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1. product profile 1.1 general description high power density, standard switching time pn-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead sod123w surface-mounted device (smd) plastic package. 1.2 features and benefits ? forward current i f 1 a ? reverse voltage v r 400 v ? standard switching time ? low forward voltage ? low reverse current ? low inductance ? small and flat lead smd plastic package ? package height typ. 1 mm ? high power capability ? aec-q101 qualified 1.3 applications ? general-purpose rectification ? reverse polarity protection ? standard switching applications 1.4 quick reference data [1] device mounted on a ceramic printed-circuit board (pcb), al 2 o 3 , standard footprint. pns40010er 400 v, 1 a high power densit y, standard switching time pn-rectifier rev. 2 ? 21 august 2012 product data sheet sod123w table 1. quick reference data symbol parameter conditions min typ max unit i f forward current t sp 160c --1.4a v rrm repetitive peak reverse voltage - - 400 v v r reverse voltage - - 400 v i fsm non-repetitive peak forward current t j(init) =25c; t p = 8 ms; square wave - - 32 a v f forward voltage i f =1a; t p 300 s; ? 0.02 ; t j =25c - 0.93 1.1 v i f(av) average forward current = 0.5 ; f = 20 khz; t amb 115 c; square wave [1] --1a = 0.5 ; f = 20 khz; t sp 170 c; square wave --1a
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 2 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 2. pinning information 3. ordering information 4. marking table 2. pinning information pin symbol description simplified outline graphic symbol 1 k cathode sod123w 2 a anode 2 1 006aab040 2 1 table 3. ordering information type number package name description version pns40010er sod123w plastic surface mounted package; 2 leads sod123w table 4. marking codes type number marking code pns40010er eh
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 3 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 5. limiting values [1] device mounted on a ceramic printed-circuit board (pcb), al 2 o 3 , standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [4] device mounted on a ceramic pcb, ai 2 o 3 , standard footprint. 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [3] device mounted on an fr4 pcb, ai 2 o 3 , standard footprint. [4] soldering point of cathode tab. table 5. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage - 400 v v r reverse voltage - 400 v v rms rms voltage - 280 v i f forward current t sp 160 c - 1.4 a i f(av) average forward current = 0.5 ; f = 20 khz; square wave; t amb 115 c [1] -1a = 0.5 ; f = 20 khz; t sp 170 c; square wave -1a i fsm non-repetitive peak forward current square wave; t j(init) =25c; t p =8ms - 32 a p tot total power dissipation t amb 25 c [2] - 750 mw [3] - 1300 mw [4] - 2300 mw t j junction temperature - 175 c t amb ambient temperature -55 175 c t stg storage temperature -65 175 c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - - 200 k/w [2] --115k/w [3] --65k/w r th(j-sp) thermal resistance from junction to solder point [4] --15k/w
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 4 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier fr4 pcb, standard footprint fig 1. transient thermal impedance from junction to ambient as a function of pulse duration; typical values fr4 pcb, mounting pad for cathode 1 cm 2 fig 2. transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-003979 10 1 10 2 10 3 z th(j-a) (k/w) 10 -1 t p (s) 10 -3 10 2 10 3 10 1 10 -2 10 -1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.02 0.01 0 0.05 aaa-003980 10 1 10 2 10 3 z th(j-a) (k/w) 10 -1 t p (s) 10 -3 10 2 10 3 10 1 10 -2 10 -1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.02 0.01 0 0.05
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 5 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 7. characteristics ceramic pcb, al 2 o 3 , standard footprint fig 3. transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-003981 10 1 10 2 10 3 z th(j-a) (k/w) 10 -1 t p (s) 10 -3 10 2 10 3 10 1 10 -2 10 -1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.02 0.01 0 0.05 table 7. characteristics symbol parameter conditions min typ max unit v f forward voltage i f = 0.5 a; t p 300 s; ? 0.02 ; t j =25c - 0.89 1.05 v i f = 0.7 a; t p 300 s; ? 0.02 ; t j =25c - 0.91 1.07 v i f =1a; t p 300 s; ? 0.02 ; t j =25c - 0.93 1.1 v i f = 0.5 a; t p 300 s; ? 0.02 ; t j = 125 c - 0.76 0.92 v i f = 0.7 a; t p 300 s; ? 0.02 ; t j = 125 c - 0.78 0.95 v i f =1a; t p 300 s; ? 0.02 ; t j = 125 c - 0.81 0.98 v i f =1a; t p 300 s; ? 0.02 ; t j =-40c - 1.01 1.18 v i f =1a; t p 300 s; ? 0.02 ; t j = 150 c - 0.78 0.95 v i f =1a; t p 300 s; ? 0.02 ; t j = 175 c - 0.75 0.92 v
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 6 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier i r reverse current v r =400v; t j = -40 c - 0.1 10 na v r =400v; t j = 25 c - 0.001 1 a v r =400v; t j = 125 c - 1 50 a v r =400v; t j = 150 c - 5 250 a v r =400v; t j = 175 c - 10 500 a c d diode capacitance v r = 4 v; f = 1 mhz; t amb =25c - 8 20 pf t rr reverse recovery time i f = 0.5 a; i r =1a; i r(meas) =0.25a; t amb =25c -0.81.8s table 7. characteristics ?continued symbol parameter conditions min typ max unit (1) t j = 175 c (2) t j = 150 c (3) t j = 125c (4) t j = 85 c (5) t j = 25 c (6) t j = ? 40 c (1) t j = 175 c (2) t j = 150 c (3) t j = 125 c (4) t j = 85 c (5) t j = 25 c (6) t j = ? 40 c fig 4. forward current as a function of forward voltage; typical values fig 5. reverse current as a function of reverse voltage; typical values aaa-003982 v f (v) 0.0 1.5 1.0 0.5 10 -2 10 -3 1 10 -1 10 i f (a) 10 -4 (1) (2) (3) (4) (5) (6) aaa-003983 10 -4 10 -5 10 -6 10 -7 10 -8 10 -9 10 -10 10 -11 i r (a) 10 -12 v r (v) 0 400 300 100 200 (1) (2) (3) (4) (5) (6)
