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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 14 ? 001 4.5v to 25v input 1ch synchronous buck dc/dc controller bd95601muv- lb general description this is the product guarantees long time support in industrial market. bd95601muv-lb is a high current buck regulator that produces low output voltage (0.75v to 2.0v) from a wide input voltage range (4.5v to 25v).high efficiency is realized using external n channel mosfets. using h 3 reg tm , rohms advanced proprietary control method that uses constant on-time control to provide ultra-high transient responses to load changes. sllm (simple light load mode) technology is added to improve efficiency with light loads giving high efficie ncy over a wide load range. soft start functionality, short circuit protection with timer latch, over current protection and tracking are all included features. this switching regulator was designed for low voltage high current power supplies. features ? long time support product for industrial applications. ? adjustable light load and selectable continuous modes. ? multifunctional protection circuits. -thermal shut down (tsd). -under voltage lock out (uvlo). -over current protection (ocp). -over voltage protection (ovp). -short circuit protection (scp). ? adjustable soft start. ? power good output. ? 200khz to 500khz switching frequency. key specifications ? vin input voltage range 4.5 v to 25 v ? vcc input voltage range 4.5 v to 5.5v ? vdd input voltage range 4.5 v to 5.5v ? output voltage range 0.75 v to 2.0v ? standby current 0 a ( typ) ? operating temperature range - 10 c to +85c package w(typ) x d(typ) x h(max) vqfn020v4040 4. 00mm x 4.00mm x 1.00mm applications ? fpga, pol application. ? mobile pc, desktop pc, lcd-tv, digital components etc. ? industrial equipment. typical application circuit figure 1. application circuit 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ss en/sllm ilim vcc fb hg sw vdd lg pgnd vout freq fs is- is+ gnd pgood out vin boot c10 c11 c12 r13 c8 l1 1v +12v reg1_5v c1 r1 r2 c2 r3 r4 r10 r5 c7 r12 r11 c3 r6 c5 r7 r8 c6 q1 q2 bd95371muv gnd pgnd c13 c4 u1 c14 jp1 r20 r18 en_1 pg_1 1vmgt 1.2v 1.35/1.5v 1.8v 2v en_1mgt en_1.2 en_1.35/1.5 en_1.8 en_2 pg_2 bd95601muv- lb vqfn020v4040 datashee t downloaded from: http:///
2/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb pin configuration figure 2 . pin configuration pin description pin no. pin name function 1 ss soft start time input. the rise time is set by a capacitor conne cted between ss and ground. at startup, a fixed current flows into the ss capacitor. outpu t voltage is co ntrolled until the ss input reaches the reference voltage of 0.75v. 2 en/sllm enable and mode selection input. voltage on this input selects the operating mode. standby mode: < 0.8v continuous mode: 2.3v C 3.8v light load mode: 4.2v C 5.5v 3 ilim coil current limit input. a 100k resistor should be connected between this input and groun d. 4 vcc ic internal circuits power input. 5 fb output voltage sense input. a resistor divider to this input se ts the output voltage. 6 vout output voltage monitor input. 7 freq current sense amplifier output. 8 fs frequency input. a resistor sets the switching frequency. the freq uency can be set from 200khz to 500khz. 9 is - input current sense amplifier input. freq pin is output. 10 is+ output current sense amplifier input. if the voltage between this pin and vout pin reaches the specified voltage level (setting at ilim pin), the switc hing is turned off. 11 pgnd ground pin for l ow -side fet driver. 12 lg this is the pin to drive the gate of the l ow -side fet. this voltage swings between vdd and pgnd. high-speed gate driving for the l ow -side fet is achieved using an output mos (3? when lg is high, 0.5? when lg is low.). 13 vdd this is the power supply pin to drive the l ow -side fet. it is recommended that 10f bypass capacitor be used to compensate for peak current during the fet on/off transition. 