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z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com specification KWT803 - s ssc customer drawn approval approval
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com contents 1. description 2. absolute maximum ratings 3. electro - optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicone resin leds
z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com KWT803 - s features applications 1. description thi s surface - mount led comes i n plcc s t a n d a r d p a c k a ge di m e n si on . it h a s a su bst rat e m ade u p of a m ol de d pl asti c reflector sitting on top of a bent lead frame . the die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range 40 to 100 . ? white colored smt package ? ingan material ? suitable for all smt assembly and soldering methods ? pb - free reflow soldering application ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting ? white back - light
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings [1] 3. electro - optical characteristics [note] all measurements were made under the standardized environment of ssc. parameter symbol value unit power dissipation p d 111 mw forward current i f 30 ma operating temperature t opr - 40~+85 storage temperature t stg - 40~+100 junction temperature t j 125 parameter symbol condition min. typ. max. unit forward voltage* v f i f =20ma 2.9 3.2 3.4 v reverse current i r v f =5v - - 10 a luminous intensity* [1] i v i f =20ma 1,700 - 2,650 mcd color temperature cct i f =20ma 5,300 - 8,900 k viewing angle [2] 2 1/2 i f =20ma - 115 - deg. color rendering index* ra i f =20ma 62 68 - - esd (hbm) 1.5k ? ;100p f 1 - - kv thermal resistance [3] r th js i f =20ma 76 oc/w [1] the luminous intensity iv was measured at the peak of the spatial pattern which may not be alig ned with the mechanical axis of the led package. [2] 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: r th js (junction / solder) * tolerance : v f : 0.05v, i v : 10%, ra : 3, x,y : 0.01 [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the pr oduct. * leds properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com -90 -60 -30 90 60 30 0 ( t a = 25 o c ) forward current vs . forward voltage relative luminous intensity vs . forward current 0 10 20 30 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 forward voltage v f (v) forward current i f [ma] relative luminous intensity [ % ] forward current i f [ma] 4. optical characteristics -25 0 25 50 75 100 0 5 10 15 20 25 30 35 forward current i f [ma] ambient temperature ta ( o c ) 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 0 10 20 30 40 50 60 70 80 90 ( t a = 25 o c ) ambient temperature vs. maximum forward current (per die) directivity ta= 25
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics spectrum 300 400 500 600 700 800 0.0 0.5 1.0 relative emission intensity wavelength [nm]
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test item symbol condition criteria for judgement min max forward voltage v f i f =20ma - usl *1 1.2 luminous intensity i v i f =20ma lsl *2 0.5 - note : *1 usl : upper standard level *2 lsl : lower standard level criteria for judging the damage item reference test conditions duration / cycle number of damaged thermal shock eiaj ed - 4701 t a = - 40 o c(30min) ~ 100 o c(30min) 100 cycle 0/22 high temperature storage eiaj ed - 4701 t a =100 o c 1000 hours 0/22 high temp. high humidity storage eiaj ed - 4701 t a =60 o c, rh=90% 1000 hours 0/22 low temperature storage eiaj ed - 4701 t a = - 40 o c 1000 hours 0/22 operating endurance test internal reference t a =25 o c, i f =20ma 1000 hours 0/22 high temperature high humidity life test internal reference t a =60 o c, rh=90%, i f =20ma 500 hours 0/22 high temperature life test internal reference t a =85 o c, i f =20ma 500 hours 0/22 low temperature life test internal reference t a = - 40 o c, i f =20ma 1000 hours 0/22 esd(hbm) mil - std - 883d 1kv at 1.5k?; 100pf 3 time 0/22
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 460 470 475 480 485 490 495 500 505 510 515 520 525 530 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620 630 830 cie y cie x
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.26 0.28 0.30 0.32 0.34 0.36 0.38 5300k 5600k 6000k 6500k 7000k 7800k 8900k g6 g5 g4 g3 g2 g1 f6 f5 f4 f3 f2 f1 e6 e5 e4 e3 e2 cie y cie x e1
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning e1 e2 e3 cie x cie y cie x cie y cie x cie y 0.2885 0.2925 0.2917 0.2855 0.2953 0.2775 0.2917 0.2855 0.2953 0.2775 0.2985 0.2705 0.2997 0.2995 0.3033 0.2915 0.3065 0.2845 0.2965 0.3065 0.2997 0.2995 0.3033 0.2915 e4 e5 e6 cie x cie y cie x cie y cie x cie y 0.2965 0.3065 0.2997 0.2995 0.3033 0.2915 0.2997 0.2995 0.3033 0.2915 0.3065 0.2845 0.3077 0.3135 0.3113 0.3055 0.3145 0.2985 0.3045 0.3205 0.3077 0.3135 0.3113 0.3055 f1 f2 f3 cie x cie y cie x cie y cie x cie y 0.3045 0.3205 0.3077 0.3135 0.3113 0.3055 0.3077 0.3135 0.3113 0.3055 0.3145 0.2985 0.3157 0.3275 0.3193 0.3195 0.3225 0.3125 0.3125 0.3345 0.3157 0.3275 0.3193 0.3195 f4 f5 f6 cie x cie y cie x cie y cie x cie y 0.3125 0.3345 0.3157 0.3275 0.3193 0.3195 0.3157 0.3275 0.3193 0.3195 0.3225 0.3125 0.3237 0.3415 0.3273 0.3335 0.3305 0.3265 0.3205 0.3485 0.3237 0.3415 0.3273 0.3335
