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TB62802AFG 2011-07-15 1 toshiba bi-cmos integrated circuit silicon monolithic TB62802AFG ccd clock drivers the TB62802AFG is a clock distri bution driver for ccd linear image sensors. the ic can functionally drive the ccd input capacitance. it also supports inverted outputs, eliminating the need for cross point control. the ic contains a 1-to-4 clock distribution driver and 4-bit buffer. the suffix (g) appended to the part number represents a lead (pb) -free product. features ? high drivability: in the case of 4-bit distribution driver , guaranteed driving 250 pf load capacitance @fclock = 25 mhz. in the case of 2-bit distribution driver ( only or only) , guaranteed driving 250 pf load capacitance @fclock = 35 mhz. ? operating temperature range: ta = 0c to 60c pin connection (top view) weight: 0.5 g (typ.) 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 out_cont 2b_in cp_in v cc1 gnd1 v cc2 ck_in sh_in rs_in 2b_out cp_out gnd2 sh_out rs_out
TB62802AFG 2011-07-15 2 logic diagram pin description pin no. pin name functions remarks 1 out_cont output control pin internal pull down r=250 k ohm 2 2b_in light load drive input driv er input for ccd last-stage clock 3 cp_in light load drive input ccd clamp gate driver input 4 v cc1 light load power supply ? ? gnd1 light load ground ? 5 v cc2 heavy load power supply ? 6 ck_in heavy load drive input driv er input for ccd transfer clock 7 sh_in light load drive input ccd shift gate driver input 8 rs_in light load drive input ccd reset gate driver input 9 rs_out light load drive output (not inverted) ccd reset gate driver output 10 sh_out light load drive output (not inverted) ccd shift gate driver output 11 heavy load drive output (not inverted) driver output for ccd transfer clock 12 heavy load drive output (inverted) driver output for ccd transfer clock ? gnd2 heavy load ground ? 13 heavy load drive output (inverted) driver output for ccd transfer clock 14 heavy load drive output (not inverted) driver output for ccd transfer clock 15 cp_out light load drive output (not inverted) ccd clamp gate driver output 16 2b_out light load drive output (not inverted) driver output for ccd last-stage clock note1: the internal circuits for heavy load drive pins and have the same configuration as those of light load drive pins rs_out, sh_out, cp_out and 2b_out. thus, these internal circuits have the same characteristics. ck_in cp_out cp_in sh_out sh_in rs_out rs_in 2b_out 2b_in out_cont
TB62802AFG 2011-07-15 3 truth table input output pin name logic pin name logic pin name logic l l h h ck_in h l l l cp_in h cp_out h l l sh_in h sh_out h l l rs_in h rs_out h l l l 2b_in h 2b_out h out_cont h ? ? all output l absolute maximum ratings (ta = 25c) characteristic symbol rating unit power supply voltage v cc ? 0.3 to 6.0 v input voltage v in ? 0.3 to v cc + 0.3 v output voltage v o ? 0.5 to v cc v high level i oh (o) ? 16.0 ma output current excluding other than , outputs low level i ol (o) + 16.0 ma high level i oh ( ) ? 150 ma output current low level i ol ( ) 150 ma storage temperature t stg ? 40 to 150 c junction temperature t j 150 c thermal resistance chip to ambient air ja 83 c/w note2: output current is specified as follows: v oh = 4.0 v, v ol = 0.5 v.
TB62802AFG 2011-07-15 4 operating conditions (ta = 25c) characteristic symbol min typ. max unit power supply voltage v cc 4.7 5.0 5.5 v input voltage v in 0 ? v cc v output voltage v o 0 ? v cc v high level i oh (o) ? ? ? 8.0 ma output current excluding , outputs low level i ol (o) ? ? 8.0 ma high level i oh ( ) ? ? ? 10.0 ma output current low level i ol ( ) ? ? 10.0 ma thermal resistance (chip to case) jc ? 12 ? c/w operating temperature t opr 0 25 60 c input rise/fall time (note3) tri/tfi ? 2.5 5.0 ns note3: there is no hysteresis in the i nput block of this ic. therefore attent ion should be given to the following: a cmos integrated circuit charges and discharges the capacitance load (internal eq uivalent capacitance) of the internal circuit while operating. the charged or discharged current flows in the package of the ic and inductance of transmission line, which causes inductive spike voltage to be generated. when the spike voltage is generated in the reference gnd, it affects th e amplitude of an input signal. the amplitude seems to be fluctuating compared to when no spike voltage is generated in the reference gnd. in this case, some induced spike wa veforms exceed the input threshold level. for low-frequency inputs, the rate at which a spike exceeds the level increases, resulting in unstable output. therefore, do not apply input signals lower than 1 s. when designing a board, be sure to take transmission line inductance into consideration.
