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? 2013 microchip technology inc. ds75083b-page 1 features input/output ports internally matched to 50 ? and dc decoupled package available - 16-contact x2qfn C 2.5mm x 2.5mmx 0.4mm all non-pb (lead-free) devices are rohs compliant transmitter chain gain: - typically 24 db gain dynamic linear output power: - meets 802.11g ofdm acpr requirement up to 21 dbm using 3.6v v cc and 22.5 dbm using 5v v cc - 17 dbm using 3.6v, 18 dbm using 5.0v, at 3% evm for 802.11g, 54 mbps - 15 dbm using 3.6v, 16 dbm using 5.0v, at 1.75% dynamic evm for 256 qam, 40 mhz bandwidth operating current - 150 ma @ p out = 17 dbm for 802.11g, 3.6v - 130 ma @ p out = 15 dbm for mcs9, 3.6v pa control current, i pen :<3 ma idle current, i cq :90 ma (3.6v v cc ) low shut-down current: ~2 a power-up/down control - turn on/off time (10%C90%) <400 ns limited variation over temperature - ~1 db power variation between -40c to +85c linear on-chip power detection - load and temperature insensitive - >20 db dynamic range on-chip power detection receiver chain gain: typically 12 db gain noise figure: typically 2.5 db receiver input p1db: typically -6 dbm lna bypass loss: typically 9 db bluetooth ? chain loss: 1.6db output p1db: >25 dbm applications wlan (ieee 802.11b/g/n/256 qam) home rf cordless phones 2.4 ghz ism wireless equipment 1.0 product description sst12lf09 is a 2.4 ghz front-end module (fem) designed in compliance with ieee 802.11b/g/n and 256 qam applications. based on gaas phemt/hbt technology, it combines a high-performance transmitter power amplifier (pa), a low-noise receiver amplifier (lna) and an antenna tx/rx/bt switch (sp3t sw). the input/output rf ports are single-ended and inter- nally matched to 50 ? . these rf ports are dc decou- pled, and require no dc-blocking capacitors or matching components. this helps reduce the system board bill of materials (bom) cost. there are two components to the fem: the transmitter (tx) chain and the receiver (rx) chain. the tx chain includes a high-efficiency pa based on the ingap/gaas hbt technology. the transmitter is optimized for high linearity, 802.11n and 256 qam operationCtypically providing 15 dbm with 1.75% dynamic evm for 256 qam, 40 mhz operation and 17 dbm at 3% for 802.11g, 54 mbps operation at 3.6v. at 5v v cc , the transmitter provides typically 17 dbm with 1.75% dynamic evm for 256 qam, 40 mhz operation and 18 dbm at 3% for 802.11g, 54 mbps operation. sst12lf09 has a transmitter on-chip, single-ended power detector that is stable over temperature andinsensitive to output vswr. it features a wide dynamic-range (20 db) with db-wise linear operation. the on-chip power detector provides a reliable solution to board-level power control. the rx chain provides typically 12 db gain with 2.5 db noise figure. with the lna bypassed, the receiver lossis typically 9 db. sst12lf09 is of fered in a 16-contact x2qfn package. see figure 3-1 for pin assignments and table 4-1 for pin descriptions. sst12lf09 2.4 ghz high-linearity, wlan front-end module downloaded from: http:///
sst12lf09 ds75083b-page 2 ? 2013 microchip technology inc. to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regarding this publication, please contact the marketing communications department via e- mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data sheet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the version number, (e.g., ds30000000a is version a of document ds30000000). errata an errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. customer notification systemregister on our web site at www.microchip.com to receive the most current information on all of our products. downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 3 sst12lf09 2.0 functional blocks figure 2-1: functional block diagram 16 15 14 13 5 6 7 8 12 3 4 1211 10 9 75083 b1.2 gndbt vcc len det nc vccvcc antgnd crx cbt tx pen gnd rx pa lna pa downloaded from: http:///
sst12lf09 ds75083b-page 4 ? 2013 microchip technology inc. 3.0 pin assignments figure 3-1: pin assignments for 16-contact x2qfn 4.0 pin descriptions 16 15 14 13 5 6 7 8 12 3 4 1211 10 9 75083 p1.0 top view (contacts facing down) rf and dc gnd gndbt vcc len det nc vccvcc antgnd crx cbt tx pen gnd rx table 4-1: pin description symbol pin no. pin name type 1 1. i=input, o=output function det 1o detector output voltage ground nc 2 no connect vcc 3 power supply pwr supply voltage vcc 4 power supply pwr supply voltage tx 5i rf transmit input pen 6i pa enable gnd 7 ground ground pad rx 8o rx output len 9i lna enable vcc 10 pwr supply voltage bt 11 i/o bluetooth rf port gnd 12 ground ground pad cbt 13 i bluetooth switch control crx 14 i receiver switch control voltage gnd 15 ground ground pad ant 16 i/o antenna downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 5 sst12lf09 5.0 electrical specifications the dc and rf specifications for the power amplifier are specified