14 sw this is the ground pin for high-side fet. the maximum absolute rating is 30v from ground. 15 hg this is the pin to drive the gate of the high-side fet. the statu s of the switching swings between boot and sw. high-speed gate driving for high-side fet is achieved using an output mos ( 3? when hg is high, 2? when hg is low). 16 boot this is the power supply pin to drive the h igh -side fet. the maximum absolute ratings are 35v from ground and 7v from sw. the switching waveform sweeps from (vin+vdd) to vdd by boot operation. 17 vin this is the pin for h 3 reg tm control. it determines necessary on-time by monitoring input voltage. it is recommended to connect 1k? / 0.1f cr filter. 18 out this is the output pin of output voltage control amp. please conn ect a resistor and capacitor to ground in series. it is recommended that a 0.01f capacitor be established in normal o peration. 19 pgood power good output. this pin outputs a high-level when the fb pin volt age is above 63% of the reference voltage. th is is an open drain pin and therefore requires an external pull- up. 20 gnd ground pin of control circuit. it is the same as fin potential. fin fin backside thermal pad. please connect to the ground. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 ss en/sllm ilim vcc fb vout freq fs is - is + pgnd lg vdd sw hg boot vin out pgood gnd downloaded from: http:///
3/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb block diagram figure 3 . block diagram reference block thermal protection h 3 reg tm controller block sllm r s q driver circuit pgnd lg vdd sw hg boot ss v cc en/sllm fb tsd sllm ss soft start block uvlo 2.5ms delay ref 0.56 ss 0.56 bg scp 4 1 2 5 16 15 14 13 12 11 vin vout fb ref 0.63 19 pgood ref vin 17 fb + - ovp - + ref 1.2 fb + - ovp sllm en vdd vout bg en/uvlo vin fs out 18 ss ref ls - uvlo ilim scp tsd vdd ilim freq ls+ is+ vout current limit 6 is+ ilim gnd pgnd - + + gnd 20 - + - + 7 8 - + 10 3 9 + - downloaded from: http:///
4/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb absolute maximum ratings (ta = 25c) parameter symbol rating unit condition input voltage 1 v cc 7 v note 1, note 2 input voltage 2 v dd 7 v note 1, note 2 input voltage 3 v in 28 v note 1, note 2 boot voltage boot 35 v note 1, note 2 boot- sw voltage boot- sw 7 v note 1, note 2 hg - sw voltage hg - sw 7 v note 1, note 2 lg voltage lg v dd v output voltage v out /is+/is- v cc v en input voltage en 7 v note 1 power dissipation 1 p d1 0.34 w note 3 power dissipation 2 p d2 0.70 w note 4 power dissipation 3 p d3 2.20 w note 5 po wer dissipation 4 p d4 3.56 w note 6 operating temperature range t opr -10 to + 85 c storage temperature range tstg -55 to + 150 c maximum junction temperature tjmax + 150 c (note 1) not to exceed pd. (note 2) instantaneous surge voltage, back electromotive force and voltage under le ss than 10% duty cycle. (note 3) derating in done 2.7 mw/c for operating above ta 25 c (when dont mounted on a heat radi ation board). (note 4) derating in done 5.6 mw/c for operating above ta 25 c (mount on 1-layer 70.0mm x 70.0mm x 1.6mm board). surface heat dissipation copper foil:10.29mm 2 . (note 5) derating in done 17.6 mw/c for operating above ta 25 c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board two sides heat dissipation copperfoil:10.29mm 2 . 2 or 3-layer : heat dissipation copper foil : 5505mm 2 ). (note 6) derating in done 28.5 mw/c for operating above ta 25 c (mount on 4-layer 70.0mm x 70.0mm x 1.6mm board) all layers heat dissipation copper foil:5505mm 2 . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consi der circuit protection measures, such as adding a fuse, in case the ic is op erated over the absolute maximum ratings. recommended operating conditions (ta= 25 c ) parameter symbol min typ max unit condition input voltage 1 v cc 4.5 - 5.5 v input voltage 2 v dd 4.5 - 5.5 v input voltage 3 v in 4.5 - 25 v boot voltage boot 4.5 - 30 v sw voltage sw -0.7 - 25 v boot- sw voltage boot- sw 4.5 - 5.5 v en input voltage en 0 - 5.5 v is input voltage i s+ /i s- 0.7 - 2.7 v min on time t onmin - - 80 ns downloaded from: http:///