TB62802AFG 2011-07-15 5 electrical characteristics dc characteristics (unless otherwise specified, v cc = 4.7 to 5.5 v, ta = 0 to 60c) characteristic symbol test circuit test condition v cc min typ. max unit high v ih 4.7 2.0 ? v cc input voltage low v il 1 4.7 0 ? 0.8 v i oh = ? 50 a 4.7 4.5 ? v cc v oh (o) 2 i oh = ? 8 ma 4.7 3.9 ? v cc i ol = 50 a 4.7 0 ? 0.2 output voltage excluding , outputs v ol (o) 4 i ol = 8 ma 4.7 0 ? 0.7 v i oh = ? 10 ma 4.7 4.5 ? v cc i oh = ? 30 ma 4.7 3.9 ? v cc v oh ( / ) 2,3 i oh = ? 120 ma 4.7 3.0 ? v cc i ol = 50 a 4.7 0 ? 0.3 i ol = 30 ma 4.7 0 ? 0.5 output voltage v ol ( / ) 4,5 i ol = 120 ma 4.7 0 ? 2.0 v i in1 v in (2,3,6,7,8pin) = v cc or gnd 5.5 ? 1.0 ? 1.0 input voltage i in2 6 v in(1pin) = v cc or gnd 5.5 ? ? 35 a total i cc 7 for light load output, all bits are high. for heavy load output, 2 bits are high. 2 bits are low. 5.5 ? ? 15.0 forced low for all bits i ccl ? out_cont = ?h? 5.5 ? ? 30.0 static current consumption each bit i cc 8 one input : v in = 0.5 v or v cc ? 2.1 v other inputs : v in = v cc or gnd ? ? ? 1.5 ma output off mode supply voltage v por (note 4) light load power supply (v cc1 ) reference ? ? 3.0 ? v note4: refer to the description of the p.o.r below. mode in which output is held at low at power-on (p.o.r: p ower o n r eset circuit) to eliminate the unstable period for the internal logic, th is ic incorporates a function for monitoring the light load power supply (v cc1 ) at power-on to maintain the outputs at low. ? at power-on, all output are held at low until light load power supply (v cc1 ) reaches the voltage level of 3 v. ? when the light load power supply (v cc1 ) voltage is higher than 3 v (typ.), the internal logic operates according to input signals. ? for normal operation, be sure to use a power supply of 4.7 v or higher as guaranteed. power v cc dut output signal waveform pulse generator p.o.r test circuit gnd supply voltage 3 v output signal waveform v cc time low level state refer to subsection 10. ?propagation delay time? in ac parameters.
