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white led driver ap3008 data sheet 1 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited general description the ap3008 is a 1.2mhz pwm boost switching regu- lator designed for constant-current white led driver applications. the ap3008 can drive a string of 2 to 3 white leds from a 2.7v supply in series, ensuring uniform bright- ness and eliminating several ballast resistors. the ap3008 implements a constant frequency 1.2mhz pwm control scheme. the high frequency pwm oper- ation also saves board space by reducing external com- ponent sizes. to improve efficiency, the feedback voltage is set to 95mv, which reduces the power dissipation in the current setting resistor. the ap3008 is equipped with ovp protection ability, the sw pin monitors the output voltage and will turn off the device if an over-voltage condition is present to prevent damage from an open circuit condition. the ap3008 is available in sot-23-5 package. features inherently uniform led current high efficiency up to 84% drives 2 to 3 leds from a 2.7v supply 1.2mhz pwm operation frequency requires only 0.22 m f output capacitor shutdown current: <1 m a built-in output over-voltage protection under voltage lock out (uvlo) applications digital cameras lcd modules gps receivers cellular phones pdas, handheld computers figure 1. package type of ap3008 sot-23-5
white led driver ap3008 data sheet 2 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 2. pin configuration of ap3008 (top view) pin configuration pin description pin number pin name function 1 sw switch pin. connect inductor/diode here. the output voltage can range up to 29v but not extend this limit. if the voltage on this pin is higher than the overvoltage protection thre- shold (ovp), the device comes back to shutdown mode. to restart the chip, one must then send a low to high sequence on shutdown pin or switch off the v in supply. 2 gnd ground pin. 3 fb voltage feedback. reference voltage is 95mv. 4 shdn shutdown pin. connect to 1.5v or higher to enable device; connect to 0.4v or less to disable device. 5 v in input supply pin. must be locally bypassed. k package (sot-23-5) sw fb v in shdn gnd 1 2 3 4 5
white led driver ap3008 data sheet 3 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited functional block diagram figure 3. functional block diagram of ap3008 gnd fb shdn v in sw package temperature range part number marking id packing type sot-23-5 -40 to 85 o c AP3008KTR-E1 e1b tape & reel circuit type package k: sot-23-5 e1: rohs ap3008 - tr: tape and reel q1 s a2 a1 r s q 1.2mhz oscillator ramp generator v ref shutdown 3 5 4 2 1 95mv driver 1.25v comparator ovp ordering information bcd semiconductor's products as designated with "e1" suffix in the part number are rohs compliant.
white led driver ap3008 data sheet 4 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited parameter symbol value unit input voltage v in 15 v sw voltage 38 v fb voltage 10 v shdn voltage 15 v thermal resistance (junction to atmosphere, no heat sink ) r q ja 265 o c/w operating junction temperature 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (machine model) 250 v esd (human body model) 2000 v note 1: stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indi- cated under "recommended operating conditions" is not implied. exposure to "absolute maximum ratings" for extended periods may affect device reliability. parameter symbol min max unit operating temperature range t op -40 85 o c operating voltage range 2.5 12 v recommended operating conditions absolute maximum ratings (note 1)