below. refer to table 5-2 for the dc volt- age and current specifications. absolute maximum stress ratings (applied conditions greater than those listed under ?absolute maxi- mum stress ratings? may cause permanent damage to the device. this is a stress rating only and func- tional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. exposure to absolute maximum stress rating conditions may affect device reliability.) tx input power to pin 5 (tx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dbm rx input power to pin 16 (ant with lna on) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dbm average tx output power from pin 16 (ant) 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dbm 1. never measure with cw source. pulsed single-tone source with <50% duty cycle is recommended. exceeding the maximum rating of average output power could cause permanent damage to the device. supply voltage at pins 3 and 4 (v cc ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to +5.5v pa enable voltage to pin 6 (pen) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to +3.6v dc supply current (i cc ) 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 ma 2. measured with 100% duty cycle 54 mbps 802.11g ofdm signal operating temperature (t a ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oc to +85oc storage temperature (t stg ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oc to +120oc maximum junction temperature (t j ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150oc surface mount solder reflow temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260c for 10 seconds table 5-1: operating range range ambient temp v cc extended -40c to +85c 3.0-5.0v table 5-2: dc electrical characteristics at 25c for tx chain symbol parameter min. typ max. unit v cc supply voltage, v cc 3.0 3.6 5.0 v i cq tx idle current for v cc = 3.6v 90 ma tx idle current for v cc = 5.0v 95 ma v pen tx enable voltage 3.05 3.10 3.15 v i cc tx supply current for 11g ofdm 54 mbps signal: p out = 17 dbm at v cc = 3.6v 150 ma p out = 18 dbm at v cc = 5.0v 160 ma i dd rx supply current (with lna on) 9m a downloaded from: http:///
sst12lf09 ds75083b-page 6 ? 2013 microchip technology inc. table 5-3: tx chain rf characteristics at v cc = 3.6v, pen=3.1v, 25c symbol parameter min. typ max. unit f l-u frequency range 2.4 2.5 ghz linearity, output power with <3% evm, 802.11g @ 54 mbps ofdm 17 dbm output power level 1.75% dynamic evm, 256 qam, 40 mhz 15 dbm output power level 2.5% dynamic evm, 802.11n, ht40 16 dbm spectrum mask compliance, ieee802.11b 21 dbm g gain 22 24 db rl in input return loss at tx port 14 db v det power detector output voltage at p out =5 dbm, ieee802.11g 0.25 0.35 v power detector output voltage at p out = 20 dbm, 0.55 0.65 v 2f, 3f, 4f, 5f harmonics at 17 dbm -30 dbm/ mhz table 5-4: tx chain rf characteristics at v cc = 5.0v, pen=3.1v, 25c symbol parameter min. typ max. unit f l-u frequency range 2.4 2.5 ghz linearity, output power with <3% evm, 802.11g @ 54 mbps ofdm 18 dbm output power level 1.75% dynamic evm, 256 qam, 40 mhz 16 dbm output power level 2.5% dynamic evm, 802.11n, ht40 17 dbm spectrum mask compliance, ieee802.11b 22 dbm g gain 22 24 db rl in input return loss at tx port 14 db v det power detector output voltage at p out =5 dbm, ieee802.11g 0.25 0.35 v v det power detector output voltage at p out = 20 dbm, 0.55 0.65 v 2f, 3f, 4f, 5f harmonics at 17 dbm -30 dbm/ mhz table 5-5: rx chain rf characteristics at v cc = 3.6vC5v, len=3.1v, crx = 3.1v, 25c symbol parameter min. typ max. unit f l-u frequency range 2.4 2.5 ghz g gain, with lna on 12 db nf noise figure, with lna on 2.5 db ip1db input p1db, with lna on -6 dbm loss lna bypass loss 9d b rl in input return loss at antenna port with lna 12 db table 5-6: bluetooth chain rf characteristics at v cc = 3.6vC5v, cbt=3.1v, 25c symbol parameter min. typ max. unit f l-u frequency range 2.4 2.5 ghz l loss 1.6 db rl return loss 8d b downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 7 sst12lf09 table 5-7: control voltages 1 function pen crx len cbt transmit mode 3.1v 0 0 0 bluetooth 00 0 3 v receive mode, lna on 03 v 3 v 0 receive mode, lna bypass 03 v 0 0 off 00 0 0 1. no other operating modes are allowed downloaded from: http:///
sst12lf09 ds75083b-page 8 ? 2013 microchip technology inc. 6.0 typical performance characteristics 6.1 transmitter test conditions: v cc = 3.6v, pen = 3.10v, len = 0v, crx = 0v, cbt = 0v, t a = 25c, unless otherwise specified figure 6-1: s-parameters figure 6-2: transmitter evm versus output power measured using 802.11g with equalizer training using sequence only -50 -40 -30 -20 -10 0 10 20 30 01234567891 0 s - parameter, db frequency, ghz s11 s21 s12 s21 75083 f6.0 75083 f1.1 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 evm (%) output power (dbm) 2412 2442 2472 downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 9 sst12lf09 figure 6-3: transmitter dynamic evm versus output power measured using 256 qam, 40 mhz bandwidth with equalizer training using sequence only figure 6-4: gain versus output power 75083 f8.0 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 evm (%) output power (dbm) 2412 2442 2472 75083 f2.1 15 16 17 18 19 20 21 22 23 24 25 5 6 7 8 9 1011121314151617181920 power gain (db) output power (dbm) 2412 2442 2472 downloaded from: http:///
