nichia sts-da1-3680 nichia corporation specifications for warm white led NF2L757GRt pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-3680 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 200 ma pulse forward current i fp 400 ma allowable reverse current i r 85 ma power dissipation p d 1.42 w operating temperature t o p r -40~100 c storage temperature t st g -40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =150ma 6.32 - v r70 luminous flux v i f =150ma 133 - lm r8000 luminous flux v i f =150ma 124 - lm r9050 luminous flux v i f =150ma 97 - lm chromaticity coordinate x - i f =150ma 0.4338 - - y - i f =150ma 0.4030 - - thermal resistance r js - 11 17 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts-da1-3680 2 ranks item rank min max unit forward voltage - 5.7 7.1 v luminous flux p20 144.0 171.2 lm p19 121.1 144.0 p18 101.8 121.1 p17 85.6 101.8 p16 72.0 85.6 color rendering index r70 r a 70 - - r8000 r a 80 - - r 9 0 - - r9050 r a 90 - - r 9 50 - - color ranks the color rank has a chromaticity range within a 3-step macadam ellipse. rank sm203 rank sm223 rank sm253 rank sm273 rank sm303 rank sm353 center point x 0.5270 0.5018 0.4806 0.4578 0.4338 0.4073 y 0.4130 0.4153 0.4141 0.4101 0.4030 0.3917 minor axis a 0.003978 0.004002 0.004029 0.004056 0.004107 0.004098 major axis b 0.007062 0.007206 0.007515 0.007872 0.008391 0.008796 ellipse rotation angle -43.56 -39.89 -37.58 -36.05 -36.00 -35.47 rank sm403 rank sm453 center point x 0.3818 0.3611 y 0.3797 0.3658 minor axis a 0.004071 0.003852 major axis b 0.009282 0.009009 ellipse rotation angle -35.95 -34.33 the color rank has a chromaticity range within a 5-step macadam ellipse. rank sm2050a rank sm2050b rank sm2050c rank sm2050d rank sm2050e rank sm2050f center point x 0.5270 y 0.4130 minor axis a 0.006630 major axis b 0.011770 ellipse rotation angle -43.56 rank sm2250a rank sm2250b rank sm2250c rank sm2250d rank sm2250e rank sm2250f center point x 0.5018 y 0.4153 minor axis a 0.006670 major axis b 0.012010 ellipse rotation angle -39.89
nichia sts-da1-3680 3 rank sm2550a rank sm2550b rank sm2550c rank sm2550d rank sm2550e rank sm2550f center point x 0.4806 y 0.4141 minor axis a 0.006715 major axis b 0.012525 ellipse rotation angle -37.58 rank sm2750a rank sm2750b rank sm2750c rank sm2750d rank sm2750e rank sm2750f center point x 0.4578 y 0.4101 minor axis a 0.006760 major axis b 0.013120 ellipse rotation angle -36.05 rank sm3050a rank sm3050b rank sm3050c rank sm3050d rank sm3050e rank sm3050f center point x 0.4338 y 0.4030 minor axis a 0.006845 major axis b 0.013985 ellipse rotation angle -36.00 rank sm3550a rank sm3550b rank sm3550c rank sm3550d rank sm3550e rank sm3550f center point x 0.4073 y 0.3917 minor axis a 0.006830 major axis b 0.014660 ellipse rotation angle -35.47 rank sm4050a rank sm4050b rank sm4050c rank sm4050d rank sm4050e rank sm4050f center point x 0.3818 y 0.3797 minor axis a 0.006785 major axis b 0.015470 ellipse rotation angle -35.95
nichia sts-da1-3680 4 rank sm4550a rank sm4550b rank sm4550c rank sm4550d rank sm4550e rank sm4550f center point x 0.3611 y 0.3658 minor axis a 0.006420 major axis b 0.015015 ellipse rotation angle -34.33 * ranking at t s =25c. * forward voltage tolerance: 0.07v * luminous flux tolerance: 5% * color rendering index r a toleranc e: 2 * color rendering index r 9 toleranc e: 4 * the r 9 value for the above rank shall be greater than 0. * chromaticity coordinate tolerance: 0.003 * leds from the above ranks will be shipped. the rank combination ratio per sh ipment will be decided by nichia. definition of the macadam ellipse ranks: 60 a b a perfect circle is divided into 60 degree-sections and then transformed into the macadam ellipse that is presented on the chromaticity diagram in this document. luminous flux ranks by color rank, color rendering index rank ranking by luminous flux ranking by color coordinates, color rendering index p16 p17 p18 p19 p20 sm203,sm2050a,sm2050b,sm2050c,sm2050d,sm2050e,sm2050f, sm223,sm2250a,sm2250b,sm2250c,sm2250d,sm2250e,sm2250f, sm253,sm2550a,sm2550b,sm2550c,sm2550d,sm2550e,sm2550f r8000 sm273,sm2750a,sm2750b,sm2750c,sm2750d,sm2750e,sm2750f, sm303,sm3050a,sm3050b,sm3050c,sm3050d,sm3050e,sm3050f, sm353,sm3550a,sm3550b,sm3550c,sm3550d,sm3550e,sm3550f, sm403,sm4050a,sm4050b,sm4050c,sm4050d,sm4050e,sm4050f, sm453,sm4550a,sm4550b,sm4550c,sm4550d,sm4550e,sm4550f r70 r8000 r9050
nichia sts-da1-3680 5 chromaticity diagram 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x \?E blackbody locus sm2750b sm2750c sm3050a sm3050b sm3050c sm3550c sm4050a sm4050b sm4050c sm4550c sm2750d sm273 sm2750e sm3050d sm303 sm3050e sm4550f sm4550e sm3550f sm2750f sm3550a sm3550b sm353 sm3550e sm3550d sm4050f sm4050e sm4050d sm403 sm4550b sm4550a sm4550d sm453 sm2750a sm3050f 4500k 4000k 3500k 3000k 2700k