TB62802AFG 2011-07-15 6 ac characteristics (input transition rise or fall time: t r /t f = 3.0 ns) ta = 25c, v cc = 5.0 v ta = 0 to 60c v cc = 4.7 to 5.5 v characteristic symbol test condition min typ. max min max unit reference measurement diagram tplh ( ) 10.8 5 16 tphl ( ) c l = 250 pf 9.8 5 16 measurement diagram 1 tplh (o) 6.0 2 10 propagation delay time tphl (o) c l = 20 pf 6.2 2 12 ns measurement diagram 2 tpclh ( ) 11.5 5 19 tpchl ( ) c l = 250 pf 10.5 5 19 measurement diagram 3 tpclh (o) 8.5 2 19 output off time tpchl (o) c l = 20 pf 12.0 2 23 ns measurement diagram 4 light load drive output skew to (skw) c l = 20 pf 0 ? 2.0 0 2.0 ns measurement diagram 5 heavy load drive output crosspoints vt (crs) c l = 100 to 250 pf 1.5 ? ? 1.5 ? v measurement diagram 6 cpd ( ) ? 32 ? ? ? equivalent internal capacitance (note5) cpd (o) ? 9.4 ? ? ? pf note 5: cpd denotes ?power dissipation capacitance?. dynamic power dissipation can be calculated using the cpd value. pd = [cpd v cc 2 fin] + (cl v cc 2 fout) cl: load capacitance per output cpd: power dissipation capacitance fin: input clock frequency fout: output clock frequency for example: for heavy load drive output, driving a load capacity of 250 pf at 25 mhz; for light load drive output, driving a load capacity of 20 pf at 25 mhz. note 6: in practice, the frequencies of some shift gate control signals are lower than the transfer clock. therefore the power dissipation during practical use is smaller than the calculated value below. pd = [32 pf 5.0 v 5.0 v 25 mhz] 4 bit + (250 pf 5.0 v 5.0 v 25 mhz) 4 bit + [9.4 pf 5.0 v 5.0 v 25 mhz] 4 bit + (20 pf 5.0 v 5.0 v 25 mhz) 4 bit ? 778 mw the typical power dissipation is approximately 778 mw. notes on system design as shown above, the TB62802AFG consumes high current while operating. there is temporary flow of a current greater than the calculated value. to suppress bouncin g from the power supply and gnd, decoupling for the power supply is a vital necessity. below is an example of how the capacita nce of a decoupling capacitor is calculated. be sure to refer to this when designing a system. the decoupling capacitor should be placed underneat h the ic to reduce the high-frequency components. supply current variable: 350 ma (estimated variable in 1 bit) supply voltage variable: 0.3 v noise pulse width: 10 ns (time in which fluctuation occurs) c = i cc /( v/ t) = 350 ma 4 bit/(0.3 v/10 ns) ? 47 nf ? 0.047 f (when using a normal capacitor) to control the fluctuation in the low-frequency compon ents, it is recommended that the power supply on the board be decoupled using a 10 f to 50 f capacitor.
TB62802AFG 2011-07-15 7 waveform measuring point propagation delay time setting input signal ?2b_in ?ck_in ?sh_in ?rs_in ?cp_in ?out_cont=l measurement diagram 1 ? output signal ? output signal measurement diagram 2 ?2b_out ?ck_out ?sh_out ?rs_out ?cp_out input signal ?2b_in ck_in sh_in rs_in cp_in h ?out_cont measurement diagram 3 ? output signal measurement diagram 4 ?2b_out ?ck_out ?sh_out ?rs_out ?cp_out measurement diagram 5 ?2b_out ?ck_out ?sh_out ?rs_out ?cp_out 10% 90% 1.5 v tri 10% 90% 1.5 v tfi gnd 3.0 v v cc ? 0.5 v tplh ( ) tphl ( ) gnd + 0.5 v tphl ( ) tplh ( ) v cc ? 0.5 v gnd + 0.5 v v cc ? 0.5 v tplh (o) tphl (o) gnd + 0.5 v v cc gnd v cc gnd v cc gnd v cc gnd to (skw) to (skw) 10% 90% 1.5 v tri 90% 1.5 v tfi gnd 3.0 v tcphl ( ) tcplh ( ) v cc ? 0.5 v gnd + 0.5 v v cc gnd tcphl (o) tcplh (o) v cc ? 0.5 v gnd + 0.5 v v cc gnd
TB62802AFG 2011-07-15 8 output waveform crosspoint/level setting measurement diagram 6 ? output signal ? output signal v ol v t (crs) v oh gnd
TB62802AFG 2011-07-15 9 reference characteristics load capacitance vs. power dissipation 0 0.2 0.4 0.6 0.8 1 1.2 0 50 100 150 200 250 300 350 load capacitance pf power dissipation w drive frequency 25mhz all bits are driven at the same frequency supply voltage 5v light load capacitance 20pf light load internal equivalent capacitance9.4pf heavy load internal equivalent capacitance32pf ambient temperature 25 drive frequency vs. power dissipation 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 5 10 15 20 25 30 drive frequencymhz power dissipation w light load internal equivalent capacitance9.4pf heavy load internal equivalent capacitance32pf light load capacitance 20pf heavy load capacitance 250pf supply voltage 5v drive frequency of light load and heavy load are the same frequency drive frequency vs. tj ta=25 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 drive frequencymhz tj light load internal equivalent capacitance9.4pf heavy load internal equivalent capacitance32pf light load capacitance 20pf heavy load capacitance 250pf supply voltage 5v drive frequency of light load and heavy load are the same frequency ja83.3/wtypical value for the ic itself)
