View TGA2618_8131552.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 1 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com applications ? commercial and military radar ? satellite communications product features ? frequency range: 16 - 18 ghz ? nf: 2.3 db ? small signal gain: 28 db ? return loss: > 9 db ? p1db: 6 dbm ? p sat = 10 dbm at p in = - 10 dbm ? otoi: 1 3 dbm ( pout/tone = - 2 dbm ) ? bias: v d = 3 v, i dq = 3 0 ma, v g = - 0.6 v ? chip dimensions : 2.1 x 1.1 x 0. 1 mm functional block diagram p ad configuration p ad no. symbol 1 rf in 2 v g 3 v d 4 rf out ordering information part eccn description TGA2618 ear99 16 - 18 ghz gan lna general description triquints tga261 8 is a ku - band low noise amplifier fabrica ted on triquints tqpht15 0.15 m gaas phemt process . the TGA2618 operates from 16 to 18 ghz and typically provides 6 dbm p1db, 2 8 db of small signal gain and 1 3 dbm otoi with 2.3 db nf . the tga261 8 is ideally suited to support both radar and sate llite communications as either an lna or a general purpose gain block. both rf ports have intergraded dc blocking caps a nd are fully matched to 50 ohms allowing for simple system integration. lead - free and rohs compliant evaluation boards are available upon request. 4 3 1 2
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 2 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com absolute maximum ratings parameter value drain voltage (v d ) 6 v gate voltage range (v g ) - 2 to 0 v drain current (i d ) 7 0 ma gate current (i g ) - 0.5 to 6 ma power dissipation , 85 c (p diss ) 0.3 w input power , cw, 50 , (p in ) 0 dbm channel temperature (t ch ) 20 0 c mounting temperature (30 seconds) 32 0 c storage temperature - 55 to 150 c operation of this device outside the parameter ranges given above may cause permanent damage. these are stress ratings only, and functional operation of the device at these conditions is not implied. recommended operating conditions parameter value drain voltage (v d ) 3 v drain current (i d q ) 30 m a gate voltage (v g ) - 0.6 v typical temperature (t base ) - 40 to 85 c electrical specifications are measured at specified test conditions. specifications are not guaranteed overall operating conditions. electrical specifications test conditions unless otherwise noted: 25 0 c, v d = 3 v, i d q = 30 m a, v g = - 0.6 v , cw parameter min typical max units operational frequency range 16 18 ghz small signal gain 28 db noise figure 2. 3 db input return loss > 9 db output return loss > 1 0 db output power at 1 db gain compression 6 dbm output toi at pout/tone = - 2 dbm 1 3 dbm gain temperature coefficient - 0.0 3 db/c noise figure temperature coefficient 0.007 db/c
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 3 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com thermal and reliability information parameter test conditions value units thermal resistance ( jc ) (1) t base = 85 c, v d = 3 v (cw) i dq = 30 ma , p diss = 0.09 w 96 oc/w channel temperature (t ch ) ( without rf ) 94 c median lifetime (t m ) 1.3 x 10^ 9 hrs thermal resistance ( jc ) (1) t base = 85 c, v d = 3 v (cw) i dq = 30 ma, i d_drive = 50 ma p in = - 10 dbm, p out = 10 dbm, freq = 17 ghz, p diss = 0.14 w 96 oc/w channel temperature (t ch ) (under rf drive) 98 c median lifetime (t m ) 7.5 x 10^8 hrs notes: 1. thermal resistance calculated at back of a 40 mil cumo carrier plate with 1.5 mil of ausn solder for die attach. test conditions: v d = 6 v; failure criteria is 10% reduction in i d_max 1e+03 1e+04 1e+05 1e+06 1e+07 1e+08 1e+09 1e+10 1e+11 1e+12 1e+13 1e+14 1e+15 25 50 75 100 125 150 175 200 median lifetime, t m (hours) channel temperature, t ch ( c) median lifetime vs. channel temperature fet5