nichia sts-da1-3680 6 chromaticity diagram 2000k 2200k 2500k 0.36 0.38 0.40 0.42 0.44 0.46 0.46 0.48 0.50 0.52 0.54 0.56 y x \?E blackbody locus sm2050a sm2050b sm2050c sm2250a sm2250c sm2250d sm2250f sm2550c sm2550f sm2550d sm2550e sm2250b sm253 sm223 sm2250e sm2050f sm203 sm2050e sm2050d sm2550a sm2550b
nichia sts-da1-3680 7 outline dimensions 3 2.6 2.27
nichia sts-da1-3680 8 soldering ? recommended reflow soldering condition(lead-free solder) 120sec max pre-heat 180 to 200c 260cmax 10sec max 60sec max above 220c 1 to 5c per sec ? recommended hand soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern recommended metal solder stencil aperture 2 2.3 3.15 2.3 3.15 * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be perform ed more than twice. hand soldering mu st not be performed more than once. * avoid rapid cooling. ramp down the temp erature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delaminati on and deformation, and wire br eaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds wi ll or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. * when using a pick and place machine, choose an appropriat e nozzle for this product. using a pick-and-place nozzle with a smaller diameter than the size of the led's em itting surface will cause damage to the emitting surface and may also cause the led not to illuminate.
nichia sts-da1-3680 9 * if the top cover tape is removed right next to where the nozzle picks up the leds, regardless of whether the leds have been baked or not, it may cause the led to be picked up incorrect ly; it is recommended to remove the top cover tape further from where the nozzle picks up the leds. ensure that there ar e no issues with the conditions when the nozzle picks up the le ds. recommended tape removal positi on(removing the cover tape furthe r from the pick-and-place nozzle) ? pick-and-place nozzle ??` feed direction of the carrier tape ?`?x tape removal position u??` top cover tape incorrect tape removal position(removing the cove r tape right next to the pick-and-place nozzle) u??` top cover tape ? pick-and-place nozzle ?`?x tape removal position ??` feed direction of the carrier tape * verify the setting conditions when the leds are mounted onto a pcb to ensure that the leds are mounted onto the pcb with the correct polarity. if the cathode mark is not able to be easily recognized with a visual inspection, check the back or side of the led to determine the polarity. * the recommended soldering pad pattern is design ed for attachment of the led without problems. when precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a ha logen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this produc t; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions.
nichia sts-da1-3680 10 tape and reel dimensions reel size: 5000pcs sts-da7-7099 1 `?? 5000 ? * nxxx757x ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) the tape packing method complies with jis c 0806 (packaging of electronic comp onents on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1 when the tape is rewound due to work interruptions, no more than 10n should be applied to the embossed carrier tape. the leds may stick to the top cover tape. * g?I???????`?`??? ???`??? (10n ) ? led `?`?N??? 3.18 0.1 0.2 0.05 0.8 0.1 3.18 0.1 cathode mark -0 1 +0.2
nichia sts-da1-3680 11 packaging - tape & reel
nichia sts-da1-3680 12 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2014 e 2015 f 2016 g 2017 h 2018 i 2019 j m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous flux, ranking by color rendering index
nichia sts-da1-3680 13 derating characteristics nf2x757gr ? no. sts-da7-7615 0 50 100 150 200 250 300 0 20406080100120 derating1 ( 74 , 200 ) ( 100 , 85.0 ) 0 50 100 150 200 250 300 0 20406080100120 derating2 ( 95 , 200 ) ( 100 , 160 ) 10 100 1000 1 10 100 duty 200 400 S allowable forward current(ma) ????(`?)-S solder temperature(cathode side) vs allowable forward current ??-S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ????(`?) solder temperature(cathode side)(c) ?? ambient temperature(c) ?`?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current 34c/w ja r = t a =25c
nichia sts-da1-3680 14 optical characteristics NF2L757GR ? no. sts-da7-7681 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.5 00.5 1 150ma i fp = t a =25c 150ma i fp = t a =25c * ??? r70 ???? the graphs above show the characteri stics for r70 leds of this product. * ??? all characteristics shown are for refe rence only and are not guaranteed.
