cystech electronics corp. spec. no. : c457e3 issued date : 2008.10.23 revised date :2010.05.21 page no. : 1/5 MBR20100AE3 cystek product specification 20amp. schottky barrier rectifiers i f(av) 2 10a MBR20100AE3 v rrm 100v tj 175 c v f 0.67v features ? low v f and low i r type ? metal silicon junction, major carrier conduction ? high current capability ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? high temperature soldering guaranteed : 260 /10s, 0.25?(6.35mm) from case ? for use in low voltage, high frequency inverters, free wheeling, and polarit y protection application ? rohs compliant package mechanical data ? case: jedec to-220ab molded plastic ? mounting position: any ? weight: 0.08 ounce, 2.24 grams ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? mounting torque : 5 in-lbs max equivalent circuit outline MBR20100AE3 to-220ab a k a
cystech electronics corp. spec. no. : c457e3 issued date : 2008.10.23 revised date :2010.05.21 page no. : 2/5 MBR20100AE3 cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 100 v maximum rms voltage v rms 70 v maximum dc blocking voltage v dc 100 v i f =10a, t c =25 0.85 i f =10a, t c =125 0.67 0.75 i f =20 a, t c =25 0.95 maximum instantaneous forward voltage at (note 1) i f =20a, t c =125 v f 0.85 v per diode 10 maximum average forward rectified current @ t c =145 per device i f(av) 20 a peak repetitive forward current (rated v r , square wave, 20khz) @t c =135 i frm 20 a peak forward surge curr ent @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 150 a peak repetitive reverse surge current (note 1 ), t j <175 i rrm 3.0 a v r =100 v, t c =25 5.0 a maximum instantaneous reverse current at v r =100 v, t c =125 i r 1.0 ma voltage rate of change, (rated v r ) dv/dt 10,000 v/ s typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 260 pf esd susceptibility (note 2) 8000 v storage temperature range t stg -55 +175 operating junction temperature range t j -65 +175 notes : 1. 2.0 s pulse width, f=1.0khz 2. human body model, 1.5k in series with 100pf thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 2 c/w maximum thermal resistance, junction-to-ambient r th,j-a 60 c/w ordering information device package shipping marking MBR20100AE3 to-220ab (rohs compliant package) 50 pcs / tube, 40 tubes/box 20100a
cystech electronics corp. spec. no. : c457e3 issued date : 2008.10.23 revised date :2010.05.21 page no. : 3/5 MBR20100AE3 cystek product specification characteristic curves forward current derating curve 0 5 10 15 20 25 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load maximum non-repetitive forward surge current 0 50 100 150 200 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) tj=150, 8.3ms single half sine wave, jedec method, per leg forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 per leg junction capacitance vs reverse voltage 100 1000 0.1 1 10 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (a) tj=75 tj=25 tj=125 per leg
cystech electronics corp. spec. no. : c457e3 issued date : 2008.10.23 revised date :2010.05.21 page no. : 4/5 MBR20100AE3 cystek product specification to-220ab dimension (c forming) style: pin 1.anode 2.cathode 3.anode 3-lead to-220ab plastic package cystek package code: e3 marking: date code device name *: typical ? inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.176 0.184 4.470 4.670 e1 0.475 0.491 12.060 12.460 a1 0.099 0.111 2.520 2.820 e *0.100 *2.540 b 0.028 0.036 0.710 0.910 e1 0.196 0.204 4.980 5.180 b1 0.046 0.054 1.170 1.370 f 0.102 0.114 2.590 2.890 c 0.012 0.021 0.310 0.530 l 0.528 0.543 13.400 13.800 c1 0.046 0.054 1.170 1.370 l1 0.140 0.156 3.560 3.960 d 0.394 0.406 10.010 10.310 0.147 0.155 3.735 3.935 e 0.335 0.350 8.500 8.900 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc ; tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0
cystech electronics corp. spec. no. : c457e3 issued date : 2008.10.23 revised date :2010.05.21 page no. : 5/5 MBR20100AE3 cystek product specification to-220ab dimension (m forming) style: pin 1.anode 2.cathode 3.anode 3-lead to-220ab plastic package cystek package code: e3 marking: device name cys 20100a date code *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.170 0.180 4.320 4.570 e1 0.478 0.508 12.140 12.900 a1 0.100 0.110 2.540 2.790 e *0.100 *2.540 b 0.028 0.036 0.710 0.910 e1 0.200 bsc 5.080 bsc b1 0.045 0.055 1.150 1.390 f 0.102 0.112 2.600 2.840 c 0.014 0.021 0.360 0.530 l 0.530 0.550 13.470 13.970 c1 0.048 0.054 1.220 1.370 l1 0.130 0.150 3.310 3.810 d 0.395 0.410 10.040 10.410 0.149 0.153 3.790 3.880 e 0.335 0.375 8.509 9.520 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc ; tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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