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| QFN-24 packaging information reference pattern layout dimensions packaging information / reference pattern layout dimensions unit: mm note : reference metal mask design 789 1 2 3 4 5 6 1 pin indent 4.00.10 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 2.80.05 0.400.05 0.075 0.50 2.70 0.30 3.20 4.60 3.30 4.50 0.50 1.10 2.50 1.10 0.25
QFN-24 reel taping specifications taping specifications unit: mm 178.00.5 600.5 0.2 0.2 0.8 0.6 0.4 0.6 0.4 0.8 1.750.1 5.50.05 12.00.3 (4.35) direction of feed direction of feed r type :[device orientation : right] standard feed l type :[device orientation : left] reverse feed QFN-24 power dissipation power dissipation data for the QFN-24 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm (1600mm 2 ) board structure: 4 copper layers each layer is 50% connected to the package heat-sink. material: glass epoxy (fr-4) thickness: 1.0 mm through-hole: 4 x 0.4 diameter 2. power dissipation vs. ambient temperature ambient temperature power dissipation pd mw thermal resistance (/ w) 25 1500 85 600 66.67 2.54 1.4 40.0 40.0 2.5 28.9 28.9 pd-ta? 0 200 400 600 800 1000 1200 1400 1600 25 45 65 85 105 125 ??ta S?p?pdmw pd vs. ta ambient temperature ta( ) power dissi p ation pd ( mw ) rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??` ~? lead frame copper alloy ?I U?`?? lead plating lead(pb) free solder plating ? ? die attach epoxy ???? au bonding wire ?? si silicon chip ?? `` marking laser marking ?? except the side of the terminals. QFN-24 QFN-24 perspective ver.00 |
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