5/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb electrical characteristics (unless otherwise specified vcc=5v vdd=5v en=3v vin=12v vout=1.05v rfs=36k? ta=25c) parameter symbol min typ max unit conditions whole device vcc bias current i cc - 1500 1800 a vcc stand-by current i ccstb - 0 10 a en= 0v vin bias current i in - 30 80 a vin stand-by current i instb - 0 10 a en= 0v en low voltage en low gnd - 0.8 v en high voltage (forced continuous mode) en high _ con 2.3 - 3.8 v en high voltage (sllm mode) en high _ sllm 4.5 - 5.5 v en bias current i en - 15 25 a en= 3v under voltage locked out vcc threshold voltage v cc _ uvlo 3.7 4.0 4.2 v vcc:sweep up vcc hysteresis voltage dv cc _ uvlo 100 160 220 mv vcc:sweep down h 3 reg tm control on time t on 194 219 244 ns max on time t onmax - 3.5 - s min off time t offmin - 490 700 ns fet driver hg high-side on resistance hg hon - 3.0 6.0 ? hg low -s ide on resistance hg lon - 2.0 4.0 ? lg high-s ide on resistance lg hon - 3.0 6.0 ? lg low -s ide on resistance lg lon - 0.5 1.0 ? scp scp start-up voltage v scp 0.345 0.420 0.495 v scp delay time t scp - 2.5 - ms ovp fb threshold voltage v ovp 0.825 0.900 0.975 v soft start charge current i ss 1 2 3 a stand-by voltage v ss _ stb - - 50 mv current limit setting current i ilim - 10 - a current li mit threshold voltage v ilim 75 100 120 mv r ilim = 100k ? output voltage sense output reference voltage 1 r ef1 0.743 0.750 0.757 v is+ input voltage i s+ -1 0 1 a l s+ = 1.05v is - input voltage i s- -1 0 1 a l s- = 1.05v power good fb power g ood voltage v pgood 0.38 0.47 0.56 v discharge on resistance r onpgood - 50 150 ? diode for boot v f v ol tage v f 0.4 0.5 0.6 v i f = 1ma downloaded from: http:///
6/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb typical performance curves (reference data) 0 figure 4. efficiency (v in = 7.5v) figure 5. efficiency (v in = 12v) figure 6. efficiency (v in = 21v) figure 7. transient response waveform (v in = 5v) vout (20mv/div) S v=8.0mv iout (5.0a/div) 10s/div downloaded from: http:///
7/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb typical performance curves (reference data) - continued figure 8. transient response waveform (v in = 5v) figure 9. power-up with vcc figure 10. line regulation figure 1 1. line regulation vout (20mv/div) S v=7.6mv iout (5.0a/div) 10s/div vcc (5v/div) vout (500mv/div) sw (5v/div) 400s/div vin (5v/div) lg (5v/div) sw (5v/div) vout (200mv/div) 20s/div vin (5v/div) vout (200mv/div) sw (5v/div) lg (5v/div) 20s/div downloaded from: http:///
8/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb typical performance curves (reference data) - continued figure 12. power-up with en figure 1 3. ocp & scp figure 1 4. switching waveform (v in = 5v, i out = 18a) figure 15 . switching waveform (v in = 21v, i out = 18a) en (5v/div) vout (500mv/div) sw (5v/div) 400s/div sw (10 v/div) lg (5 v/div) scp delay time iout (5a/div) 400s/div sw (5v/div) hg (5v/div) lg (5v/div) 1s/div ) sw (5v/div) lg (5v/div) 1s/div ) hg (5v/div) downloaded from: http:///
9/ 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb description of blocks bd95601muv- lb is a single channel synchronous buck regulator using h 3 reg tm , rohms latest constant on -time controller technology. fast load response is achieved by controlling the output voltage using a comparator without relying on the switching frequency. when v out drops due to a rapid load change, the system quickly restores v out by extending the t on time interval. thus, it serves to improve the regulator s transient response. activating the light load mode further inc reases efficiency by using simple light load mode (sllm) control. h 3 reg tm control (normal