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 7 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier f = 1 mhz; t amb = 25 c t amb = 25 c fig 6. diode capacitance as a function of reverse voltage; typical values fig 7. non-repetitive peak forward current as a function of pulse duration; typical values t j = 175 c (1) = 0.1 (2) = 0.2 (3) = 0.5 (4) = 1 t j = 175 c (1) = 1 (2) = 0.9 (3) = 0.8 (4) = 0.5 fig 8. average forward power dissipation as a function of average forward current; typical values fig 9. average reverse power dissipation as a function of reverse voltage; typical values v r (v) 0 400 300 100 200 aaa-003984 10 5 15 20 c d (pf) 0 t p (s) 10 2 10 4 10 3 aaa-003985 10 2 10 3 i fsm (a) 10 i f(av) (a) 0.0 1.5 1.0 0.5 aaa-003986 0.4 0.8 1.2 p f(av) (w) 0.0 (1) (2) (3) (4) v r (v) 0 400 300 100 200 aaa-003987 1.5 3.0 4.5 p r(av) (mw) 0.0 (1) (2) (3) (4)
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 8 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier fr4 pcb, standard footprint t j = 175 c (1) = 1 (dc) (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fr4 pcb, mounting pad for cathode 1 cm 2 t j = 175 c (1) = 1 (dc) (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 10. average forward current as a function of ambient temperature; typical values fig 11. average forward current as a function of ambient temperature; typical values ceramic pcb, al 2 o 3 , standard footprint t j = 175 c (1) = 1 (dc) (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz t j = 175 c (1) = 1 (dc) (2) = 0.5; f = 20 khz (3) = 0.2; f = 20 khz (4) = 0.1; f = 20 khz fig 12. average forward current as a function of ambient temperature; typical values fig 13. average forward current as a function of solder point temperature; typical values t amb (c) 0 200 150 50 100 aaa-003988 0.5 1.0 1.5 i f(av) (a) 0.0 (1) (2) (3) (4) t amb (c) 0 200 150 50 100 aaa-003989 0.5 1.0 1.5 i f(av) (a) 0.0 (1) (2) (3) (4) t amb (c) 0 200 150 50 100 aaa-003990 0.5 1.0 1.5 i f(av) (a) 0.0 (1) (2) (3) (4) t sp (c) 0 200 150 50 100 aaa-003991 0.5 1.0 1.5 i f(av) (a) 0.0 (1) (2) (3) (4)
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 9 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 8. test information the current ratings for the ty pical waveforms are calculated according to the equations: i f(av) = i m with i m defined as peak current, i rms = i f(av) at dc, and i rms = i m ? with i rms defined as rms current. 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualific ation for discrete semiconductors, and is suitable for use in automotive applications. fig 14. reverse recovery time: test circuit and waveforms fig 15. duty cycle definition t rr (1) + i f t output signal t r t p t 10 % 90 % v r input signal v = v r + i f r s r s = 50 i f d.u.t. r i = 50 sampling oscilloscope mga881 t p t cy p t 006aac658 duty cycle = t p t cy
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 10 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 9. package outline 10. soldering fig 16. package outline sod123w 08-11-06 dimensions in mm 2.8 2.4 3.7 3.3 1.05 0.75 1.9 1.5 1 2 0.6 0.3 0.22 0.10 1.1 0.9 fig 17. reflow soldering footprint for sod123w 2.9 2.8 4.4 1.62.1 1.2 (2) 1.1 (2) solder lands solder resist occupied area solder paste 1.1 (2) 1.2 (2) sod123w_fr dimensions in mm
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 11 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 11. revision history table 8. revision history document id release date data sheet status change notice supersedes pns40010er v.2 20120821 product data sheet - pns40010er v.1 modifications: ? data sheet status updated pns40010er v.1 20120615 preliminary data sheet - -
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 12 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at urlhttp://www.nxp.com . 12.2 definitions preview ? the document is a preview version only. the document is still subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any re presentations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and r eplaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the document status [1] [2] product status [3] definition objective [short] data sheet development this document contai ns data from the objective spec ification for product developmen t. preliminary [short] data sheet qua lification this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the pr oduct specification.
pns40010er all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 21 august 2012 13 of 14 nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms an d conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from competent authorities. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey, g reenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pns40010er 400 v, 1 a high power density, standard switching time pn-rectifier ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 21 august 2012 document identifier: pns40010er please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 6 thermal characteristics . . . . . . . . . . . . . . . . . . .3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . .9 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . .9 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 legal information. . . . . . . . . . . . . . . . . . . . . . . .12 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 13 contact information. . . . . . . . . . . . . . . . . . . . . .13

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