white led driver ap3008 data sheet 5 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited (v in =3v, v shdn =3v , t a =25 o c, unless otherwise specified.) parameter symbol conditions min typ max unit feedback voltage v fb i sw =100ma, duty cycle=66% 86 95 1 04 mv fb pin bias current 45 1 00 na supply current i cc v shdn =v in , v fb =v in , no switching 1.9 2.5 ma supply current i q v shdn =0v 0.1 1.0 m a switch frequency f 0.8 1.2 1.6 mhz maximum duty cyc le d max 85 90 % switch current limit i lim duty=15% 320 ma switch vcesat v cesat i sw =250ma 350 mv switch leakage current v sw =5v 0. 01 5 m a shdn voltage v th high 1.5 v v tl low 0.4 shdn pin bias current 50 m a ovp voltage v ovp 29 v thermal resistance (junction to case) q jc 86.10 o c/w electrical characteristics
white led driver ap3008 data sheet 6 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited figure 6. switch frequency figure 7. feedback bias current typical performance characteristics figure 4. quiescent current vs. v in figure 5. shdn pin bias current 0 2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 i q (ma) v in (v) -50 o c 25 o c 100 o c -50 - 25 0 25 50 75 100 40 80 120 160 200 240 280 320 shdn pin bias current ( m a) j unction temperature ( o c) v shdn =10v v shdn =3.6v v shdn =3v v shdn =2.7v vs. junction temperature -50 - 25 0 25 50 75 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 switch frequency (mhz) j unction temperature ( o c) vs. junction temperature vs. junction temperature -50 - 25 0 25 50 75 100 0 5 10 15 20 25 30 35 40 45 50 55 feedback bias current (na) j unction temperature ( o c)
white led driver ap3008 data sheet 7 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited typical performance characteristics (continued) figure 8. efficiency vs. junction temperature figure 9. switch current vs. duty cycle 0 20 40 60 80 100 0 40 80 120 160 200 240 280 320 360 400 440 current limit (ma) d uty cycle (%) figure 10. efficiency vs. led current figure 11. efficiency vs. led current 0 5 10 15 20 60 65 70 75 80 85 v in =3.6v v in =3v 3 leds v led =3.35v, ta=25 o c efficiency (%) le d current (ma) 0 5 10 15 20 60 65 70 75 80 85 v in =3.6v v in =3v 4 leds v led =3.35v, ta=25 o c efficiency (%) le d current (ma) -50 - 25 0 25 50 75 100 78 80 82 84 i led =10ma i led =20ma i led =15ma v in =3.6v 3 leds efficiency (%) j unction temperature ( o c)
white led driver ap3008 data sheet 8 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited typical application figure 12. three white leds driver v in sw shdn ap3008 fb gnd v in l1 22 mh 3v to 5v off on c1 1 m f c2 0.22m f d1 led 1 led 2 led 3 r1 6.34 w c1, c2: x5r or x7r dielectric l1: sumida cdrh5d28r-220nc or equivalent 1 4 2 3 5
9 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited white led driver ap3008 data sheet sot-23-5 unit: mm(inch) mechanical dimensions 2.820(0.111) 2 . 6 5 0 ( 0 . 1 0 4 ) 1 . 5 0 0 ( 0 . 0 5 9 ) 0 . 0 0 0 ( 0 . 0 0 0 ) 0.300(0.012) 0.950(0.037) 0 . 9 0 0 ( 0 . 0 3 5 ) 0.100(0.004) 0.200(0.008) 0 . 3 0 0 ( 0 . 0 1 2 ) 8 0 3 .100(0.122) 1 . 7 0 0 ( 0 . 0 6 7 ) 3 . 0 0 0 ( 0 . 1 1 8 ) 0.500(0.020) 0 . 1 5 0 ( 0 . 0 0 6 ) 1 . 3 0 0 ( 0 . 0 5 1 ) 0 .200(0.008) 0 . 6 0 0 ( 0 . 0 2 4 ) 1.800(0.071) 2.000(0.079) 0 . 7 0 0 ( 0 . 0 2 8 ) r e f t y p 1 . 4 5 0 ( 0 . 0 5 7 ) m a x
white led driver ap3008 data sheet 10 may 2013 rev. 2. 0 bcd semiconductor manufacturing limited sot-23-5 mounting pad layout e2 e1 y x g z dimensio ns z (mm)/(inch) g (mm)/(inch) x (mm)/(inch) y (mm)/(inch) e1 (mm)/(inch) e2 (mm)/(inch) value 3.600/0.142 1.600/0. 063 0.700/0. 028 1.000/0.039 0.950/0.0 37 1.900/0.075
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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