vs-20ctq150spbf, VS-20CTQ150-1PBF www.vishay.com vishay semiconductors revision: 29-jul-14 1 document number: 94490 for technical questions within your region: diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high performance schottky rectifier, 2 x 10 a features ? 175 c t j operation ? center tap configuration ? low forward voltage drop ? high frequency operation ? high purity, high temperature epoxy encapsulation for enhanced mechanical strength and mois ture resistance ? guard ring for enhanced ruggedness and long term reliability ? meets msl level 1, per j-std-020, lf maximum peak of 260 c ? aec-q101 qualified ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 description this center tap schottky rectif ier has been optimized for low reverse leakage at high temper ature. the proprietary barrier technology allows for reliable operation up to 175 c junction tempera ture. typical applications are in switching power supplies, converters , freewheeling diodes, and reverse battery protection. ? ? product summary i f(av) 2 x 10 a v r 150 v v f at i f 0.66 v i rm max. 5.0 ma at 125 c t j max. 175 c e as 1.0 mj package to-263ab (d 2 pak), to-262aa diode variation common cathode to-263ab (d 2 pak) to-262aa ba s e common cathode a node anode common cathode 1 3 2 2 ba s e common cathode anode anode common cathode 1 3 2 2 v s -20ctq150 s p b f v s -20ctq150-1p b f major ratings and characteristics symbol characteristics values units i f(av) rectangular waveform 20 a v rrm 150 v i fsm t p = 5 s sine 1030 a v f 10 a pk , t j = 125 c (per leg) 0.66 v t j range -55 to +175 c voltage ratings parameter symbol vs-20ctq150spbf VS-20CTQ150-1PBF units maximum dc reverse voltage v r 150 v maximum working peak reverse voltage v rwm absolute maximum ratings parameter symbol test conditions values units maximum average forward current ? see fig. 5 per leg i f(av) 50 % duty cycle at t c = 154 c, rectangular waveform 10 a per device 20 maximum peak one cycle ? non-repetitive surge current per leg ? see fig. 7 i fsm 5 s sine or 3 s rect. pulse following any rated load condition and with rated v rrm applied 1030 10 ms sine or 6 ms rect. pulse 180 non-repetitive avalanche energy per leg e as t j = 25 c, i as = 1 a, l = 2 mh 1.0 mj repetitive avalanche current per leg i ar current decaying linear ly to zero in 1 s ? frequency limited by t j maximum v a = 1.5 x v r typical 1a
vs-20ctq150spbf, VS-20CTQ150-1PBF www.vishay.com vishay semiconductors revision: 29-jul-14 2 document number: 94490 for technical questions within your region: diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) pulse width < 300 s, duty cycle < 2 % electrical specifications parameter symbol test conditions typ. max. units maximum forward volt age drop per leg ? see fig. 1 v fm (1) 10 a t j = 25 c 0.80 0.88 v 20 a 0.90 1.0 10 a t j = 125 c 0.63 0.66 20 a 0.73 0.77 maximum reverse leakage current per leg ? see fig. 2 i rm (1) t j = 25 c v r = rated v r 3.0 25 a t j = 125 c 2.7 5.0 ma typical junction ca pacitance per leg c t v r = 5 v dc (test signal range 100 khz to 1 mhz), 25 c - 280 pf typical series inductance per leg l s measured lead to lead 5 mm from package body - 8.0 nh maximum voltage rate of change dv/dt rated v r - 10 000 v/s thermal - mechanical specifications parameter symbol test conditions values units maximum junction and storage ? temperature range t j , t stg -55 to +175 c maximum thermal resistance, ? junction to case per leg r thjc dc operation 2.0 c/w per package 1.0 typical thermal resistance, ? case to heatsink r thcs mounting surface, smooth and greased ? (only for to-262) 0.50 approximate weight 2g 0.07 oz. mounting torque minimum 6 (5) kgf cm (lbf in) maximum 12 (10) marking device case style d 2 pak 20ctq150s case style to-262 20ctq150-1
