfet process. this product is 100% rf tested to ensure compliance to performance specifications. * restrictions on hazardous substances, european union directive 2002/95/ec. pad layout absolute maximum ratings 1,2 1. exceeding any one or combination of these limits may cause permanent damage to this device. 2. m/a - com does not recommend sustained operation near these survivability limits. 3. typical thermal resistance ( ? jc) = +80c/w. parameter absolute maximum v dd +7 v input power +20 dbm channel temperature 3 +150c operating temperature - 55c to +100c storage temperature - 65c to +150c ordering information 4,5 part number package maam02350 die 4. reference application note m538 for lead - free solder reflow recommendations. 5. die quantity varies. die size inches (mm) 0.044 x 0.032 x 0.004 (1.140 x 0.820 x 0.102) outline drawing
wide band gaas mmic amplifier 0.2 - 3.0 ghz rev. v4 maam02350 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 electrical specifications: t a = 25c, v dd = +6 v, z 0 = 50 parameter test conditions units min. typ. max. gain 0.2 - 3.0 ghz, p in = - 30 dbm db 17 19 gain flatness 0.2 - 3.0 ghz, p in = - 30 dbm db 0.5 noise figure 0.2 - 3.0 ghz db 3.7 4.1 input vswr 0.2 - 3.0 ghz, p in = - 30 dbm ratio 1.8:1 output vswr 0.2 - 3.0 ghz, p in = - 30 dbm ratio 1.5:1 output 1 db compression 0.2 - 3.0 ghz dbm +14 oip3 0.2 - 3.0 ghz, p in = - 30 dbm dbm 24 reverse isolation 0.2 - 3.0 ghz, p in = - 30 dbm db 35 bias current ma 65 100 handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. schematic typical bias configuration 6. self - bias operation is obtained by connecting +6 volts to both v dd and v dd pads, grounding pad s1, and connecting pads gnd1 and gnd2 to separate bypass 500 pf mos capacitors. v g 1 s 1 v g 2 v d d ' v d d r f o u t g n d 2 g n d 1 r f i n v g 1 , v g 2 v d d , v d d 5 0 0 p f r f o u t 1 0 0 p f 5 0 0 p f 5 0 0 p f 1 0 0 p f r f i n s 1
wide band gaas mmic amplifier 0.2 - 3.0 ghz rev. v4 maam02350 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical performance @ +25c gain vswr noise figure 5 10 15 20 25 0 1 2 3 4 5 frequency (ghz) 1 2 3 4 5 0 1 2 3 4 5 frequency (ghz) 1.0 1.5 2.0 2.5 3.0 3.5 0 1 2 3 4 5 input vswr output vswr frequency (ghz)
wide band gaas mmic amplifier 0.2 - 3.0 ghz rev. v4 maam02350 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 handling permanent damage to the maam02350 may occur if the following precautions are not adhered to: a. cleanliness - the maam02350 should be handled in a clean environment. do not attempt to clean assembly after the maam02350 is installed. b. static sensitivity - all die handling equipment and personnel should comply with dod - std - 1686 class 1. c. transients - avoid instrument and power supply transients while bias is connected to the maam02350. use shielded signal and bias cables to minimize inductive pick - up. d. general handling - do not touch the surface of the die. it is recommended that the maam02350 die be handled along the long side with a sharp pair of tweezers. mounting the maam02350 is back - metallized with pd/ni/au (100/1,000/30,000?) metallization. it can be die - mounted using au/sn eutectic performs or a thermally and electrically conductive epoxy. the attachment surface should be clean and flat. eutectic die attach: a. an 80/20 au/sn perform is recommended with a work surface temperature of approximately 225c and a tool temperature of 265c. when hot 95/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290c. b. do not expose the maam02350 to a temperature greater than 320c for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach: a. apply a minimum amount of epoxy and place the maam02350 into position. a thin epoxy fillet should be visible around the perimeter of the die. b. cure epoxy per manufacturers recommended schedule. bonding a. ball or wedge bond with 1.0 mil diameter gold wire or 3.0 mil x 0.5 mil ribbon. thermosonic bonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. b. bonds should be started on the die and terminated on the package. rf bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended. c. bonding pads are 4.0 x 4.0 mils.
wide band gaas mmic amplifier 0.2 - 3.0 ghz rev. v4 maam02350 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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