operation) (v out drops due to a rapid load change) fb v out /v in circuit transient circuit driver hg sw lg v in v out fb ref hg lg hg output on -time is determined by the formula (1). when hg is off, lg is on until the output voltage becomes fb= ref. when fb falls to a reference voltage (ref), the drop is detected, activating the h 3 reg tm control system fb ref hg io lg t on + when v out drops due to a rapid load change, and the voltage remains below the output setting following the programmed t on time, the system quickly restores v out by extending the t on time, thus improving the transient response. once v out is restored, the controller continues normal operation. t on = v out v in x 1 f [sec] ??? (1) comparator for output voltage control internal reference voltage ref downloaded from: http:///
10 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb description of blocks - continued (light load control) in sllm (en/sllm = 4.5v to 5.5v), sllm function will operate when the lg pin is off and the coil current is lower than 0a (the current goes from v out to sw). when the fb input is lower than ref voltage again, hg will be enabled once again. fb ref hg lg 0a load c out *attention: to affect the rapid transient response, the h 3 reg tm control monitors the current from the output capacitor to the load using the esr of the output capacitor do not use ceramic capacitors on c out side of power supply. ceramic bypass capacitors can be used near the individual loads if desire d. downloaded from: http:///
11 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb timing chart soft-start function timer latch type short circuit protection over current voltage protection c ss (pf) soft start time(ms) 12000 5 27000 10 51000 20 en ss fb i in t ss soft start time inrush current the soft start function is exercised when the en/sllm input is set to high. current control takes effect at startup enabling a moderate output voltage ramping. soft start timing and incoming current are calculated with the following: formulas (2) and (3) below. t ss = 0.75(typ) x c ss 2a(typ) [sec] ??? (2) i in = c o x v out t ss [a] ??? ( 3) x v out v in (c ss : soft start capacitor c o : output capacitor) fb scp en/uvlo t scp ref x 0.7 short circuit protection is enabled when fb falls to or below ref x 0.7. once the programmed time period has elapsed, the output is latched off to prevent destruction of the circuit. output voltage can be restored either by cycling the en pin or disabling uvlo. short circuit protection time is programmed at 2.5msec (typ). t max t on t on hg lg i l i limit during normal operation, if fb is less than ref, hg is high during the time t on, but when the coil current exceeds the i li mit threshold, hg is set to off. the next pulse returns to normal operation i f the output voltage drops after the maximum on-time or i l becomes lower than i limit. downloaded from: http:///
12 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb selection of components externally connected 1. inductor (l) selection * passing a current larger than inductors rated current will cause m agnetic saturation in the inductor and decrease system efficiency. when selecting the inductor, be sure to a llow enough margin to assure that peak currents do not exceed the inductor rated current value. *to minimize possible inductor damage and maximize efficie ncy, choose a inductor with a low (dcr, acr) resistance. 2. output capacitor (co) selection please give due consideration to the conditions in formula (7 ) below for the output capacit or , bearing in mind that the output start-up time must be established within the soft start timeframe. capacitors used as bypass capacitors are connected to the load side affect the overall output capacit ance ( c ext , figure above). please set the soft start time or over-current detection value, regarding these capacities. if an inappropriate capacitor is used, ocp may be detected during acti vation and may cause startup malfunctions. 