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 4 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com typical performance : small signal conditions unless otherwise specified: v d = 3 v, i dq = 3 0 ma, v g = - 0.6 v , cw 2.00 2.25 2.50 2.75 3.00 15.0 15.5 16.0 16.5 17.0 17.5 18.0 noise figure (db) frequency (ghz) noise figure vs. freq. vs. i dq 15 ma 30 ma 45 ma temp = 25 c 20 23 26 29 32 15 16 17 18 19 20 s21 (db) frequency (ghz) gain vs. frequency vs. temperature - 45 c 25 c 85 c 20 23 26 29 32 15 16 17 18 19 20 s21 (db) frequency (ghz) gain vs. frequency vs. drain current 15 ma 30 ma 45 ma temp = 25 c 2.00 2.25 2.50 2.75 3.00 15.0 15.5 16.0 16.5 17.0 17.5 18.0 noise figure (db) frequency (ghz) noise figure vs. freq. vs. temperature 25 c 85 c -30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0 15 16 17 18 19 20 s11 (db) frequency (ghz) input return loss vs. frequency vs. temp. - 45 c 25 c 85 c -30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0 15 16 17 18 19 20 s22 (db) frequency (ghz) output return loss vs. frequency vs. temp. - 45 c 25 c 85 c
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 5 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com typical performance: linearity conditions unless otherwise specified: v d = 3 v, i dq = 30 ma, v g = - 0.6 v, cw 6 8 10 12 14 16 18 16.0 16.5 17.0 17.5 18.0 otoi (dbm) frequency (ghz) otoi vs. frequency vs. temperature 85 c 25 c pout/tone = - 2 dbm, 10 mhz tone spacing -75 -70 -65 -60 -55 -50 -45 -40 -35 -30 -25 -6 -4 -2 0 2 4 6 im5 (dbc) output power/tone (dbm) im5 vs. output power vs. frequency 18 ghz 17 ghz 16 ghz temp = 25 c, 10 mhz tone spacing 6 8 10 12 14 16 18 16.0 16.5 17.0 17.5 18.0 otoi (dbm) frequency (ghz) otoi vs. frequency vs. drain current pin/tone = - 23 dbm, 10 mhz tone spacing 45 ma 30 ma 15 ma -40 -35 -30 -25 -20 -15 -6 -4 -2 0 2 4 6 im3 (dbc) output power/tone (dbm) im3 vs. output power vs. frequency 18 ghz 17 ghz 16 ghz temp = 25 c, 10 mhz tone spacing -40 -35 -30 -25 -20 -15 -6 -4 -2 0 2 4 6 im3 (dbc) output power/tone (dbm) im3 vs. output power vs. temperature 17 ghz, 10 mhz tone spacing 85 oc 25 oc 25 30 35 40 45 50 55 60 -30 -25 -20 -15 -10 -5 0 drain current (ma) input power (dbm) drain current vs. input power vs. frequency 16 ghz 17 ghz 18 ghz temp = 25 c
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 6 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com typical performance: large signal conditions unless otherwise specified: v d = 3 v, i dq = 30 ma, v g = - 0.6 v, cw -6 -3 0 3 6 9 12 15 -30 -25 -20 -15 -10 -5 0 output power (dbm) input power (dbm) output power vs. input power vs. freq. 16 ghz 17 ghz 18 ghz temp = 25 c -6 -3 0 3 6 9 12 15 -30 -25 -20 -15 -10 -5 0 output power (dbm) input power (dbm) output power vs. input power vs. temp. 25 c 85 c freq = 17 ghz 15 18 21 24 27 30 -30 -25 -20 -15 -10 -5 0 gain (db) input power (dbm) gain vs. input power vs. freq. 16 ghz 17 ghz 18 ghz temp = 25 c 15 18 21 24 27 30 -30 -25 -20 -15 -10 -5 0 gain (db) input power (dbm) gain vs. input power vs. temp. 25 c 85 c freq = 17 ghz 3 4 5 6 7 8 9 16.0 16.5 17.0 17.5 18.0 p1db (dbm) frequency (ghz) p1db vs. frequency vs. temperature 25 c 85 c 9 10 11 12 13 14 16.0 16.5 17.0 17.5 18.0 p sat (dbm) frequency (ghz) p sat vs. frequency vs. temperature 25 c 85 c p in = - 10 dbm
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 7 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com application information bias - up procedure 1. set i d limit to 7 0 ma, i g limit to 6 ma 2. apply - 2 v to v g for pinch off 3. apply + 3 v to v d 4. adjust v g more positive until i dq = 3 0 ma (v g ~ - 0.6 v typical) 5. apply rf signal bias - down procedure 1. turn off rf signal 2. reduce v g to - 2 v. ensure i dq ~ 0ma 3. set v d to 0v 4. turn off v d supply 5. turn off v g supply c4 10 nf r1 5 ohms c6 1 uf c1 1 nf c3 10 nf rf in rf out r2 5 ohms c5 1 uf v g v d c2 1 nf
