nichia sts - da1 - 3616a nichia corporation specifications for white led nfsw157ft - hg pb built rohs compliant
nichia sts - da1 - 3616a 1 specifications (1) absolute maximum ratings item s ymbol absolute maximum rating unit forward current i f 200 ma pulse forward current i fp 400 ma allowable reverse current i r 85 ma power dissipation p d 680 mw operating temperature t opr - 40~100 c storage temperature t stg - 40~100 c junction temperatu re t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =120ma 3.0 - v luminous flux v i f =120ma 44 - lm luminous intensity i v i f =120ma 14.4 - cd ch romaticity coordinate x - i f =120ma 0.277 - - y - i f =120ma 0.260 - - thermal resistance r js - 21 28 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point. * this product uses a unique red phosphor that has a slow response time; when compared with the blue die and green phosphor in the product, the red will fluoresce with a delayed pulse of about 10msec and have an afterglow for about 10msec after the blue die dims. if the leds are operated with a pulse current, ensure there are no issues.
nichia sts - da1 - 3616a 2 ranks item rank min max unit forward voltage - 2.7 3.4 v luminous flux p14d21 51.0 55.6 lm p13d22 46.7 51.0 p13d21 42.8 46.7 p12d22 39.2 42.8 color ranks rank btc45 rank btc46 x 0.2970 0.2970 0.3020 0.3020 x 0.2920 0.2920 0.2970 0.2970 y 0.2968 0.3068 0.3160 0.3060 y 0.2876 0.2976 0.3068 0.2968 rank btc47 rank btc48 x 0.28 70 0.2870 0.2920 0.2920 x 0.2820 0.2820 0.2870 0.2870 y 0.2784 0.2884 0.2976 0.2876 y 0.2692 0.2792 0.2884 0.2784 rank btc49 rank btc50 x 0.2770 0.2770 0.2820 0.2820 x 0.2720 0.2720 0.2770 0.2770 y 0.2600 0.2700 0.2792 0.2692 y 0.2508 0.2608 0. 2700 0.2600 rank btc51 rank btc52 x 0.2670 0.2670 0.2720 0.2720 x 0.2620 0.2620 0.2670 0.2670 y 0.2416 0.2516 0.2608 0.2508 y 0.2324 0.2424 0.2516 0.2416 rank btc53 rank btc65 x 0.2570 0.2570 0.2620 0.2620 x 0.2970 0.2970 0.3020 0.3020 y 0 .2232 0.2332 0.2424 0.2324 y 0.2868 0.2968 0.3060 0.2960 rank btc66 rank btc67 x 0.2920 0.2920 0.2970 0.2970 x 0.2870 0.2870 0.2920 0.2920 y 0.2776 0.2876 0.2968 0.2868 y 0.2684 0.2784 0.2876 0.2776 rank btc68 rank btc69 x 0.2820 0.2820 0.2 870 0.2870 x 0.2770 0.2770 0.2820 0.2820 y 0.2592 0.2692 0.2784 0.2684 y 0.2500 0.2600 0.2692 0.2592 rank btc70 rank btc71 x 0.2720 0.2720 0.2770 0.2770 x 0.2670 0.2670 0.2720 0.2720 y 0.2408 0.2508 0.2600 0.2500 y 0.2316 0.2416 0.2508 0.2408 rank btc72 rank btc73 x 0.2620 0.2620 0.2670 0.2670 x 0.2570 0.2570 0.2620 0.2620 y 0.2224 0.2324 0.2416 0.2316 y 0.2132 0.2232 0.2324 0.2224 * ranking at t s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 7% * chromatici ty coordinate tolerance: 0.005 * leds from the above ranks will be shipped. the rank combination ratio per shipment will be decided by nichia.
