TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 1 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ir receiver modules for remote control systems ordering code taping: TSSP57038tt1 - top view taped TSSP57038tt2 - top view taped applications ? reflective sensors for hand dryers, towel or soap dispensers, water fa ucets, toilet flush ? vending machine fall detection ? security and pet gates ? person or object vicinity activation features ? up to 2 m for presence sensing ? uses modulated bursts at 38 khz ? 940 nm peak wavelength ? pin diode and sensor ic in one package ? low supply current ? shielding against emi ? visible light is suppressed by ir filter ? insensitive to supply voltage ripple and noise ? supply voltage: 2.5 v to 5.5 v ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 description the TSSP57038 is a compact infrared detector module for presence sensing applications. it receives 38 khz modulated signals and has a pe ak sensitivity of 940 nm. this component has not been qualified according to automotive specifications. block diagram presence sensing 22531-1 parts table carrier frequency 38 khz TSSP57038 package belobog pinning 1 = out, 2, 3, 6, 7, 8 = gnd, 4, 5 = v s dimensions (mm) 3.95 w x 3.95 h x 0.8 d mounting smd application presence sensors 33 k v s out demo- gnd pass amp input pin band dulator 4, 5 1 2, 3, 6, 7, 8 20445-7 +3 v ir emitter +3 v 38 khz envelope s ignal out to c
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 2 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress ratin g only and functional operation of the device at these or any other cond itions beyond those indicated in the operational sections of t his specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect the device reliability. absolute maximum ratings parameter test condition symbol value unit supply voltage v s -0.3 to +6 v supply current i s 5ma output voltage v o -0.3 to (v s + 0.3) v output current i o 5ma junction temperature t j 100 c storage temperature range t stg -25 to +85 c operating temperature range t amb -25 to +85 c power consumption t amb 85 c p tot 10 mw soldering temperature t 10 s, 1 mm from case t sd 260 c electrical and optical characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit supply current (pin 3) e v = 0, v s = 5 v i sd 0.55 0.7 0.9 ma e v = 40 klx, sunlight i sh -0.8-ma supply voltage v s 2.5 - 5.5 v transmission distance e v = 0, test signal see fig. 1, ir diode tsal6200, i f = 400 ma d-25-m output voltage low (pin 1) i osl = 0.5 ma, e e = 2 mw/m 2 , test signal see fig. 1 v osl - - 100 mv minimum irradiance pulse width tolerance: t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e min. -0.71.2mw/m 2 maximum irradiance t pi - 5/f o < t po < t pi + 6/f o , test signal see fig. 1 e e max. 50 - - w/m 2 directivity angle of half transmission distance ? 1/2 - 75- deg
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 3 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - output active low fig. 2 - pulse length and se nsitivity in dark ambient fig. 3 - output function fig. 4 - output pulse diagram fig. 5 - frequency depe ndence of responsivity fig. 6 - sensitivity vs. ambient temperature 16110 e e t t pi * t * t pi 10/f 0 is recommended for optimal function v o v oh v ol t optical test signal (ir diode tsal6200, i f = 0.4 a, 30 pulses, f = f 0 , t = 10 ms) output signal t d 1) t po 2) 1) 7/f 0 < t d < 15/f 0 2) t pi - 5/f 0 < t po < t pi + 6/f 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 1000 10 000 100 000 t po - output pul s e width (m s ) e e - irradiance (mw/m 2 ) output pul s e width input bur s t length = 950 nm, optical te s t s ignal, fig. 1 e e t v o v oh v ol t 600 s 600 s t = 60 ms t on t off 94 8134 optical test signal output signal , (see fig. 4) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 1 10 100 1000 10 000 t on , t off - output pul s e width (m s ) e e - irradiance (mw/m 2 ) t on t off = 950 nm, optical te s t s ignal, fig. 3 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.7 0.9 1.1 1.3 f/f 0 - relative frequency 16925 f = f 0 5 % f(3 db) = f 0 /10 e /e - rel. responsivity e min. e 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -30 -10 10 30 50 70 90 e e min. - thre s hold irradiance (mw/m 2 ) t amb - ambient temperature ( c)
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 4 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 7 - sensitivity vs. supply voltage fig. 8 - relative spectral sensitivity vs. wavelength fig. 9 - horizontal directivity the typical application of this device is a reflective or beam break sensor with active lo w detect or no detect information contained in its ou tput. applications requiring up to 2 m beam break or 1 m reflective range benefit from the lower gain of these sensors because they are less sensitive to stray signal from the emitter, simplifying the mechanical design. example for a sensor hardware: there should be no common window in front of the emitter and detector in order to avoi d crosstalk via guided light through the window. 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2 3 4 5 e e min. - s en s itivity (mw/m 2 ) v s - s upply voltage (v) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 750 800 850 900 950 1000 1050 1150 - wavelength (nm) s( ) rel - relative spectral sensitivity 1100 0.1 0.3 0.5 0.7 0.9 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 21947 emitter t s al6200 ir receiver t ss p6p38 s eparation to avoid cro ss talk by s tray light in s ide the hou s ing