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 8 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com assembly drawing bill of material reference des. value description manuf. part number c1, c2 1 nf single - layer ceramic capcitor various c3, c4 10 nf single or multi - layer ceramic capacitor (may also use 0.01 f smt capacitors) various c5 , c6 1 f 1206 smt c apacitor various r1 , r2 5 ohms smt resistor various c1 1 nf c2 1 nf c3 10 nf c4 10 nf v d v g 1 2 3 4 5 6 rf out rf in r1 5 ohms c6 1 uf r2 5 ohms c5 1 uf
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 9 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com mechanical information units: millimeters thickness: 0.10 die x,y size tolerance : 0.05 0 ground is backside of die rf i n and rf out pads are symmetric pad description p ad no. symbol description pad size 1 rf in input; matched to 50 ; dc blocked 0.205 x 0.1 mm 2,3 n/c do not connect 0.1 x 0.1 mm 4 v g gate voltage; bias network is required; see recommended application information above. 0.1 x 0.1 mm 5 v d drain voltage; bias network is required; see recommended application information above. 0.1 x 0.1 mm 6 rf out output; matched to 50 ; dc blocked 0.205 x 0.1 mm
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 10 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com assembly notes component placement and adhesive attachment assembly notes: ? vacuum pencils and/or vacuum collets are the preferred method of pick up. ? air bridges must be avoided during placement. ? the force impact is critical during auto placement. ? organic attachment (i.e. epoxy) can be used in low - power applications. ? curing should be do ne in a convection oven; proper exhaust is a safety concern. solder attachment reflow process assembly notes: ? use ausn (80/20) solder and limit exposure to temperatures above 300c to 3 to 4 minutes, maximum. ? an alloy station or conveyor furnace with redu cing atmosphere should be used. ? do not use any kind of flux. ? coefficient of thermal expansion matching is critical for long - term reliability. ? devices must be stored in a dry nitrogen atmosphere. organic adhesive attachment assembly notes: ? organic adhesive s s uch as ablebond 84 - 1, or equivalent, can be used. ? epoxies cure at temperatures of 100 to 200c. interconnect process assembly notes: ? thermosonic ball bonding is the preferred interconnect technique. ? force, time, and ultrasonics are critical parameters. ? aluminum wire should not be used. ? device s with small pad sizes should be bonded with 0.0007 - inch wire.
t ga2618 16 - 18 ghz ga as lna preliminary datasheet: rev - 09 - 09 - 1 4 - 11 of 11 - disclaimer: subject to change without notice ? 201 4 triquint www.triquint.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change witho ut notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent r ights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving , or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint : web: www.triquint.com tel: +1. 972 . 994 . 8465 email: info - sales@triquint.com fax: +1. 972 . 994 . 8504 for tech nical questions and application information: email: info - products@triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: tbd value: tbd test: human body model (hbm) standard: jedec standard jesd22 - a114 rohs - compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level tbd at tbdc convection reflow the part is rated moisture sensitivity level tbd at tbdc per jedec standard ipc/jedec j - std - 020. eccn us department of commerce: ear99

▲Up To Search▲

Price & Availability of TGA2618

	To Download TGA2618 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .