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lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y features * meet rohs. * side looking / dual color chip led with tin plati ng. * ultra bright alingap chip led. * package in 8mm tape on 7" diameter reels. * eia std package. * i.c. compatible. * compatible with automatic placement equipment. * compatible with infrared and vapor phase reflow s older process. package dimensions devices part no. lens source color pin assignment alingap green a2 LTST-S327KGJRKT water clear allngap red a1 notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.10 mm (.004") unless otherwise noted. part no. : LTST-S327KGJRKT page : 1 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at ta=25 c LTST-S327KGJRKT parameter green red unit power dissipation 75 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 80 80 ma dc forward current 30 30 ma reverse voltage 5 5 v operating temperature range -30 c to + 85 c storage temperature range -40 c to + 85 c infrared soldering condition 260 c for 10 seconds part no. : LTST-S327KGJRKT page : 2 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y suggestion profile: suggestion ir reflow profile for pb free process part no. : LTST-S327KGJRKT page : 3 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at ta=25 c LTST-S327KGJRKT parameter symbol green red unit test condition min. 18.0 18.0 typ. 35.0 45.0 luminous intensity iv max. 112.0 112.0 mcd if =20ma note 1 viewing angle 2 q 1/2 typ. 130 130 deg note 2 (fig.6) peak emission wavelength l p typ. 574 639 nm measurement @peak (fig.1) dominant wavelength l d typ. 571 631 nm if =20ma note 3 spectral line half-width dl typ. 15 20 nm typ. 2.0 2.0 forward voltage vf max. 2.4 2.4 v if =20ma reverse current ir max. 10 10 m a vr = 5v notes: 1. luminous intensity is measured with a lig ht sensor and filter combination that approximates the cie eye-response curve. 2. 1/2 is the off-axis angle at which the luminous int ensity is half the axial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. caution in esd: static electricity and surge damages the l ed. it is recommend to use a wrist band or anti-ele ctrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. part no. : LTST-S327KGJRKT page : 4 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : LTST-S327KGJRKT page : 5 of 1 2 bns-od-c131/a4 bin code list luminous intensity color : green , unit : mcd @20ma bin code min. max. m 18.0 28.0 n 28.0 45.0 p 45.0 71.0 q 71.0 112.0 tolerance on each intensity bin is +/-15% luminous intensity color : red , unit : mcd @20ma bin code min. max. m 18.0 28.0 n 28.0 45.0 p 45.0 71.0 q 71.0 112.0 tolerance on each intensity bin is +/-15% dominant wavelength color : green , unit : nm @20ma bin code min. max. c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance for each dominate wavelength bin is +/- 1 nm
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 c ambient temperature unless otherwise noted) part no. : LTST-S327KGJRKT page : 6 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y cleaning do not use unspecified chemical liquid to clean led they could harm the package. if clean is necessary, immerse the led in ethy l alcohol or in isopropyl alcohol at normal tempera ture for less one minute. suggest soldering pad dimensions suggest soldering direction: package dimensions of tape and reel notes: 1. all dimensions are in millimeters (inches). part no. : LTST-S327KGJRKT page : 7 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y notes: 1. empty component pockets sealed with top cover ta pe. 2. 7 inch reel-3000 pieces per reel. 3. minimum packing quantity is 500 pcs for remainde rs. 4. the maximum number of consecutive missing lamps is two. 5. in accordance with ansi/eia 481 specifications. part no. : LTST-S327KGJRKT page : 8 of 1 2 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : LTST-S327KGJRKT page : 9 of 1 2 bns-od-c131/a4 cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household ap plications).consult liteons sales in advance for information on applications in which exceptiona l reliability is required, particularly when the fa ilure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation , traffic control equipment, medical and life support systems and safety devices). 2. storage the package is sealed: the leds should be stored at 30c or less and 90% rh or less. and the leds are limited to use within one year, while the leds is packed in moisture-proo f package with the desiccants inside. the package is opened: the storage ambient for the leds should not exceed 30c temperature or 60% relative humidity. it is recommended that leds out of their original p ackaging are ir-reflowed within one week. for extended storage out of their original packagin g, it is recommended that the leds be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. leds stored out of their original packaging for mor e than a week should be baked at about 60 deg c for at least 20 hours before solder assembly. 3. cleaning use alcohol-based cleaning solvents such as isoprop yl alcohol to clean the led if necessary. 4. soldering recommended soldering conditions: reflow soldering soldering iron pre-heat pre-heat time peak temperature soldering time 150~200c 120 sec. max. 260c max. 10 sec. max.(max. two times) temperature soldering time 300c max. 3 sec. max. (one time only) soldering notes: because different board designs use different numbe r and types of devices, solder pastes, reflow ovens , and circuit boards, no single temperature profile works for all possible combinations. however, you can successfully mount your packages t o the pcb by following the proper guidelines and pcb-specific characterization. lite-on runs both component-level verification usin g in-house kyramx98 reflow chambers and board-level assembly. the results of this testing are verified through po st-reflow reliability testing. profiles used at lite-on are based on jedec standar ds to ensure that all packages can be successfully and reliably surface mounted. figure on page3 shows a sample temperature profile compliant to jedec standards. you can use this example as a generic target to set up your reflow process. you should adhere to the jedec profile limits as we ll as specifications and recommendations from the solder paste manufacturer to avoid damaging the dev ice and create a reliable solder joint.