3. input capacitor (cin) selection a ceramic capacitor is recommended to reduce esr loss and maximi ze efficiency. i l = (v in - v out ) x v out l x v in x f [a] ??? (4) pgnd pgnd i l v in i l l c o v out output ripple current generally, lower inductance values offer faster response ti mes but also result in increased output ripple and lower efficiency. 0.47 h to 2.2 h are a recommended range of values. the peak current rating of the coil is approximated by formula (5). please select an inductor equal to or higher than this value . i lpeak = i outmax + (v in -v out ) x v out 2 x l x v in x f [ a] ??? ( 5) the inductor value is a major influence on the output ripple curren t. as formula (4) below indicates, the greater the inductor or the switchin g frequency, the lower the ripple current. v out = esr x i l +esl i l / t on ??? (6) c o + c ext t ss x (limit- i ou t ) v o ut ??? (7) t ss : soft start time limit: over current detection v in l co v out esr output capacitor esl loa d c ext pgnd pgnd the output capacitor should be determined by equivalent series resistance and equivalent series inductance so that the output ripple volta ge is 30mv or more. the rating of the capacitor is set with sufficient margin given the output voltage. i l : output ripple current esr : equivalent series resistance , esl : equivalent series inductance input capacitor irms= i out x v out (v in -v out ) v in [a] ??? (8) where v in = 2 x v out , irms= i out 2 pgnd pgnd l c o v out cin the input capacitor selected must have low enough esr to fully su pport high output ripple so as to prevent extreme over current conditions. th e formula for ripple current irms is given in (8) below. v in downloaded from: http:///
13 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb selection of components externally connected - continued 4 . mosfet selection the h igh -side mosfet generates loss when switching, along with the loss due to on -resistance. good efficiency is achieved by selecting a mosfet with low on -resistance and low qg (gate total charge amount). recommended mosfets for various current values are as follows: output current high-side mosfet low -side mosfet to 5a rq3e080gn rq3e080gn 5 to 8a rq3e120gn rq3e150gn 8 to 10a rq3e150gn rq3e180gn 5. set point output voltage this ic operates such that output voltage is ref fb. setting resistance are selected from 10k to 50k , because of external noise resistant and feedback current. please refer to constant the following for typical output voltag e. output voltage r1 r2 1.0v 10k 30k 1.2v 18k +1.8k 33k 1.35v 24k 30k 1.5v 24k 12k(30k//20k) 1.8v 39k+3k 30k 2.0v 36k+0.68k 22k p high-side = p ron +p tran p low -side = p ron < loss of high-side mosfet > < loss of high-side mosfet > v in l co v out low-side mosfet high-side mosfet pgnd pgnd v out v in x r on x i out 2 + (tr+tf) x v in x i out x f 6 = ??? (9) v in -v out v in x r on x i out 2 = ??? (1 0) (ron: on -resistance of fet, f: switching frequency, tr: rise time, tf: fall t ime) the h igh -side and low-side drivers are designed to activate n chann el mosfets having low on-resistance. the chosen mosfet may result in the loss described below, plea se select a proper fet for each considering the input-output and load curren t. v out = x ref(0.7v) (r1+r2) r2 downloaded from: http:///
14 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb selection of components externally connected - continued 6 . selecting resistance for over current setting (a) high-precision current detection circuit (use a low value resistor) (b) low loss current detection circuit (use dcr of l) i lmit =0.1 x 0.1 r i lmit = (r: detection resistor) [a] ??? (11) (rl: dcr value of inductor) must be adjusted so that the power dissipation into the r. about 47k to 330k. [a] ??? (12) l r x c rl = detect point i l i limit 0 t as shown in the diagram to the left, if the voltage between is+ and v out exceed the i lmit , the h igh -side fet gate is set low. because the peak value of inductor current is detected and correspon ds to the saturation time of inductor, the reliability of the system is improved. v in l co v out current limit i l r r ilim 100k gnd pgnd pgnd v in l co v out current limit i l rl r c gnd pgnd pgnd however, r x c l lg hg is+ v out i lim i lim v out is+ lg hg please make sure that 100k is used for r ilim . r ilim 100k please make sure that 100k is used for r ilim . downloaded from: http:///