nichia sts-da1-3680 15 optical characteristics NF2L757GR ? no. sts-da7-7608 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.5 00.5 1 150ma i fp = t a =25c 150ma i fp = t a =25c * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product. * ??? all characteristics shown are for refe rence only and are not guaranteed.
nichia sts-da1-3680 16 optical characteristics NF2L757GR ? no. sts-da7-7682 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.5 00.5 1 150ma i fp = t a =25c 150ma i fp = t a =25c * ??? r9050 ???? the graphs above show the characteristics for r9050 leds of this product. * ??? all characteristics shown are for refe rence only and are not guaranteed.
nichia sts-da1-3680 17 forward current characteristics / temperature characteristics NF2L757GR ? no. sts-da7-7609a 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 5.0 5.5 6.0 6.5 7.0 7.5 8.0 vfif 150 400 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 100 200 300 400 500 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) * ??? all characteristics shown are for refe rence only and are not guaranteed. =25c t a i fp =150ma i fp =150ma t a =25c
nichia sts-da1-3680 18 forward current characteristics / temperature characteristics NF2L757GR ? no. sts-da7-7683 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 taxy -40 ? c 25 ? c 100 ? c x 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 ifxy 20ma 100ma 150ma 200ma 400ma x y y 150ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? r70 ???? the graphs above show the characteri stics for r70 leds of this product.
nichia sts-da1-3680 19 forward current characteristics / temperature characteristics NF2L757GR ? no. sts-da7-7610 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 taxy -40c 0c 25c 100c x 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 ifxy 20ma 150ma 400ma x y y 150ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product.
nichia sts-da1-3680 20 forward current characteristics / temperature characteristics NF2L757GR ? no. sts-da7-7684 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 taxy -40 ? c 0 ? c 25 ? c 100 ? c x 0.38 0.39 0.40 0.41 0.42 0.41 0.42 0.43 0.44 0.45 ifxy 20ma 150ma 400ma x y y 150ma i fp = ??-? ambient temperature vs chromaticity coordinate -? forward current vs chromaticity coordinate t a =25c * ??? all characteristics shown are for refe rence only and are not guaranteed. * ??? r9050 ???? the graphs above show the characteristics for r9050 leds of this product.
nichia sts-da1-3680 21 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =150ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =200ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =85ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =150ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =150ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positive or negative #1 0/22 board bending 1bend to a deflection of 2mm for 51sec #3 0/22 soldering joint shear strength jeita ed-4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 34c/w the board bending is pe rformed using an excl usive test board. 2) measurements are pe rformed after allowing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =150ma >u.s.l.1.1 luminous flux( v ) i f =150ma nichia sts-da1-3680 22 cautions (1) storage conditions te m p e ra t u r e humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performan ce degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferab ly the original moisture-p roof bags for storage. after the ?period after opening? storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposu re to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds mi ght cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the use of silico nes may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the curre nt through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. ... ... this product should be operated using forward curre nt. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater th an 10% of the sorting current to stabilize the led characteristic s. ensure that excessive voltages such as li ghtning surges are not applied to the leds. for outdoor use, necessary measures should be take n to prevent water, moisture and salt air damage.
nichia sts-da1-3680 23 (3) handling precautions do not handle the leds with bare hands as it will contaminat e the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the wi re to break, which will cause the led not to illuminate. when handling the product with tweezers, be ca reful not to apply excess ive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures. cri rank r9050 leds in this specification use materials that contain halogen-based compounds; the halogen element found in these materials will not affe ct the leds when the leds are used under the conditions specified in this specification. the other cri ranks in this specification do not use these materials. (4) design consideration pcb warpage after mounting the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerte d on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. volatile organic compounds that have been released from ma terials present around the leds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed enviro nment, these volatile compounds ca n discolor after being exposed to heat and/or photon energy and it may greatly re duce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shift. perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and mach ines that are being used are properly grounded and that proper grounding techniques are used in wo rk areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics insp ection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <4.0v at i f =0.5ma
nichia sts-da1-3680 24 (6) thermal management proper thermal management is an impo rtant when designing products with le ds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from ju nction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning the leds should not be cleaned with water, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with is opropyl alcohol (ipa), then squeeze it before wiping the leds. ultrasonic cleaning is not recommended sinc e it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipmen t (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor co ntrol system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer sh all inform nichia directly before disassembling or analysis. the specifications and appearance of th is product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins.
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