miniature surface mount polymeric esd suppressors suppressors 0402 series specification no. 24-1 industry e. rd. iv, hsinchu science park hsinchu, 300 taiwan tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 i u u q x x x q u u d d p n u x ??WI@^ I| 24-1 ? tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 2009/11 revision 1.0 product overview polytronics polytrans ? esd suppressor is the leading esd protection solution to meet iec 61000-4-2 level 4 transient and at the same time remain signal integrity above 4.5 gbps. it is the ideal supplement protection solution for built- in ic protection to improve the overall stability and robustness of the products in the event of an esd transient. polytrans ? esd suppressor utilizes polymeric materials and advanced proce sses to help reduce the overall cost of added protection and at the same offer low leakage current to maximize battery life of the end product. features z compact size (1.0 mm x 0.5 mm) z fast response time z low capacitance z low leakage current z rohs compliant z bi-directional z surface mount z meet iec 61000-4-2 level 4 applications z hdmi 1.3 hardware z set-top box z desktop / laptop computers z fingerprint device z usb 3.0 / ieee 1394 z computer peripherals z network hardware z portable and handheld electronics equivalent circuit 0402 series electrical characteristics part number typical trigger voltage (iec) typical clamping voltage (iec) rated voltage typical capacitance response time leakage current esd pulse withstand ppes0402v06b 350v 35v 6vdc 0.1pf < 1ns < 10na 1000 PPES0402V14B 500v 50v 14vdc 0.1pf < 1ns < 10na 1000 general explanation of part numbering system: p-pptc.pes - polytrans esd suppressors. 0402 - device dimension. v06 /v14 - rat ed dc voltage. b-bidirectional free datasheet http:///
miniature surface mount polymeric esd suppressors suppressors 0402 series specification no. 24-1 industry e. rd. iv, hsinchu science park hsinchu, 300 taiwan tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 i u u q x x x q u u d d p n u x ??WI@^ I| 24-1 ? tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 2009/11 revision 1.0 physical specification materials body: epoxy fiberglass terminals: copper/tin solderability mil-std-202, method 208 soldering parameters wave solder: 206c, 10 seconds maximum reflow solder: 206c, 30 seconds maximum dimensions (mm) recommended solder pad dimension (mm) environmental specification operation temperature -65c ~ 125c moisture resistance 85c/85%rh 1000 hr. thermal shock mil-std-202, method 107 -65c ~ 125c, 30 min. cycle, 10 cycles l w t d part number min max min max min max min max min max 0402 series a d a1 d1 occupied area solder paste c c1 b b1 l w1 w t d d w 1 0.40 0.60 0.23 0.39 1.10 0.90 1.10 0.35 0.12 0.28 part number a b c d a1 b1 c1 d1 1.45 0.54 0.52 0.41 0402 serise 1.55 0.56 0.58 0.38 free datasheet http:///
miniature surface mount polymeric esd suppressors suppressors 0402 series specification no. 24-1 industry e. rd. iv, hsinchu science park hsinchu, 300 taiwan tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 i u u q x x x q u u d d p n u x ??WI@^ I| 24-1 ? tel: +886 (3) 564-3931 fax: +886 (3) 564-4624 2009/11 revision 1.0 p t d d d d s t c t p s p w p h t w w 4 w d h w c 3 w 2 w 1 f solder reflow recommended pb-free assemb ly profile parameters note 1: all temperature refer to topside of the package, measured on the package body surface. note 2: if reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. recommended reflow methods: ir, vapor phase oven, hot air oven, n 2 environment for lead-free. recommended maximum paste thickness is 0.25mm (0.010 inch). devices can be cleaned using standa rd industry methods and solvents. devices can be reworked using th e standard industry practices. packaging specification 8mm tape and reel per eia-rs481-1 (iec 286, part3); 5000 pieces per reel. parts are delivered on on 7? (178mm) reel, paper carrier tape. storage condition: 0c ~ 40c, 70%rh. description measurement (mm) description measurement (mm) c t 0.053 0.01 h 12.0 0.05 d d 1.50 0.1 w 9.0 0.5 d s 4.00 0.1 d ? 60 0.5 p d 0.41 0.1 f ? 13.0 0.2 p h 1.12 0.1 c ? 178 1.0 p s 2.00 0.1 w 1 2.2 0.5 p w 0.62 0.1 w 2 3.0 0.5 t t 0.61 0.1 w 3 4.0 0.5 t w 8.00 0.1 w 4 5.5 0.5 description condition average ramp-up rate (ts max to tp) 3c/second max. preheat -temperature min (ts min ) -temperature max (ts max ) -time (ts min to ts max ) 150c 200c 60~180 seconds time maintained above: -temperature (t l ) -time (t l ) 217c 60~150 seconds peak temperature (tp) - time within 5c of actual tp 260c 10~30 seconds ramp-down rate 3c/second max. time 25c to peak temperature 8 minutes max. t 25 c to peak t s preheat t l ts max ts min critical zone t l to t p t p t p t l 25 ramp-up temperature time ramp-down free datasheet http:///
|
