cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 1/7 HBNP45C6 c y s t ek product s pecification general purpose npn / pnp epitaxial planar transistors (dual transistors) HBNP45C6 features ? includes a btc2412 chip and a bta1037 chip in a sot-563 package. ? mounting possible with sot-523 automatic mounting machines. ? transistor elements are indepe ndent, eliminating interference. ? mounting cost and area can be cut in half. ? pb-free lead plating an d halogen-free package. equivalent circuit outline absolute maximum ratings (ta=25 c) limits sot-563 HBNP45C6 e1 b1 c2 c1 b2 e2 parameter symbol tr1 (npn) tr2 (pnp) unit collecto r -b ase v o ltage v cbo 60 -60 v collector-emitter voltage v ceo 50 -50 v emitter-base voltage v ebo 7 -6 v collector current i c 150 -150 ma power dissipation pd 150(total) *1 mw junction temperature tj 150 c storage temperature tstg -55~+150 c not e : * 1 12 0m w per el em ent m u st not be excee ded . http://
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 2/7 HBNP45C6 c y s t ek product s pecification characteristics (ta=25 c) ? tr1 (npn) symbol min. typ. max. unit test conditions bv cbo 60 - - v i c =100 a bv ceo 50 - - v i c =1ma bv ebo 7 - - v i e =50 a i cbo - - 0.1 a v cb =60v i ebo - - 0.1 a v eb =7v *v ce(sat) - 0.2 0.4 v i c =50ma, i b =5ma *h fe 200 - 600 v ce =6v, i c =1ma f t 80 180 - mhz v ce =12v, i c =2ma, f=100mhz cob - 2 3.5 pf v cb =12v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% ? tr2 (pnp) symbol min. typ. max. unit test conditions bv cbo -60 - - v i c =-50 a bv ceo -50 - - v i c =-1ma bv ebo -6 - - v i e =-50 a i cbo - - -0.1 a v cb =-60v i ebo - - -0.1 a v eb =-6v *v ce(sat) - -0.25 -0.5 v i c =-50ma, i b =-5ma *h fe 200 - 600 v ce =-6v, i c =-1ma f t 60 140 - mhz v ce =-12v, i c =-2ma, f=100mhz cob - 4 5 pf v cb =-12v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% ordering information device package shipping HBNP45C6-0-t1-g sot-363 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 3/7 HBNP45C6 c y s t ek product s pecification characteristic curves ? tr1 (npn) c u r r en t g a in v s c o ll ect o r c u r r e n t 100 1 000 0. 1 1 10 1 00 1000 c o l l ecto r c u r r e n t - - - i c ( m a ) cu rre nt g a i n--- hf e hfe@vce=6v saturation voltage vs collector current 10 10 0 100 0 0 . 1 1 10 1 00 1000 c o l l e c t o r c u r re n t --- ic (ma ) s a t u ra t i o n v o l t a g e ---( mv ) vce(sat)@ic=10ib s a t u ra t i on v o l t a g e v s c ol l e c t or c urre nt 100 1000 0. 1 1 10 1 00 1000 c o l l e c t o r c u rre nt --- ic ( m a ) s a t u ra t i o n v o l t a g e ---(mv ) vbe(sat)@ic=10ib c u to f f f r e q u en cy v s c o lle cto r c u r r e n t 10 100 1000 0. 1 1 10 100 c o l l e c t o r c u rre n t --- ic (ma ) c u t o ff f r e q ue nc y---f t ( m h z ) ft@vce=12v c a p a c ita n c e c h ar ac ter i s t i c s 1 10 10 0 0. 1 1 10 1 00 r e v e rs e - bi a s e d v o l t a g e ---(v ) c a p a c i t a nc e --- (p f ) ft=1mhz cib cob
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 4/7 HBNP45C6 c y s t ek product s pecification ? tr2 (pnp) cu rre nt g a i n vs c ol l e c t o r c urre nt 10 100 1 000 0. 1 1 10 10 0 1000 c o l l e c t or c u rre n t ---ic (ma ) curr e n t g a i n- -- hf e hfe@vce=6v s a t ura t i on v ol t a ge vs c o l l e c t or c urre n t 10 100 1000 0. 1 1 10 1 00 1 000 c o l l e c t o r c urre n t ---ic ( m a ) s a tu r a ti o n vo lta g e - - - ( m v) vce(sat)@ic=10ib s a t ura t i on v ol t a ge vs co l l e c t or curre n t 100 100 0 1000 0 0. 1 1 1 0 10 0 1 00 0 c o l l e c t o r c u rre n t ---i c ( ma ) s a tu r a tio n vo lta g e - - - ( m v) vbe(sat)@ic=10ib c u t o ff f r e q u e n c y vs c ol l e c t o r c urre nt 10 10 0 10 00 0. 1 1 10 100 c o l l e c t or c u rre n t ---ic (ma ) cut of f f r e que nc y- - - f t ( m h z ) ft@vce=12v c a p a cit a n ce c h ar a c te r i s t ics 1 10 100 0. 1 1 10 1 00 r e v e rs e -b i a s e d v o l t a g e ---(v ) c a p a c i t a nc e ---( p f ) ft=1mhz cib cob power derating curves 0 20 40 60 80 100 120 140 160 0 50 100 150 200 ambient temperature --- ta( ) power dissipation---pd(mw) dual single
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 5/7 HBNP45C6 c y s t ek product s pecification reel dimension carrier tape dimension
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 6/7 HBNP45C6 c y s t ek product s pecification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cys t ech electronics corp. s pec. no. : c901 c6 issued date : 20 12.09.28 revised date : page no. : 7/7 HBNP45C6 c y s t ek product s pecification sot-563 dimension inches millimeters marking: product code date code: y ear+month y ear: 6 2006, 7 20 07 month: 1 1, 2 2, ??? 9 9, a 10, b 11 , c 12 45 6-lead sot-563 plastic surface mounted package cystek package code: c6 st y l e : pin 1. emitter1 (e1) pin 2. base1 (b1) pin 3. colle ctor2 (c2 ) pin 4. emitter2 (e2) pin 5. base2 (b2) pin 6. collector1 ( c1 ) inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.021 0.024 0.525 0.600 b 0.007 0.011 0.170 0.270 a1 0.000 0.002 0.000 0.050 e1 0.043 0.051 1.100 1.300 e 0.018 0.022 0.450 0.550 e 0.059 0.067 1.500 1.700 c 0.004 0.006 0.090 0.160 l 0.004 0.012 0.100 0.300 d 0.059 0.067 1.500 1.700 7 ref 7 ref notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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