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning g1 g2 g3 cie x cie y cie x cie y cie x cie y 0.3205 0.3485 0.3237 0.3415 0.3273 0.3335 0.3237 0.3415 0.3273 0.3335 0.3305 0.3265 0.3317 0.3555 0.3353 0.3475 0.3385 0.3405 0.3285 0.3625 0.3317 0.3555 0.3353 0.3475 g4 g5 g6 cie x cie y cie x cie y cie x cie y 0.3285 0.3625 0.3317 0.3555 0.3353 0.3475 0.3317 0.3555 0.3353 0.3475 0.3385 0.3405 0.3397 0.3695 0.3433 0.3615 0.3465 0.3545 0.3365 0.3765 0.3397 0.3695 0.3433 0.3615
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com color rank @ i f = 20ma e ~ g forward voltage (v) @ i f = 20ma bin code min. max. y3 2.9 3.0 z1 3.0 3.1 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 luminous intensity ( mcd ) @ i f = 20ma flux (lm) bin code min. max. typ j7 1,700 1,800 4.9 j8 1,800 1,900 5.2 j9 1,900 2,000 5.4 k0 2,000 2,100 5.7 k1 2,100 2,200 5.9 k2 2,200 2,300 6.2 k3 2,300 2,400 6.5 k4 2,400 2,500 6.8 k5 2,500 2,650 7.0 7. bin code description available ranks not yet available ranks bin code luminous intensity color rank forward voltage k0 f1 z1 [note] all measurements were made under the standardized environment of ssc. in order to ensure availability, single color rank will not be orderable. [1] classification criteria : luminous intensity iv [2] please use for only reference.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 8. outline dimension ( tolerance : 0 . 2 , unit : mm ) recommended solder pattern 9. reel structure ( tolerance : 0 . 2 , unit : mm ) (1) quantity : 3000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 10. packing 1 side outer box structure material : paper(sw3b(b)) ? ? ? humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type size (mm) ? ? ? 7inch 245 220 102 245 220 142
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 11. soldering lead free solder pre - heat 150~200 pre - heat time 120 sec. max. peak - temperature 260 max. soldering time condition 10 sec. max. lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead - free solder lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under soldering iron. (4) the encapsulated material of the leds is silicone. precautions should be taken to avoid the strong pressure on the encapsulated part. so when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nitrogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. [note] in case that the soldered products are reused in soldering process, we dont guarantee the p roducts. lead solder pre - heat 120~150 pre - heat time 120 sec. max. peak - temperature 240 max. soldering time condition 10 sec. max.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use 1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccat or) with a desiccant. otherwise, to store them in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh 2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. attention in followed; a. after opened and mounted the soldering shall be quickly. b. keeping of a fraction temperature : 5 ~ 40oc humidity : less than 30% 3) in the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10 - 12hr. at 60 5oc. 4) silver plating might be tarnished in the environment that contains corrosive gases and materials. also any product that has tarnished lead might be decreased the solder - ability and optical - electrical properties compare to normal ones. please do not expose the product in the corrosive environment during the storage. 5) any mechanical force or any excess vibration shall not be accepted to apply during cooling proces s to normal temperature after soldering. 6) quick cooling shall be avoided. 7) components shall not be mounted on warped direction of pcb. 8) anti radioactive ray design is not considered for the products. 9) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. 10) when the leds are illuminating, operating current should be decided after considering the ambien t maximum temperature. 11) the leds must be soldered within seven days after opening the moisture - proof packing. 12) repack unused products with anti - moisture packing, fold to close any opening and then store in a dry place. 13) the appearance and specifications of the product may be modified for improvement without notice. 14) please note the information contained herein is subject to change. ssc reserves the right to modify or change the design of led package inside structure without prior notice unless optical performance changes. 15) we recommend using solder paste composed of agcusn, because pastes that contain bi or b might cause color change of ag during surface mount technology.
z - power led x10490 z - power led x10490 technical data sheet ssc - qp - 7 - 07 - 24 (rev.00) april 2013 april 2013 www.seoulsemicon.com www.seoulsemicon.com 13. handling of silicone resin leds 1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented . this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 4) silicone differs from materials conventionally used for the manufacturing of leds. these conditio ns must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space.

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