sst12lf09 ds75083b-page 10 ? 2013 microchip technology inc. figure 6-5: transmitter dc current versus output power figure 6-6: detector voltage versus output power 75083 f3.1 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 0123456789101112131415161718192021 supply current (ma) output power (dbm) 2412 2442 2472 75083 f4.2 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 detector voltage (v) output power (dbm) 2412 2442 2472 downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 11 sst12lf09 6.2 receiver test conditions: v cc = 3.6v, len = 3.3v, crx = 3.3v, pen = 0v, cbt = 0v, t a = 25c, unless otherwise specified figure 6-7: receiver s-parameter figure 6-8: receiver noise figure -40 -30 -20 -10 0 10 20 01234567891 0 s - parameter, db frequency, ghz s11 s21 s12 s21 75083 f7.0 75083 f5.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.4 2.45 2.5 noise figure, db frequency, ghz downloaded from: http:///
sst12lf09 ds75083b-page 12 ? 2013 microchip technology inc. figure 6-9: typical schematic 75083 schematic 1.3 12lf09 vcc bt crx cbt 16 15 14 13 5 6 7 8 12 3 4 1211 10 9 len 0.1 f pen vdd 0.1 f det nc vcc 0.1 f 50 tx 50 rx 50 50 ant 2.2 f 10 * *resistor improves evm for 5v operation downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 13 sst12lf09 7.0 packaging diagrams for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: microchip technology drawing c04-14017a sheet 1 of 1 16-lead super-thin quad flatpack no-leads (q3ce/f) - 2.5x2.5 mm body [x2qfn] 16-x2qfn-2.5x2.5-q3c-2.0 note: from the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-c ircle notch. 2. the topside pin #1 indicator is laser engraved; its approximate shape and location is as shown. 3. the external paddle is electrically connected to the die back-side and to vss. this paddle must be soldered to the pc board; it is required to connect this paddle to the vss of the unit. connection of this paddle to any other voltage potential will result in shorts and electr ical malfunction of the device. 4. untoleranced dimensions are nominal target dimensions. 5. all linear dimensions are in millimeters (max/min). 1. downloaded from: http:///
sst12lf09 ds75083b-page 14 ? 2013 microchip technology inc. table 7-1: revision history revision description date a ? initial release of data sheet may 2013 b ? revised ?features? on page 1 ? updated tables 5-2 , 5-3 , 5-5 , 5-6 ? updated figure 6-6 on page 10 and figure 6-9 on page 12 ? changed v dd to v cc throughout ? updated figure 2-1 on page 3 dec 2013 downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 15 sst12lf09 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following informa- tion: product support C data sheets and errata, appli- cation notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of micro- chip sales offices, distributors and factory repre- sentatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a spec- ified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on cus- tomer change notification and follow the registrationinstructions. customer supportusers of microchip products can receive assistanc e through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representa - tive or field application engineer (fae) for support local sales offices are also available to help custom - ers. a listing of sales offices and locations is included i n the back of this document. technical support is available through the web sit e at: http://microchip.com/support downloaded from: http:///
sst12lf09 ds75083b-page 16 ? 2013 microchip technology inc. 8.0 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. p art no. device device: sst12lf09 = 2.4 ghz high-gain, high-efficiency front-end module package: q3ce = x2qfn (2.5mm x 2.5mm), 0.4 max thickness 16-contact evaluation kitflag k = evaluation kit valid combinations: SST12LF09-Q3CE SST12LF09-Q3CE-k xxx package downloaded from: http:///
? 2013 microchip technology inc. ds75083b-page 17 note the following details of the code protection feature on microchip devices: microchip products meet the specification contained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, application maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn:978-1-62077-683-4 information contained in this publication regarding deviceapplications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, includ ing but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchipdevices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. downloaded from: http:///
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