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 5 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters 0.8 0.15 3.95 3.95 (2.75) 0.55 (0.95) 0.55 (1.8) pinning from topview gnd gnd out vs (vs) (gnd) (gnd) (gnd) 0.75 0.05 4 x 0.75 = 3 0.35 0.05 (8 x) 1.5 3 (0.3) (0.3) (0.3) (0.7) (1.9) (3.4) not indicated tolerances 0.1 specifications according to din technical drawings all dimensions in mm drawing-no.: 6.550-5315.01-4 issue: 2; 12.02.14 marking area drawing refers to following types: tsop37... / tsop57... proposed pad layout from component side (dim. for reference only) (3.95) (3.95) (0.35) (0.8) (2.75) (3) (4 x) (4x) 1 2 3 4 5 8 7 6 0.475 (0.4) pin 1 identification pin 1 identification optically effective area (1) (1) (2) (2) (2) (2) (2) pins connected internally. it is not necessary to connect externally. (1) (1)
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 6 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 assembly instructions reflow soldering ? reflow soldering must be done within 168 h while stored under a max. tempera ture of 30 c, 60 % rh after opening the dry pack envelope ? set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. exercise extreme care to keep the maximum temperature below 260 c. the temperature shown in the profile means th e temperature at the device surface. since there is a temperature difference between the component and the circuit bo ard, it should be verified that the temperature of the device is accurately being measured ? handling after reflow should be done only after the work surface has been cooled off manual soldering ? use a soldering iron of 25 w or less. adjust the temperature of the sold ering iron below 300 c ? finish soldering within 3 s ? handle products only after the temperature has cooled off vishay lead (pb)-free reflow solder profile note (1) moq: minimum order quantity ordering information ordering code packaging volume (1) remarks TSSP57038..tt1 tape and reel moq: 1800 pcs 3.95 mm x 3.95 mm x 0.75 mm TSSP57038..tt2 moq: 7000 pcs 0 50 100 150 200 250 300 0 50 100 150 200 250 300 t (s) t (c) 255 c 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 20 s max. ramp up 3 c/s max. ramp down 6 c/s max. 2 cycles allowed 19800
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 7 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping version TSSP57038 dimensions in millimeters leader and trailer tape: part s mounted empty trailer 200 mm min. empty leader 400 mm min. direction of pulling out unreel direction ? 60 min. ? y 2 0.5 label po s ted here coming out from reel tape po s ition (12.4) 18.4 max. ? 13 0.2 ? 21 0.8 100 mm min. with cover tape x 2:1 tape and reel dimen s ion s : (2) (1.75) (5.5) 12 0.3 (8) (4) (? 1.5) (0.3) reel s ize "y" tt1 ? 180 2 = 1800 pc s . tt2 ? 330 2 = 7000 pc s . (1.2) technical drawing s according to din s pecification s not indicated tolerance s 0.1 drawing-no.: 9.700-5347.01-4 i ss ue: 1; 14.11.11
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 8 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 label standard bar code labels for finished goods the standard bar code labels are product labels and used for identification of goods. the finished goods are packed in final packing area. the standard packing units are labeled with standard bar code labels be fore transported as finished goods to warehouses. the labels are on each packing unit and contain vishay semicond uctor gmbh specific data. dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed in to a cardboard box. a secondary cardboard box is used for shipping purposes. recommended method of storage dry box storage is recommended as soon as the aluminum bag has been opened to preve nt moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 168 h under these conditions moisture content will be too high for reflow soldering. in case of moisture absorptio n, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c / - 0 c and < 5 % rh (dry air / nitrogen) or 96 h at 60 c + 5 c and < 5 % rh for all device containers or 24 h at 125 c + 5 c not suitable for reel or tubes. an eia jedec ? standard j-std-020 level 3 label is included on all dry bags. vishay semiconductor gmbh standard bar code product label (finished goods) plain writing abbreviation length item-description -18 item-n u mber ino 8 selection-code sel 3 lot-/serial-n u mber batch 10 data-code cod 3 (yww) plant-code ptc 2 q u antity qty 8 accepted by acc - packed by pck - mixed code indicator mixed code - origin xxxxxxx+ company logo long bar code top type length item-n u mber n8 plant-code n2 se qu ence-n u mber x3 q u antity n8 total length -21 short bar code bottom type length selection-code x3 data-code n3 batch-n u mber x10 filter -1 total length -17 aluminum bag label reel 15973
TSSP57038 www.vishay.com vishay semiconductors rev. 1.5, 02-sep-15 9 document number: 82482 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 eia jedec standard j- std-020 level 3 label is included on all dry bags esd precaution proper storage and handling pro cedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electrostatic sensitive devices warning la bels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors st andard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. bar code product label (example) 1. calculated shelf life in sealed bag: 12 months at <40c and <90% relative humidity (rh) 3. after bag is opened, devices that will be subjected to reflow solder or other high temperature process must be 4. devices require bake, before mounting, if: a) humidity indicator card reads > 10% for level 2a - 5a devices or >60% for level 2 devices when read at 235c b) 3a or 3b are not met 5. if baking is required, refer to ipc/jedec j-std-033 for bake procedure 2. peak package body temperature:_______________________c if blank, see adjacent bar code label a) mounted within:___________________hours of factory conditions 30c/60% rh, or b) stored per j-std-033 if blank, see adjacent bar code label bag seal date:_________________________________________ if blank, see adjacent bar code label note: level and body temperature defined by ipc/jedec j-std-020 this bag contains moisture-sensitive devices caution if blank, see adjacent bar code label 3 level 260 168 22650 22178
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