TB62802AFG 2011-07-15 10 propagation delay time dependence on light load capacitance 2 3 4 5 6 7 8 0 5 10 15 20 25 load capacitancef propagation delay timens lh(o) tphl(o) propagation delay time dependence on heavy load capacitance 2 3 4 5 6 7 8 9 10 11 50 100 150 200 250 300 load capacitancepf propagation delay timens tphl(? tphl(b) tplh(b) tplh)
TB62802AFG 2011-07-15 11 test circuit dc parameters pins marked with an asterisk ( ? ) are test pins. be sure to ground thos e input pins that are not used as test pins so that the logic is determined. unless otherwise spec ified, bits of the same type are measured in the same way. 1. v ih /v il (1) light load drive bits note 7: when measuring input pins, connect to gnd those input pins that are not being measured. (2) heavy load drive bits note 8: connect to gnd those input pins that are not being measured. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v 0 to v cc 20 pf e.g., oscilloscope ? ? ? ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v 0 to v cc 250 pf e.g., oscilloscope ?
TB62802AFG 2011-07-15 12 2. v oh (o/ ) note 9: connect to gnd those input pins that are not being measured. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? ? v o output: ? 8 ma output: ? 120 ma ? ? ? ?
TB62802AFG 2011-07-15 13 3. v oh ( ) note 10: connect to gnd those input pins that are not being measured. 4. v ol (o/ ) note 11: connect to gnd those input pins that are not being measured. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? v output: ? 120 ma ? 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? v o output: 8 ma output: 120 ma ? ? ? ? ? 4.7 v
TB62802AFG 2011-07-15 14 5. v ol ( ) note12: connect to gnd those input pins that are not being measured. 6. i in note13: connect to gnd those input pins that are not being measured. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 5.5 v ? ? ? ? ? ? 5.5 v a a 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 4.7 v ? v output: 120 ma ? 4.7 v
TB62802AFG 2011-07-15 15 7. i cc note 14: the input logic of the heavy load drive clock input pin (pin 6) is the same for high or low. 8. i cc note 15: when measuring input pins, connect to gnd (or to the power supply) those input pins that are not being measured. 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 v or 5.5 v ? ? 5.5 v a 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0.5 v or v cc ? 2.1 v ? ? v cc a
TB62802AFG 2011-07-15 16 ac parameters pins marked with an asterisk ( *) are test pins. ground those input pins th at are not being used as test pins so that the logic is determined. unless otherwise specified, bits of the same type are measured in the same way. 9. propagation delay time (1) light load drive bits (2) heavy load drive bits 20 pf e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 0 to 3 v p-p ? ? v cc ? ? 250 pf e.g., oscilloscope 1 2 3 4 16 5 6 7 8 15 14 13 12 11 10 9 ? ? v cc ? ? 0 to 3 v p-p
TB62802AFG 2011-07-15 17 package dimensions weight: 0.5 g (typ.)
TB62802AFG 2011-07-15 18 notes on contents 1. block diagrams some of the functional blocks, circu its, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especia lly at the mass produc tion design stage. toshiba does not grant any license to any industrial property rights by prov iding these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the devi ce characteristics. these components and circuits are not guaranteed to prev ent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum rating s, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large curren t to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negati ve current resulting from the back electromotive force at power off. ic breakdown may cause in jury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative term inals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
TB62802AFG 2011-07-15 19 (5) carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, over cu rrent or ic failure can ca use smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat ev en during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, dete rioration of ic characterist ics or ic breakdown. in addition, please design the device taking into co nsiderate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply an d output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design. about solder ability, following conditions were confirmed ? solder ability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux
TB62802AFG 2011-07-15 20 restrictions on product userestrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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