15 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb application example figure 16 . bd95601muv-lb basic application circuit bills of materials reference designator type value description manufacturer part number manufacturer configuration (mm) c1 ceramic capacitor 0.022f 25v, x7r, 10% grm155r71e223ka61 murata 1005 c2 ceramic capacitor 1f 10v, x5r, 10% grm188r61a105ka61 murata 1608 c3 ceramic capacitor 10f 25v, x5r, 10% grm32dr61e106ka12 murata 3225 c4 ceramic capacitor 0.47f 10v , x5r, 10% grm188r61a474ka61 murata 1608 c5, c6 ceramic capacitor 0.01f 25v, x7r, 10% grm155r71e103ka01 murata 1005 c7 ceramic capacitor 10pf 50v, ch, 5% grm1552c1h100ja01 murata 1005 c8 ceramic capacitor 1000pf 50v, x5r, 10% grm155r61h102ka01 mura ta 1005 c10 ceramic capacitor 0.1f 50v, x5r, 10% grm155r61e104ka87 murata 1005 c11, c12 ceramic capacitor 10f 35v, x5r, 10% grm32er6ya106ka12 murata 3225 l1 inductor 0.56h 20%, 14.2a(l=- 20%), dcr=3.2mmax fdu0650-h-r56m toko 7667 q1 mosfet - n-ch , vdss 30v, id 15a, ron 4.7m rq3e150gn rohm 3333 q2 mosfet - n- ch, vdss 30v, id 18a, ron 3.3m rq3e180gn rohm 3333 r1 resistor 100k 1/16w, 50v, 5% mcr01mzpj104 rohm 1005 r2 resistor 10 1/16w, 50v, 5% mcr01mzpj100 rohm 1005 r5 resistor 36k 1/16w, 50v, 5% mcr01mzpj363 rohm 1005 r6 resistor 3.3 1/16w, 50v, 5% mcr01mzpj3r3 rohm 1005 r7 resistor 1k 1/16w, 50v, 5% mcr01mzpj102 rohm 1005 r8 resistor 2.7k 1/16w, 50v, 5% mcr01mzpj272 rohm 1005 r10 resistor 510 1/16w, 50v, 5% mcr01mzpj511 rohm 1005 r11, r12 resistor 100 1/16w, 50v, 5% mcr01mzpj101 rohm 1005 r13 resistor 100k 1/16w, 50v, 5% mcr01mzpj104 rohm 1005 u1 ic - buck dc/dc controller bd95601muv- lb rohm vqfn020v4040 2 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ss en/sllm ilim vcc fb hg sw vdd lg pgnd vout freq fs is- is+ gnd pgood out vin boot c10 c11 c12 r13 c8 l1 1v +12v reg1_5v c1 r1 r2 c2 r3 r4 r10 r5 c7 r12 r11 c3 r6 c5 r7 r8 c6 q1 q2 bd95371muv gnd pgnd c13 c4 u1 c14 jp1 r20 r18 en_1 pg_1 1vmgt 1.2v 1.35/1.5v 1.8v 2v en_1mgt en_1.2 en_1.35/1.5 en_1.8 en_2 pg_2 bd95601muv- lb downloaded from: http:///
16 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb vout=1.0v, iout=6a reference designator type value description manufacturer part number manufacturer configuration (mm) c13, c14 poscap 470f 2 .5 v, 20%, esr 6 mmax 2r5tpf470m6l sanyo 7343 jp1 jumper n/a not applicable - - - r3 resistor 30k 1/16w, 50v, 0.5% mcr01mzpd3002 rohm 1005 r4 resistor 10k 1/16w, 50v, 0.5% mcr01mzpd1002 rohm 1005 r18 resistor 0 jumper, 1a, 50mmax mcr01mzpj000 rohm 1005 r20 resistor n/a not applicable - - - vout=1.2v, iout=4a reference designator type value description manufacturer part number manufacturer configurati on (mm) c13, c14 poscap 470f 2 .5 v, 20%, esr 6 mmax 2r5tpf470m6l sanyo 7343 jp1 jumper n/a not applicable - - - r3 resistor 30k 1/16w, 50v, 0.5% mcr01mzpd3002 rohm 1005 r4 resistor 18k 1/16w, 50v, 0.5% mcr01mzpd1802 rohm 1005 r18 resistor 0 jumper, 1a, 50mmax mcr01mzpj000 rohm 1005 r20 resistor n/a not applicable - - - vout=1.8v, iout=6a reference designator type value description manufacturer part number manufacturer configuration (mm) c13, c14 poscap 470f 2 .5 v, 20%, esr 6 mmax 2r5tpf470m6l sanyo 7343 jp1 jumper n/a not applicable - - - r3 resistor 30k 1/16w, 50v, 0.5% mcr01mzpd3002 rohm 1005 r4 resistor 39k 1/16w, 50v, 0.5% mcr01mzpd3902 rohm 1005 r18 resistor 3k 1/16w, 50v, 5% mcr01mzpj302 rohm 1005 r20 resistor n/a not applicable - - - vout=1.35v, iout=4a reference designator type value description manufacturer part number manufacturer configuration (mm) c13, c14 poscap 470f 2 .5 v, 20%, esr 6 mmax 2r5tpf470m6l sanyo 7343 jp1 jumper - 0: 1.35v, 1: 1.5v - - - r3 resistor 30k 1/16w, 50v, 0.5% mcr01mzpd3002 rohm 1005 r4 resistor 24k 1/16w, 50v, 0.5% mcr01mzpd2402 rohm 1005 r18 resistor 0 jumper, 1a, 50mmax mcr01mzpj000 rohm 1005 r20 resistor 120k 1/16w, 50v, 0.5% mcr01mzpd1 203 rohm 1005 vout=2.0v, iout=2a reference designator type value description manufacturer part number manufacturer configuration (mm) c13, c14 poscap 330f 6.3v, 20%, esr 18mmax 6tpe330mil sanyo 7343 jp1 jumper n/a not applicable - - - r3 resistor 18k 1/16w, 50v, 0.5% mcr01mzpd1802 rohm 1005 r4 resistor 30k 1/16w, 50v, 0.5% mcr01mzpd3002 rohm 1005 r18 resistor 0 jumper, 1a, 50mmax mcr01mzpj000 rohm 1005 r20 resistor n/a not applicable - - - downloaded from: http:///
17 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 ambient temperature( ) power dissipation pd w) (1) 0.34w (4)3.56w (3)2.20w (2)0.70w power dissipation 85 pcb size: 74.2mm74.2mm1.6mmt substrate(1): ic only substrate(2): 1-layer (copper foil density 0mm 2 ) substrate(3): 4-layer (copper foil density 10.29 mm 2 ) 2,3-layer (copper foil de density 5505mm 2 ) substrate(4): 4-layer (copper foil density 5505 mm 2 ) substrate(1) ja=367.6c /w substrate(2) ja=178.6c /w substrate(3) ja=56.6c /w substrate(4) ja=35.1c /w downloaded from: http:///
18 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power s upply , such as mounting an external diode between the power su pply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-signa l ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is w hen the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current m ay flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one po wer supply. therefore, give special consideration to power coupl ing capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors co mpletely after each process or step. the ics power suppl y should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal partic les, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
19 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb operational notes C continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor . the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasi tic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) shoul d be avoided. figure 17 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and p ower dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ra ting is excee ded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protectio n circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
20 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb ordering information b d 9 5 6 0 1 m u v - l b h 2 part number package muv : vqfn product class lb for industrial applications packaging and forming specification h 2: embossed tape and reel marking diagrams vqfn020v4040 (top view) 95601 part number marking lot number 1pin mark downloaded from: http:///
21 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb physical dimension, tape and reel information package name vqfn020v4040 tape embossed carrier tape quantity 250pcs direction of feed reel direction of feed 1pin h2 the direction of the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand. *order quantity needs to be multiple of the minimum quantity. downloaded from: http:///
22 / 22 tsz02201-0j1j0az00520-1-2 ? 2013 rohm co., ltd. all rights reserved. 01.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 bd95601muv- lb revision history date revision changes 6.sep.2013 001 new release 1.apr.2014 002 delete sentence and log life cycle in general description and futures. change packaging and forming specification fro m e2 to h2. downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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