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absolute maximum ratings parameter units i d @ v gs = 12v, t c = 25c continuous drain current 14.4 i d @ v gs = 12v, t c = 100c continuous drain current 9.1 i dm pulsed drain current 58 p d @ t c = 25c max. power dissipation 75 w linear derating factor 0.6 w/c v gs gate-to-source voltage 20 v e as single pulse avalanche energy 150 mj i ar avalanche current 14.4 a e ar repetitive avalanche energy 7.5 mj dv/dt peak diode recovery dv/dt 6.0 v/ns t j operating junction -55 to 150 t stg storage temperature range pckg. mounting surface temp. 300 (for 5s) weight 1.0 (t ypical) g pre-irradiation international rectifier?s rad-hard tm hexfet ? mosfet technology provides high performance power mosfets for space applications. this technology has over a decade of proven performance and reliability in satellite applications. these devices have been characterized for both total dose and single event effects (see). the combination of low r ds(on) and low gate charge reduces the power losses in switching applications such as dc to dc converters and motor control. these devices retain all of the well established advantages of mosfets such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters. o c a radiation hardened power mosfet surface mount (smd-0.5) www.irf.com 1 features: single event effect (see) hardened low r ds(on) low total gate charge simple drive requirements ease of paralleling hermetically sealed ceramic package surface mount light weight for footnotes refer to the last page IRHNJ7130 100v, n-channel rad-hard ? hexfet ? mosfet technology product summary part number radiation level r ds(on) i d IRHNJ7130 100k rads (si) 0.18 ? 14.4a irhnj3130 300k rads (si) 0.18 ? 14.4a irhnj4130 500k rads (si) 0.18 ? 14.4a irhnj8130 1000k rads (si) 0.18 ? 14.4a smd-0.5 pd - 93820a
IRHNJ7130 pre-irradiation 2 www.irf.com for footnotes refer to the last page source-drain diode ratings and characteristics parameter min typ max units t est conditions i s continuous source current (body diode) ? ? 14.4 i sm pulse source current (body diode) ?? 58 v sd diode forward voltage ? ? 1.5 v t j = 25c, i s = 14.4a, v gs = 0v t rr reverse recovery time ? ? 275 ns t j = 25c, i f = 14.4a, di/dt 100a/ s q rr reverse recovery charge ? ? 2.5 c v dd 25v t on forward turn-on time intrinsic turn-on time is negligible. turn-on speed is substantially controlled by l s + l d . a thermal resistance parameter min typ max units t est conditions r thjc junction-to-case ? ? 1.67 electrical characteristics @ tj = 25c (unless otherwise specified) parameter min typ max units t est conditions bv dss drain-to-source breakdown voltage 100 ? ? v v gs = 0v, i d = 1.0ma ? bv dss / ? t j temperature coefficient of breakdown ? 0.11 ? v/c reference to 25c, i d = 1.0ma voltage r ds(on) static drain-to-source on-state ? ? 0.18 v gs = 12v, i d = 9.1a resistance ? ? 0.20 ? v gs = 12v, i d = 14.4a v gs(th) gate threshold voltage 2.0 ? 4.0 v v ds = v gs , i d = 1.0ma g fs forward transconductance 2.5 ? ? s ( )v ds > 15v, i ds = 9.1a i dss zero gate voltage drain current ? ? 25 v ds = 80v, v gs =0v ? ? 250 v ds = 80v, v gs = 0v, t j = 125c i gss gate-to-source leakage forward ? ? 100 v gs = 20v i gss gate-to-source leakage reverse ? ? -100 v gs = -20v q g total gate charge ? ? 50 v gs = 12v, i d = 14.4a q gs gate-to-source charge ? ? 10 nc v ds = 50v q gd gate-to-drain (?miller?) charge ? ? 20 t d (on) turn-on delay time ? ? 35 v dd = 50v, i d = 14.4a, t r rise time ? ? 75 r g = 7.5 ?, v gs = 12v t d (off) turn-off delay time ? ? 70 t f fall time ? ? 60 l s + l d total inductance ? 4.0 ? c iss input capacitance ? 960 ? v gs = 0v, v ds = 25v c oss output capacitance ? 340 ? p f f = 1.0mhz c rss reverse transfer capacitance ? 85 ? na ? nh ns a measured from the center of drain pad to center of source pad c/w note: corresponding spice and saber models are available on the international rectifier website. www.irf.com 3 IRHNJ7130 table 1. electrical characteristics @ tj = 25c, post total dose irradiation parameter 100k rads(si) 1 300k - 1000k rads (si) 2 units test conditions min max min max bv dss drain-to-source breakdown voltage 100 ? 100 ? v v gs = 0v, i d = 1.0ma v gs(th) gate threshold voltage 2.0 4.0 1.25 4.5 v gs = v ds , i d = 1.0ma i gss gate-to-source leakage forward ? 100 ? 