nichia sts - da1 - 3616a 3 chromaticity diagram btc45 btc46 btc47 btc48 btc49 btc50 btc51 btc52 btc53 btc65 btc66 btc67 btc68 btc69 btc70 btc71 btc72 btc73 0.15 0.20 0.25 0.30 0.35 0.40 0.15 0.20 0.25 0.30 0.35 0.40 y x
nichia sts - da1 - 3616a 4 outline dimensions s t s - d a 7 - 7 3 2 9 a n x s w 1 5 7 f - h x n o . ( g u n i t : m m ) t h i s p r o d u c t c o m p l i e s w i t h r o h s d i r e c t i v e . u ? r o h s ? m * ( g u n i t : m m , t o l e r a n c e : 0 . 2 ) o p r o t e c t i o n d e v i c e k a d i m e n s i o n s d o n o t i n c l u d e m o l d f l a s h . * 0 . 7 6 0 . 2 6 2 . 6 0 . 8 6 a n o d e c a t h o d e 0 . 5 2 ( 1 ) ( 2 . 6 ) 1 . 4 3 t h e d i m e n s i o n ( s ) i n p a r e n t h e s e s a r e f o r r e f e r e n c e p u r p o s e s . * ? i t e m ` | p a c k a g e m a t e r i a l s ? ? | e n c a p s u l a t i n g r e s i n m a t e r i a l s O | e l e c t r o d e s m a t e r i a l s | w e i g h t d e s c r i p t i o n ` h e a t - r e s i s t a n t p o l y m e r ` ? ? + w s i l i c o n e r e s i n ( w i t h d i f f u s e r a n d p h o s p h o r ) ~ + y a g - p l a t e d c o p p e r a l l o y 0 . 0 0 7 5 g ( t y p )
nichia sts - da1 - 3616a 5 soldering ? recommended reflow soldering condition(lead ? recommended hand soldering condition recommended soldering pad pattern recommended metal solder stencil aperture * this led is designed to be reflow soldered on to a pcb. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twice. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down t he temperature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is sof t, do not press on the encapsulant resin. pressure can cause nicks, chip - outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * repairing should not be done after the leds have been soldered. when repairing is unavoi dable, a double - head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. * when soldering, do not apply stress to the led while the led is hot. * when u sing a pick and place machine, choose an appropriate nozzle for this product. using a pick - and - place nozzle with a smaller diameter than the size of the led's emitting surface will cause damage to the emitting surface and may also cause the led not to illuminate. 120sec m ax pre - heat 180 to 200 c 260c m ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ( g u n i t : m m ) 3 . 0 4 3 . 7 6 0 . 0 7 0 . 8 9 0 . 5 2 0 . 9 3 0 . 7 6 0 . 8 6 1 . 5 5 0 . 2 6 2 . 8 4
nichia sts - da1 - 3616a 6 * if the top cover tape is removed right next to where the nozzle picks up the leds, regardless of whether the leds have been baked or not, it may cause the led to be picked up incorrectly; it is recommended to remove the top cover tap e further from where the nozzle picks up the leds. ensure that there are no issues with the conditions when the nozzle picks up the led s. recommended tape removal position(removing the cover tape further from the pick - and - place nozzle) incor rect tape removal position(removing the cover tape right next to the pick - and - place nozzle) * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is required, such as high - dens ity mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a h alogen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions. ? pick-and-place nozzle ??` feed direction of the carrier tape ?`?x tape removal position u??` top cover tape u??` top cover tape ? pick-and-place nozzle ?`?x tape removal position ??` feed direction of the carrier tape
nichia sts - da1 - 3616a 7 tape and reel dimensions s t s - d a 7 - 0 0 7 1 c n x x x 1 5 7 x ` / ` t r a i l e r a n d l e a d e r t o p c o v e r t a p e l e d ? ` 4 0 0 m m ` 1 6 0 m m t r a i l e r 1 6 0 m m m i n ( e m p t y p o c k e t s ) l o a d e d p o c k e t s ` e m b o s s e d c a r r i e r t a p e ` ` f e e d d i r e c t i o n l e a d e r w i t h o u t t o p c o v e r t a p e 4 0 0 m m m i n 1 0 0 m m l e a d e r w i t h t o p c o v e r t a p e 1 0 0 m m m i n ( e m p t y p o c k e t ) n o . ( g u n i t : m m ) 6 0 + 1 - 0 ` r e e l f 1 3 0 . 2 f 2 1 0 . 8 l a b e l 2 1 0 . 8 1 3 0 . 2 1 1 . 4 1 9 0 . 3 1 8 0 + 0 - 3 - 0 1 . 5 + 0 . 1 ` t a p e 4 0 . 1 1 . 7 5 0 . 1 4 0 . 1 2 0 . 0 5 3 . 5 0 . 0 5 8 + 0 . 3 - 0 . 1 1 . 6 0 . 1 0 . 2 0 . 0 5 3 . 2 5 0 . 1 0 . 6 5 0 . 1 - 0 1 + 0 . 1 c a t h o d e r e e l s i z e : 5 0 0 0 p c s 1 ` 5 0 0 0 * t h e t a p e p a c k i n g m e t h o d c o m p l i e s w i t h j i s c 0 8 0 6 ( p a c k a g i n g o f e l e c t r o n i c c o m p o n e n t s o n c o n t i n u o u s t a p e s ) . * j i s c 0 8 0 6 ? ` w h e n t h e t a p e i s r e w o u n d d u e t o w o r k i n t e r r u p t i o n s , n o m o r e t h a n 1 0 n s h o u l d b e a p p l i e d t o t h e e m b o s s e d c a r r i e r t a p e . t h e l e d s m a y s t i c k t o t h e t o p c o v e r t a p e . * g ? I ` ` ? ` ( 1 0 n ) l e d ` ` N
nichia sts - da1 - 3616a 8 p ackaging - tape & reel n i c h i a l e d s t s - d a 7 - 0 0 0 6 c n x x x x x x x l a b e l l a b e l n o . r e e l ` ` s e a l m o i s t u r e - p r o o f b a g ? r o h s n x x x x x x x x x x x l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s r o h s n x x x x x x x x x x x l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n r e e l s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . ` ? ` d e s i c c a n t s m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h c o r r u g a t e d p a r t i t i o n s . ? K ` ` ? y ? ? * ? \ H y ? B ? y * ? Q H n u ? p ? ? * u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . p r o d u c t s s h i p p e d o n t a p e a n d r e e l a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . * u ? ` ? n o ` y i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ? f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ? t h e l a b e l d o e s n o t h a v e t h e r a n k f i e l d f o r u n - r a n k e d p r o d u c t s . * ?
