? semiconductor components industries, llc, 2017 january, 2017 ? rev. 18 1 publication order number: njd2873t4/d njd2873 power transistors npn silicon dpak for surface mount applications designed for high?gain audio amplifier applications. features ? high dc current gain ? low collector?emitter saturation voltage ? high current?gain ? bandwidth product ? epoxy meets ul 94 v?0 @ 0.125 in ? njv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant maximum ratings rating symbol value unit collector?base voltage v cb 50 vdc collector?emitter voltage v ceo 50 vdc emitter?base voltage v eb 5 vdc collector current ? continuous i c 2 adc collector current ? peak i cm 3 adc base current i b 0.4 adc total device dissipation @ t c = 25 c derate above 25 c p d 15 0.1 w w/ c total device dissipation @ t a = 25 c* derate above 25 c p d 1.68 0.011 w w/ c operating and storage junction temperature range t j , t stg ?65 to +175 c esd ? human body model hbm 3b v esd ? machine model mm c v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. device package shipping ? ordering information silicon power transistors 2 amperes 50 volts 15 watts ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. marking diagram a = assembly location y = year ww = work week g = pb?free device dpak case 369c style 1 ayww j 2873g www. onsemi.com njd2873t4g dpak (pb?free) 2,500 units / ree l NJVNJD2873T4G dpak (pb?free) 2,500 units / ree l 1 1 base 3 emitter collector 2,4 2 3 4
njd2873 www. onsemi.com 2 thermal characteristics characteristic symbol max unit thermal resistance junction?to?case junction?to?ambient (note 1) r jc r ja 10 89.3 c/w 1. these ratings are applicable when surface mounted on the minimum pad sizes recommended. electrical characteristics (t c = 25 c unless otherwise noted) characteristic symbol min max unit off characteristics collector?emitter sustaining voltage (note 2) (i c = 10 madc, i b = 0) v ceo(sus) 50 ? vdc collector cutoff current (v cb = 50 vdc, i e = 0) i cbo ? 100 nadc emitter cutoff current (v be = 5 vdc, i c = 0) i ebo ? 100 nadc on characteristics dc current gain (note 2) (i c = 0.5 a, v ce = 2 v) (i c = 2 adc, v ce = 2 vdc) (i c = 0.75 adc, v ce = 1.6 vdc, ?40 c t j 150 c) h fe 120 40 80 360 ? 360 ? collector?emitter saturation voltage (note 2) (i c = 1 a, i b = 0.05 a) v ce(sat) ? 0.3 vdc base?emitter saturation voltage (note 2) (i c = 1 a, i b = 0.05 adc) v be(sat) ? 1.2 vdc base?emitter on voltage (note 2) (i c = 1 adc, v ce = 2 vdc) (i c = 0.75 adc, v ce = 1.6 vdc, ?40 c t j 150 c) v be(on) ? ? 1.2 0.95 vdc dynamic characteristics current?gain ? bandwidth product (note 3) (i c = 100 madc, v ce = 10 vdc, f test = 10 mhz) f t 65 ? mhz output capacitance (v cb = 10 vdc, i e = 0, f = 0.1 mhz) c ob ? 80 pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. pulse test: pulse width = 300 s, duty cycle 2%. 3. f t = ? h fe ?? f test .
njd2873 www. onsemi.com 3 typical characteristics ?40 c 0.4 0.01 0.1 1 1 0 i c , collector current (amps) v ce(sat) , collector?emitter saturation voltage (v) ic/ib = 20 ?40 c 1.2 0.01 0.1 1 10 i c , collector current (amps) v be(sat) , base?emitter saturation voltage (v) 100 c 25 c ic/ib = 20 1.0 0.8 0.6 0.4 0.2 ?40 c 100 1000 0.01 0.1 1 10 i c , collector current (amps) h fe , dc current gain 100 c v ce = 2.0 v 10 25 25 figure 1. power derating t, temperature ( c) 0 50 75 100 125 150 15 10 5 20 p d , power dissipation (watts) figure 2. dc current gain figure 3. collector?emitter saturation voltage figure 4. base?emitter saturation voltage figure 5. base?emitter voltage 25 c 150 c 175 c 25 c 100 c 150 c 175 c 175 c 150 c ?40 c i c , collector current (amps) v be(on) , base?emitter voltage (v) 100 c 25 c v ce = 2.0 v 175 c 150 c 0.3 0.2 0.1 0 1.1 0.9 0.7 0.5 0.3 1.2 1.0 0.8 0.6 0.4 0.2 1.1 0.9 0.7 0.5 0.3 0.01 0.1 1 1 0 175 200 0
njd2873 www. onsemi.com 4 figure 6. saturation region i b , base current (ma) v ce(sat) , collector?emitter saturation voltage (v) 1.0 0.01 0.1 1 10 0.8 0.6 0.4 0.2 0 100 1000 t a = 25 c 10 ma 100 ma 500 ma 1 a i c = 2 a 0.1 1 10 100 1000 100 10 1 figure 7. capacitance v r , reverse voltage (v) c, capacitance (pf) c ibo c obo t a = 25 c figure 8. saturation region i c , collector current (ma) f tau , current gain bandwidth product (mhz) 100 1 10 100 1000 100 0 10000 v ce = 10 v t a = 25 c 1 10 100 1000 100 10 1 figure 9. capacitance v ce , collector emitter voltage (v) i c , collector current 10000 1 ms 10 ms 100 ms 1 s t, time (ms) 0.01 0.02 0.05 1 2 5 10 20 50 100 200 0.1 0.5 0.2 1 0.2 0.1 0.05 r(t), transient thermal r jc (t) = r(t) jc r jc = 10 c/w max d curves apply for power pulse train shown read time at t 1 t j(pk) - t c = p (pk) jc (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 0.2 0 (single pulse) resistance (normalized) figure 10. thermal response 0.5 d = 0.5 0.05 0.3 0.7 0.07 0.03 0.02 0.1 0.02 0.01
njd2873 www. onsemi.com 5 package dimensions dpak (single gauge) case 369c issue f style 1: pin 1. base 2. collector 3. emitter 4. collector b d e b3 l3 l4 b2 m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 7. optional mold feature. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.114 ref 2.90 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw e bottom view z bottom view side view top view alternate constructions note 7 z on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 njd2873t4/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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