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y 5. drive method an led is a current-operated device. in order to en sure intensity uniformity on multiple leds connecte d in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below . circuit model a circuit model b led led (a) recommended circuit. (b) the brightness of each led might appear differe nt due to the differences in the i-v characteristic s of those leds. 6. esd (electrostatic discharge) static electricity or power surge will damage the l ed. suggestions to prevent esd damage: use of a conductive wrist band or anti-electrostati c glove when handling these leds. all devices, equipment, and machinery must be prope rly grounded. work tables, storage racks, etc. should be properly grounded. use ion blower to neutralize the static charge whic h might have built up on surface of the leds plastic lens as a result of friction between leds d uring storage and handling. esd-damaged leds will exhibit abnormal characterist ics such as high reverse leakage current, low forwa rd voltage, or no lightup at low currents. to verify for esd damage, check for lightup and vf of the suspect leds at low currents. the vf of good leds should be >2.0v@0.1ma for i ngan product and >1.4v@0.1ma for alingap product. part no. : LTST-S327KGJRKT page : 10 of 12 bns-od-c131/a4
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y part no. : LTST-S327KGJRKT page : 11 of 12 bns-od-c131/a4 7. reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@20ma. mil-std-750d:1026 mil-std-883d:1005 jis c 7021:b-1 high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ,rh= 90 95% * test time= 240hrs2hrs mil-std-202f:103b jis c 7021:b-11 high temperature storage ta= 1055 * test time= 1000hrs (-24hrs,+72hrs) mil-std-883d:1008 jis c 7021:b-10 endurance test low temperature storage ta= -555 * test time=1000hrs (-24hrs,+72h rs) jis c 7021:b-12 temperature cycling 105 25 -55 25 30mins 5mins 30mins 5mins 10 cycles mil-std-202f:107d mil-std-750d:1051 mil-std-883d:1010 jis c 7021:a-4 thermal shock ir-reflow in-board, 2 times 85 5 -40 5 10mins 10mins 10 cycles mil-std-202f:107d mil-std-750d:1051 mil-std-883d:1011 solder resistance t.sol= 260 5 dwell time= 10 1secs mil-std-202f:210a mil-std-750d:2031 jis c 7021:a-1 ir-reflow pb free process ramp-up rate(217 to peak) +3 / second max temp. maintain at 175(25) 180 seconds max temp. maintain above 217 60-150 seconds peak temperature range 260 +0/-5 time within 5c of actual peak temperature (tp) 10~30 seconds ramp-down rate +6 /second max mil-std-750d:2031.2 j-std-020d environmental test solderability t.sol= 235 5 immersion time 20.5 sec immersion rate 252.5 mm/sec coverage R 95% of the dipped surface mil-std-202f:208d mil-std-750d:2026 mil-std-883d:2003 iec 68 part 2-20 jis c 7021:a-2 8. others the appearance and specifications of the product ma y be modified for improvement without prior notice.
lite-on technology corporation p r o p e r t y o f l i t e - o n o n l y 9. suggested checking list training and certification 1. everyone working in a static-safe area is esd- certified? 2. training records kept and re-certification dat es monitored? static-safe workstation & work areas 1. static-safe workstation or work-areas have esd signs? 2. all surfaces and objects at all static-safe wo rkstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sens itive (esds) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 5. all wrist strap or heel strap checkers calibrati on up to date? note: *50v for blue led. device handling 1. every esds items identified by eia-471 labels on item or packaging? 2. all esds items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. no static charge generators (e.g. plastics) insi de shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycles? others 1. audit result reported to entity esd control coor dinator? 2. corrective action from previous audits completed ? 3. are audit records complete and on file? part no. : LTST-S327KGJRKT page : 12 of 1 2 bns-od-c131/a4

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