nichia sts - da1 - 3616a 9 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2014 e 2015 f 2016 g 2017 h 2018 i 2019 j m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - nichia's product number rrr - ranking by color coordinates, ranking by luminous flux
nichia sts - da1 - 3616a 10 derating characteristics NFSW157F-HG ? no. sts-da7-7882 0 50 100 150 200 250 300 0 20 40 60 80 100 120 derating1 (61, 200) (100, 67.0) 0 50 100 150 200 250 300 0 20 40 60 80 100 120 derating2 (100, 200) 10 100 1000 1 10 100 duty 200 400 S allowable forward current(ma) ???? ( `? ) - S solder temperature(cathode side) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ???? ( `? ) solder temperature(cathode side)( c) ?? ambient temperature( c) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current 92 c/w ja r = t a =25 c
nichia sts - da1 - 3616a 11 optical characteristics NFSW157F-HG ? no. sts-da7-7417a 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 120ma i fp = t a =25 c 120ma i fp = t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3616a 12 forward current characteristics / temperature characteristics NFSW157F-HG ? no. sts-da7-7418a 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 2.0 2.5 3.0 3.5 4.0 vfif 120 400 relative luminous flux(a.u.) ?? - ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 500 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) * ??? all characteristics shown are for reference only and are not guaranteed. =25 c t a i fp = 120ma i fp = 120ma t a =25 c
nichia sts - da1 - 3616a 13 forward current characteristics / temperature characteristics NFSW157F-HG ? no. sts-da7-7419a 0.24 0.25 0.26 0.27 0.28 0.26 0.27 0.28 0.29 0.30 taxy - 40?c 0?c 25?c 100?c x 0.24 0.25 0.26 0.27 0.28 0.26 0.27 0.28 0.29 0.30 ifxy 20ma 100ma 120ma 200ma x y y 120ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3616a 14 reliability (1) tests and results test reference standard test conditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4 701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed - 4701 303 303a t sld =2455c, 5sec, lead - free solder(sn - 3.0ag - 0.5cu) #2 0/22 thermal shock jeita ed - 4701 300 307 - 40c to 100c, 1 min dwell, 10sec transfer, precondition: 30c, 70%rh, 168hr 100cycles #1 0/22 temperature cycle jeita ed - 4701 100 105 - 40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/22 moisture resistance (cyclic) jeita ed - 4701 200 203 25c~65c~ - 10c, 9 0%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed - 4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed - 4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed - 4701 200 202 t a = - 40c 1 000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =120ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =200ma test board: see notes below 500hours #1 0/22 high temperature op erating life t a =100c, i f =65ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =130ma test board: see notes below 500hours #1 0/22 low temperature operating life t a = - 40c, i f =120ma test board: see note s below 1000hours #1 0/22 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed - 4701 300 304 hbm, 2kv, 1.5k, 100pf, 3pulses, alternately positive or negative #1 0/22 so ldering joint shear strength jeita ed - 4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 92c/w 2) measurements are performed after allowing the leds to return to room temper ature. (2) failure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =120ma >u.s.l.1.1 luminous flux( v ) i f =120ma nichia sts - da1 - 3616a 15 cautions (1) sto rage conditions temperature humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std - 020 for moisture - sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture - proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture - proof aluminum bag, the products should go th rough the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture - proof bags for storage. after the period after opening storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight container when not in use. exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristic s. it is also recommended to return the leds to the original moisture proof bags and reseal. a fter assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the a bove should be taken into consideration when designing. resin materials, in particular, may contain substances which can affect silver plating, such as halogen. do not use sulfur - containing materials in commercial products. some materials, such as se als and adhesives, may contain sulfur. the extremely corroded or contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silicones may lead to silicone contamination o f electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. do not store the leds in a dusty envir onment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maxi mum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended. if the leds are operated with constant voltage using circuit a, the current through the leds may vary due to t he variation in forward voltage characteristics of the leds. this product should be operated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led characteristics. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, mois ture and salt air damage. ( a ) . . . ( b ) . . .
nichia sts - da1 - 3616a 16 (3) handling precautions do not handle the leds with bare hands as it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wire to break, which will cause the led not to illuminate. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, chipped, delaminate or deformed, causing wire - bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wire to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommende d: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and machin es that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charg e with ionizers the customer is advised to check if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltage measurement or a light - up test at low cur rent (1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts - da1 - 3616a 17 (6) thermal management proper thermal management is an important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. other solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of s uch solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with isopropyl alcohol (ipa), then squeeze it before wiping the led s. ultrasoni c cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cl eaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825 - 1:2007 laser safety standar d removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825 - 1:20112001, which still includes leds in its scope. most of nichia's leds can be cl assified as belonging into either the exempt group or risk group 1. high - power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the huma n body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for air planes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without havi ng prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of this product may change without notice; nichia does not guarant ee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins. t s p o i n t
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