100 na v gs = 20v i gss gate-to-source leakage reverse ? -100 ? -100 v gs = -20 v i dss zero gate voltage drain current ? 25 ? 25 a v ds = 80v, v gs =0v r ds(on) static drain-to-source ? 0.19 ? 0.25 ? v gs = 12v, i d = 9.1a on-state resistance (to-3) r ds(on) static drain-to-source ? 0.18 ? 0.24 ? v gs = 12v, i d = 9.1a on-state resistance (smd-0.5) international rectifier radiation hardened mosfets are tested to verify their radiation hardness capability. the hardness assurance program at international rectifier is comprised of two radiation environments. every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the to-3 package. both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. 1. part number IRHNJ7130 2. part numbers irhnj3130, irhnj4130, irhnj8130 fig a. single event effect, safe operating area v sd diode forward voltage ? 1.5 ? 1.5 v v gs = 0v, i s = 14.4a international rectifier radiation hardened mosfets have been characterized in heavy ion environment for single event effects (see). single event effects characterization is illustrated in fig. a and table 2. radiation characteristics table 2. single event effect safe operating area 0 20 40 60 80 100 120 0 -5 -10 -15 -20 -25 vgs vds cu br ion let energy range v ds (v) (mev/(mg/cm 2 )) (mev) (m) @ v gs =0v @ v gs =-5v @ v gs =-10v @ v gs =-15v @ v gs =-20v cu 28 285 43 100 100 100 80 60 br 36.8 305 39 100 90 70 50 ? IRHNJ7130 pre-irradiation 4 www.irf.com 0.1 1 10 100 0.1 1 10 100 20s pulse width t = 25 c j top bottom vgs 15v 12v 10v 9.0v 8.0v 7.0v 6.0v 5.0v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 5.0v 0.1 1 10 100 0.1 1 10 100 20s pulse width t = 150 c j top bottom vgs 15v 12v 10v 9.0v 8.0v 7.0v 6.0v 5.0v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 5.0v 0.1 1 10 100 5 7 9 11 13 v = 50v 20s pulse width ds v , gate-to-source voltage (v) i , drain-to-source current (a) gs d t = 25 c j t = 150 c j -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d 12v 14.4a www.irf.com 5 IRHNJ7130 ! ! " " " #$ pre-irradiation 1 10 100 0 500 1000 1500 2000 v , drain-to-source voltage (v) c, capacitance (pf) ds v c c c = = = = 0v, c c c f = 1mhz + c + c c shorted gs iss gs gd , ds rss gd oss ds gd c iss c oss c rss 0 10 20 30 40 50 60 0 4 8 12 16 20 q , total gate charge (nc) v , gate-to-source voltage (v) g gs for test circuit see figure i = d 13 14 a v = 20v ds v = 50v ds v = 80v ds 1 10 100 1000 1 10 100 100 0 operation in this area limited by r ds(on) single pulse t t = 150 c = 25 c j c v , drain-to-source voltage (v) i , drain current (a) i , drain current (a) ds d 100us 1ms 10ms 0.1 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 v ,source-to-drain voltage (v) i , reverse drain current (a) sd sd v = 0 v gs t = 150 c j t = 25 c j IRHNJ7130 pre-irradiation 6 www.irf.com $ v ds 9 0% 1 0% v gs t d(on) t r t d(off) t f $ %& 1 0.1 % + - ' & ( )* " 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response) 25 50 75 100 125 150 0 3 6 9 12 15 t , case temperature ( c) i , drain current (a) c d www.irf.com 7 IRHNJ7130 q g q gs q gd v g charge d.u.t. v d s i d i g 3ma v gs .3 f 50k ? .2 f 12v current regulator same type as d.u.t. current sampling resistors + - +, ! -! %& & ' " . ( & %& . ( & t p v (br)dss i as r g i as 0.01 ? t p d.u.t l v ds + - v dd driver a 15v 20v pre-irradiation 25 50 75 100 125 150 0 100 200 300 400 starting t , junction temperature ( c) e , single pulse avalanche energy (mj) j as i d top bottom 6.4a 9.1a 14a v gs IRHNJ7130 pre-irradiation 8 www.irf.com pulse width 300 s; duty cycle 2% total dose irradiation with v gs bias. 12 volt v gs applied and v ds = 0 during irradiation per mil-std-750, method 1019, condition a total dose irradiation with v ds bias. 80 volt v ds applied and v gs = 0 during irradiation per mll-std-750, method 1019, condition a repetitive rating; pulse width limited by maximum junction temperature. v dd = 25v, starting t j = 25c, l= 1.4mh, peak i l = 14.4a, v gs = 12v i sd 14.4a, di/dt 395a/ s, v dd 100v, t j 150c footnotes: case outline and dimensions ? smd-0.5 ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 ir leominster : 205 crawford st., leominster, massachusetts 01453, usa tel: (978) 534-5776 tac fax: (310) 252-7903 visit us at www.irf.com for sales contact information . data and specifications subject to change without notice. 05/2006 pad assignments 1- drain 2- gate 3- source |
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