this is information on a product in full production. january 2013 doc id 023686 rev 1 1/10 10 ESDALC5-4BN4 4-line bidirectional transil?, transient voltage surge suppressor for esd protection datasheet ? production data features 4 bidirectional transil diodes breakdown voltage v br = 5.5 v min. low leakage current < 60 na very small pcb area: 0.8 mm2 400 m pitch micro-package lead-free and rohs package complies with the following standards iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: mobile phones portable multimedia devices and accessories computers, tablets and peripherals set top boxes audio equipment description the ESDALC5-4BN4 is a monolithic array designed to protect up to 4 bidirectional lines against esd transients. the device is ideal for applications where both reduced printed circuit board space and high esd protection levels are required. figure 1. functional diagram (top view) qfn-4l gnd i/o1 i/o2 i/o3 i/o4 www.st.com
characteristics ESDALC5-4BN4 2/10 doc id 023686 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 2. electrical characteristics (values, t amb = 25 c) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage, iec 61000-4-2, level 4: contact discharge air discharge 30 30 kv i pp peak pulse current (8/20 s) 4 a p pp peak pulse power dissipation (8/20 s) (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. gnd to i/o 60 w t j operating junction temperature range -40 to 125 c t stg storage temperature range -65 + 150 c t l maximum lead temperature for soldering during 10 s 260 c symbol test conditions min. typ. max. unit v br i r = 1 ma, i/o to gnd 11 13 v i r = 1 ma, gnd to i/o 5.5 8 i rm v rm = 5 v 160na v cl i pp = 1 a, 8/20 s, i/o to gnd 18 v i pp = 1 a, 8/20 s, gnd to i/o 14.5 c line v r = 0 v, f = 1 mhz, v osc = 30 mv 13 15 pf symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current br rm rm rm pp v = clamping voltage cl
ESDALC5-4BN4 characteristics doc id 023686 rev 1 3/10 figure 3. leakage current versus junction temperature (typical values) figure 4. junction capacitance versus reverse voltage applied (typical values) i r (na) 0,01 0,1 1 10 100 25 50 75 100 125 150 vr=5v io/gnd gnd/io t j (c) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0123456 t j =25c io/gnd io/io v r (v) c ( p f) figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 10 v/div 20 ns/div 30 ns 60 ns 100 ns 41 v 17 v 18 v 14 v 10 v/div 20 ns/div 30 ns 60 ns 100 ns -36 v -11 v -12 v -8 v figure 7. s21 attenuation measurements fi gure 8. analog crosstalk measurements between channels s21 (db) 100k 1m 10m 100m 1g 10g -36 -33 -30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0 average performance (50 system) pass band attenuation 0.05 db - 3 db point 484 mhz attenuation (0.8? 4ghz) >6 db 7 db @ 900 mhz 15 db @ 1.8 ghz f/hz 100k 1m 10m 100m 1g 10g -120 -110 -100 - 90 -80 -70 -60 -50 -40 -30 -20 -10 0 average performance (50 system) attenuation @ 1mhz 100 db attenuation @ 100mhz 66 db min attenuation @ hz 33 db @ 6 ghz db f/hz
ordering information scheme ESDALC5-4BN4 4/10 doc id 023686 rev 1 2 ordering information scheme figure 9. ordering information scheme esda lc 5 4 b n4 esd array low capacitance package 5 = 5.5 volts min 4 = 4 lines b = bidirectional breakdown voltage number of lines direction n4 = qfn-4l
ESDALC5-4BN4 package information doc id 023686 rev 1 5/10 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. qfn- 4l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.31 0.38 0.40 0.012 0.015 0.016 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.10 0.15 0.20 0.004 0.006 0.008 d 0.70 0.80 0.90 0.028 0.031 0.035 d2 0.50 0.58 0.65 0.020 0.023 0.026 e 0.35 0.40 0.45 0.014 0.016 0.018 e 0.90 1.00 1.10 0.035 0.039 0.043 e2 0.15 0.20 0.25 0.006 0.008 0.010 l 0.18 0.23 0.28 0.007 0.009 0.011 l1 0.00 - 0.05 0.00 - 0.002 figure 10. footprint dimensions (in mm) figure 11. marking a a1 d e d2 e e2 l1 b l 1 4 2 3 index area 0.4 0.43 0.2 0.18 0.17 0.58 0.58 1.4 l
package information ESDALC5-4BN4 6/10 doc id 023686 rev 1 figure 12. tape and reel specifications dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 2.0 2.0 8.0 1.75 3.5 ? 1.55 0.63 0.89 0.22 1.07 l l l l l l l
ESDALC5-4BN4 recommendation on pcb assembly doc id 023686 rev 1 7/10 4 recommendation on pcb assembly 4.1 stencil opening design reference design stencil opening thickness: 100 m stencil opening for leads: opening to footprint ratio is 100%. figure 13. recommended stencil window position 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 180 m footprint footprint t=100 m and opening ratio is 100% 580 m 200 m 430 m stencil window
recommendation on pcb assembly ESDALC5-4BN4 8/10 doc id 023686 rev 1 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ESDALC5-4BN4 ordering information doc id 023686 rev 1 9/10 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDALC5-4BN4 l (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location qfn-4l 0.77 mg 10 000 tape and reel table 5. document revision history date revision changes 18-jan-2013 1 initial release.
ESDALC5-4BN4 10/10 doc id 023686 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
|
