![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
geometry principal device type ctltvs12 gross die per 5 inch wafer 368,512 process CPZ37R transient voltage suppressor 12 volt tvs chip process details die size 6.7 x 6.7 mils die thickness 3.54 mils anode bonding pad area 4.3 x 4.3 mils top side metalization al - 13,000? back side metalization au-as/ag - 13,000?/6,000? www.centralsemi.com r0 (16-march 2012)
|
Price & Availability of CPZ37R
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |