pk23 2 (v1. 1 ) march 19 , 201 2 www.xilinx.com 1 pk23 2 (v1.1 ) march 19 , 201 2 100% material declaration data sheet f t 64 average weight: 0. 2450 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) componen t percent of total silicon die 0.009338 3.81% silicon (si) 7440 - 21 - 3 99.96 0.009334 aluminum 7429 - 9 0 - 5 0. 04 0.000004 die attach 0.001018 0.41% silver (ag) 7440 - 22 - 4 75.00 0.000764 epoxy cresol novolak 29690 - 82 - 2 24.80 0.000252 d ibutyl phthalate 84 - 74 - 2 0.20 0.000002 mold compound 0.149487 61.01% biphenyl epoxy resin 85951 - 11 - 6 12.00 0.017939 phenol resin 9003 - 35 - 4 7.00 0.010464 quartz 14808 - 60 - 7 2.50 0.003737 silica, vitreous 60676 - 86 - 0 77.00 0.115106 carbon black 1333 - 86 - 4 0.50 0.000747 antimony trioxide 1309 - 64 - 4 0.50 0.000747 brominated epoxy resin 68541 - 56 - 0 0.50 0.000747 solder balls 0.017586 7.18% tin (sn) 7440 - 31 - 5 63.00 0.011079 lead (pb) 7439 - 92 - 1 37.00 0.006507 gold wire 0.000837 0.34 % gold (au) 7440 - 57 - 5 100.00 0.000837 ? copyright 20 08 - 2012 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet C FT64 pk23 2 (v 1. 1 ) march 19 , 201 2 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total substrate 0.06699 9 27.340 coating copper (cu) 7440 - 50 - 8 24.92 0.023527 nickel (ni) 7440 - 02 - 0 14.16 0.000195 gold (au) 7440 - 57 - 5 0.57 0.000119 core fiber glass 65997 - 17 - 3 8.49 0.016694 epoxy resin 9003 - 36 - 5 8.49 0.009485 metal hydroxide 21645 - 51 - 2 0.78 0.000379 bisma leimide 105391 - 33 - 1 0.08 0.005691 triazine 25722 - 66 - 1 0.24 0.005691 substrate baryum sulfate 7727 - 43 - 7 0.03 0.000522 dipropylene glycol monomethyl 34590 - 94 - 8 3.27 0.000052 talc containing no asbestiform fibers 14807 - 96 - 6 3.35 0.000164 si lica crystalline 14808 - 60 - 7 0.03 0.000023 2 - (2 - ethoxyethoxy)ethyl acetate 112 - 15 - 2 35.12 0.002192 acrylates derivative 407 - 47 - 6 0.29 0.002244 amine compound trade secret 1.78 0.000021 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its a ccuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and mate rials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 05/06/08 1.0 initial xilinx release. 03/19/12 1.1 component cas# update.
|