vs-20ctq150spbf, VS-20CTQ150-1PBF www.vishay.com vishay semiconductors revision: 29-jul-14 3 document number: 94490 for technical questions within your region: diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 1 - maximum forward voltage drop characteristics (per leg) fig. 2 - typical values of reverse current vs. reverse voltage (per leg) fig. 3 - typical junction capacitance vs. reverse voltage (per leg) fig. 4 - maximum thermal impedance z thjc characteristics (per leg) 1 100 10 i f - instantaneous forward current (a) v fm - forward voltage drop (v) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t j = 175 c t j = 125 c t j = 25 c 0.001 0.0001 1 10 100 0.1 0.01 i r - reverse current (ma) v r - reverse voltage (v) 40 20 60 80 160 100 120 140 0 t j = 175 c t j = 150 c t j = 125 c t j = 100 c t j = 75 c t j = 50 c t j = 25 c 10 100 1000 c t - junction capacitance (pf) v r - reverse voltage (v) 80 40 120 160 0 t j = 25 c 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 t 1 - rectangular pulse duration (s) z thjc - thermal impedance (c/w) single pulse (thermal resistance) d = 0.75 d = 0.50 d = 0.33 d = 0.25 d = 0.20 p dm t 1 t 2 notes: 1. duty factor d = t 1 /t 2 2. peak t j = p dm x z thjc + t c
vs-20ctq150spbf, VS-20CTQ150-1PBF www.vishay.com vishay semiconductors revision: 29-jul-14 4 document number: 94490 for technical questions within your region: diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 5 - maximum average forward current vs. allowable lead temperature fig. 6 - maximum average forward dissipation vs. average forward current fig. 7 - maximum peak surge forward current vs. pulse duration fig. 8 - unclamped inductive test circuit note (1) formula used: t c = t j - (pd + pd rev ) x r thjc ; ? pd = forward power loss = i f(av) x v fm at (i f(av) /d) (see fig. 6); ? pd rev = inverse power loss = v r1 x i r (1 - d); i r at v r1 = 80 % rated v r 130 140 150 160 180 170 allowable lead temperature (c) i f(av) - average forward current (a) 6 4 8 12 14 210 16 0 dc square wave (d = 0.50) 80 % rated v r applied see note (1) 0 1 3 6 7 8 9 5 4 2 10 average power loss (w) i f(av) - average forward current (a) 6 3912 15 0 dc rms limit d = 0.20 d = 0.25 d = 0.33 d = 0.50 d = 0.75 100 1000 i fsm - non-repetitive surge current (a) t p - square wave pulse duration (s) 100 1000 10 000 10 at any rated load condition and with rated v rrm applied following surge current monitor high-speed switch d.u.t. r g = 25 + freewheel diode v d = 25 v l irfp460 40hfl40s02
vs-20ctq150spbf, VS-20CTQ150-1PBF www.vishay.com vishay semiconductors revision: 29-jul-14 5 document number: 94490 for technical questions within your region: diodesamericas@vishay.com , diodesasia@vishay.com , diodeseurope@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ordering information table ordering information (example) preferred p/n quantity per t/r minimum order quantity packaging description vs-20ctq150spbf 50 1000 antistatic plastic tubes vs-20ctq150strlpbf 800 800 13" diameter reel vs-20ctq150strrpbf 800 80 0 13" diameter reel VS-20CTQ150-1PBF 50 1000 an tistatic plastic tubes links to related documents dimensions www.vishay.com/doc?95014 part marking information www.vishay.com/doc?95008 packaging information www.vishay.com/doc?95032 2 - current rating (20 = 20 a) 3 - c = common cathode 4 - t = to-220 5 - s chottky q s erie s 6 - voltage rating (150 = 150 v) 7 - s = d 2 pak -1 = to-262 8 - none = tube trl = tape and reel (left oriented - for d 2 pak only) trr = tape and reel (right oriented - for d 2 pak only) - pbf = lead (pb)-free 9 1 -vi s hay s emiconductor s product device code 5 1 3 2 4 6 7 8 9 v s - 20 c t q 150 s trl p b f
document number: 95014 for technical questi ons concerning discr ete products, contact: diodes-tech@vishay.com www.vishay.com revision: 31-mar-09 for technical questi ons concerning module products, contact: ind-modules@vishay.com 1 d 2 pak, to-262 outline dimensions vishay high power products dimensions for d 2 pak in millimeters and inches notes (1) dimensioning and toleranc ing per asme y14.5 m-1994 (2) dimension d and e do not include mold flash. mold flash shall not exceed 0.127 mm (0.005") per side. these dimensions are measured at the outmost extremes of the plastic body (3) thermal pad contour optional within dimension e, l1, d1 and e1 (4) dimension b1 and c1 apply to base metal only (5) datum a and b to be determined at datum plane h (6) controlling dimension: inch (7) outline conforms to jedec outline to-263ab symbol millimeters inches notes symbol millimeters inches notes min. max. min. max. min. max. min. max. a 4.06 4.83 0.160 0.190 d1 6.86 8.00 0.270 0.315 3 a1 0.00 0.254 0.000 0.010 e 9.65 10.67 0.380 0.420 2, 3 b 0.51 0.99 0.020 0.039 e1 7.90 8.80 0.311 0.346 3 b1 0.51 0.89 0.020 0.035 4 e 2.54 bsc 0.100 bsc b2 1.14 1.78 0.045 0.070 h 14.61 15.88 0.575 0.625 b3 1.14 1.73 0.045 0.068 4 l 1.78 2.79 0.070 0.110 c 0.38 0.74 0.015 0.029 l1 - 1.65 - 0.066 3 c1 0.38 0.58 0.015 0.023 4 l2 1.27 1.78 0.050 0.070 c2 1.14 1.65 0.045 0.065 l3 0.25 bsc 0.010 bsc d 8.51 9.65 0.335 0.380 2 l4 4.78 5.28 0.188 0.208 c b detail a c2 a a a 0.004 b m a lead tip (3) (3) v ie w a - a (e) (d1) e1 b h a1 detail ?a? rotated 90 cw scale: 8 :1 l ga u ge plane 0 to 8 l3 l4 seating plane section b - b and c - c scale: n one (4) (4) ( b , b 2) b 1, b 3 (c) c1 base metal plating conforms to jedec outline d 2 pak (smd-220) 13 2 d c a l2 e (2)(3) (2) 4 h bb 2 x b 2 x b 2 l1 0.010 a b mm (3) e 2 x pad layout mi n . 11.00 (0.43) mi n . 9.65 (0.3 8 ) mi n . 3. 8 1 (0.15) mi n . 2.32 (0.0 8 ) 17.90 (0.70) 15.00 (0.625) 2.64 (0.103) 2.41 (0.096) lead assignments diodes 1. - anode (t w o die)/open (one die) 2., 4. - cathode 3. - anode
www.vishay.com for technical questions c oncerning discrete products, contact: diodes-tech@vishay.com document number: 95014 2 for technical questions concer ning module products, contact: ind-modules@vishay.com revision: 31-mar-09 outline dimensions vishay high power products d 2 pak, to-262 dimensions for to-262 in millimeters and inches notes (1) dimensioning and tolerancing as per asme y14.5m-1994 (2) dimension d and e do not include mold flash. mold flash shall not exceed 0.127 mm (0.005") per side. these dimensions are measured at the outmost extremes of the plastic body (3) thermal pad contour optional within dimension e, l1, d1 and e1 (4) dimension b1 and c1 apply to base metal only (5) controlling dimension: inches (6) outline conform to jedec to-262 except a1 (maximum), b (minimum) and d1 (minimum) where dimensions derived the actual package outline symbol millimeters inches notes min. max. min. max. a 4.06 4.83 0.160 0.190 a1 2.03 3.02 0.080 0.119 b 0.51 0.99 0.020 0.039 b1 0.51 0.89 0.020 0.035 4 b2 1.14 1.78 0.045 0.070 b3 1.14 1.73 0.045 0.068 4 c 0.38 0.74 0.015 0.029 c1 0.38 0.58 0.015 0.023 4 c2 1.14 1.65 0.045 0.065 d 8.51 9.65 0.335 0.380 2 d1 6.86 8.00 0.270 0.315 3 e 9.65 10.67 0.380 0.420 2, 3 e1 7.90 8.80 0.311 0.346 3 e 2.54 bsc 0.100 bsc l 13.46 14.10 0.530 0.555 l1 - 1.65 - 0.065 3 l2 3.56 3.71 0.140 0.146 (4) (4) base metal plating b 1, b 3 ( b , b 2) c1 c section b - b and c - c scale: n one section a - a (3) e1 (3) d1 e b a a a c2 c a1 seating plane lead tip (3) (2) (3) (2) a e (dat u m a) l1 l2 b b c c 3 2 1 l d 2 x e 3 x b 2 3 x b 0.010 a b mm modified jedec outline to-262 lead assignments diodes 1. - anode (t w o die)/open (one die) 2., 4. - cathode 3. - anode
legal disclaimer notice www.vishay.com vishay revision: 02-oct-12 1 document number: 91000 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, vishay), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, vi shay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on vishays knowledge of typical requirements that are often placed on vishay products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify vish ays terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vi shay product could result in personal injury or death. customers using or selling vishay products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized vishay personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of vishay. product names and markings noted herein may be trad emarks of their respective owners. material category policy vishay intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some vishay documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. vishay intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some vishay documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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