DM3030-w2455bet rev:1 page:1/9 acx advanced ceramic x features ? combined function of tx/rx switch, and two diplexers ? small, low profile smd ? rohs compliant applications ? wlan a/b/g modules part number ? type dm : diplexer module ? dimensions ( l w ) 3.0 3.0 mm ? material code w ? frequency range 2455=2400mhz /5500mhz ? specification code be ? packaging t: tape & reel b: bulk electrical specifications frequency range (mhz) fo 2400~2500mhz insertion loss (db) txg - ant 1.5 max. 48.0 min. @ 2 fo mhz attenuation (db) txg - ant 30.0 min. @ 3 fo mhz return loss (db) txg & ant 14.0 min. 38.0 min. @ 4.8 ~ 5.0ghz rxa - txg 32.0 min. @ 7.2 ~ 7.5ghz 20.0 min. @ 4.8 ~ 5.0ghz txa - txg 20.0 min. @ 7.2 ~ 7.5ghz 20.0 min. @ 4.8 ~ 5.0ghz rxg - txg 20.0 min. @ 7.2 ~ 7.5ghz rxg - txg 20.0 min. @ 2.4 ~ 2.5ghz tx mode isolation (db) ant - rxg 19.0 min. @ 2.4 ~ 2.5ghz frequency range (mhz) fo 2400~2500mhz insertion loss (db) ant - rxg 1.5 max. rx mode return loss (db) rxg & ant 11.0 min. DM3030 series multilayer chip diplexer module dm 3030 - w 2455 be ? ? ? ? ? ? ?
DM3030-w2455bet rev:1 page:2/9 acx advanced ceramic x frequency range (mhz) fo 4900~5875mhz insertion loss (db) txa - ant 2.0 max. 20.0 min. @ 2 fo mhz attenuation (db) txa - ant 15.0 min. @ 3 fo mhz return loss (db) txa & ant 10.0 min. rxg - txa 40.0 min. @ 2.4 ~ 2.5ghz txg - txa 20.0 min. @ 2.4 ~ 2.5ghz rxa - txa 20.0 min. @ 2.4 ~ 2.5ghz rxa - txa 16.0 min. @ 4.9 ~ 5.875ghz tx mode isolation (db) ant - rxa 16.0 min. @ 4.9 ~ 5.875ghz frequency range (mhz) fo 4900~5875mhz insertion loss (db) ant - rxa 2.0 max. rx mode return loss (db) rxa & ant 11.0 min. operating temperature range : -30 ~ +85 o c storage temperature range : +5 ~ +35 o c, humidity 45~75%rh storage period : 6 months max. q?ty/reel (pcs) : 2,000 mode vrx vtx txg or txa active 0~0.3 v 3.0~3.6 v rxg or rxa active 3.0~3.6 v 0~0.3 v terminal configuration no. terminal name no. terminal name (1) gnd (11) gnd (2) rxg (12) gnd (3) rxa (13) vrx (4) gnd (14) gnd (5) txa (15) gnd (6) gnd (16) txg (7) gnd (17) gnd (8) vtx (18) gnd (9) gnd (19) gnd (10) ant (20) gnd (8) (7) (6) (5) (9) (10) (11) (12) (4) (3) (2) (1) (13) (14) (15) (16) (18) (19) (20) (17)
DM3030-w2455bet rev:1 page:3/9 acx advanced ceramic x dimensions and recommended pc board pattern mark dimensions mark dimensions l 3.0 ? 0.2 c2 0.65 ? 0.1 w 3.0 ? 0.2 d1 0.35 ? 0.1 t 1.1 max. d2 0.35 ? 0.1 a1 0.25 ? 0.1 e1 0.1 + 0.2 / -0.1 a2 0.25 ? 0.1 e2 0.1 + 0.2 / -0.1 b1 0.25 ? 0.1 f1 0.3 ? 0.1 b2 0.25 ? 0.1 f2 0.3 ? 0.1 c1 0.65 ? 0.1 g 0.2 typ. unit : mm bottom view top view side view t l w land pattern c2 a1 b1 e1 c1 a2 b2 e2 f2 f1 g g d2 d1 0.65 0.25 0.1 0.25 0.1 0.65 0.3 0.25 0.25 0.2 0.2 0.3 0.25 0.25 0.35 0.35
DM3030-w2455bet rev:1 page:4/9 acx advanced ceramic x circuit block measuring diagram * dc-blocking capacitance: 15pf rx g sw diplexer diplexer rx a tx g tx a vtx gnd top view 1 2 3 4 8 7 6 5 rx g rx a ant gnd gnd gnd gnd gnd gnd gnd 12 11 10 9 tx a 13 14 15 16 tx g vrx gnd
DM3030-w2455bet rev:1 page:5/9 acx advanced ceramic x 246810121416 018 -50 -40 -30 -20 -10 -60 0 freq, ghz db(att_ant_txa) db(att_ant_txg) 2 4 6 8 10 12 14 16 018 -30 -20 -10 -40 0 freq, ghz db(rl_tx_ant) db(rl_txa) db(rl_txg) 246810121416 018 -60 -40 -20 -80 0 freq, ghz db(iso_txa_txg) db(iso_rxa_txg) 2 4 6 8 10 12 14 16 018 -60 -40 -20 -80 0 freq, ghz db(iso_rxg_txg) db(iso_ant_rxg) 246810121416 018 -60 -40 -20 -80 0 freq, ghz db(iso_txa_txg) db(iso_rxg_txa) 246810121416 018 -60 -40 -20 -80 0 freq, ghz db(iso_rxa_txa) db(iso_ant_rxa) 246810121416 018 -50 -40 -30 -20 -10 -60 0 freq, ghz db(att_ant_rxa) db(att_ant_rxg) 2 4 6 8 10 12 14 16 018 -30 -20 -10 -40 0 freq, ghz db(rl_rx_ant) db(rl_rxa) db(rl_rxg) typical electrical characteristics (t=25 o c) tx mode rx mode notes ? the contents of this data sheet are subject to change without notice. please confirm the specifications and delivery conditions when placing your order. ? products should be properly treated at all situations from esd potential resulting from human, equipments or other possible esd sources.
DM3030-w2455bet rev:1 page:6/9 acx advanced ceramic x taping specifications ? tape dimensions (unit: mm) & quantity ? reel dimensions (unit: mm) ? leader and trailer tape type a a? b c d e f t quantity/reel tape material 3030 4.0 0.1 4.0 0.1 3.35 0.1 3.35 0.1 2.0 0.1 3.5 0.1 8.0 0.1 1.30 0.10 2,000pcs plastic (embossed) type a b 3030 2.3 0.5 9.00.3 601 178 1 13.5 0.5 a label label: customer?s name, acx p/n, q?ty, date, acx corp. 1.4 0.2 b a? d f e 1.75 0.1 a b emboss tape t c O O trailer end empty compartments with cover tape (500 mm min.) trailer (160 mm min.)
DM3030-w2455bet rev:1 page:7/9 acx advanced ceramic x ? marking ? product lot code year year 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 code 1 2 3 4 5 6 7 8 9 0 month month jan. feb. mar. apr. may jun. jul. aug. sep. oct. nov. dec. code 1 2 3 4 5 6 7 8 9 a b c serial no. from 01~99. ? peel-off force peel-off force should be in the range of 0.1 ? 0.6 n at a peel-off speed of 30010 mm/min . ? storage conditions (1) temperature: 15 ~35 , relative humidity (rh): 45~75%. (2) non-corrosive environment. (3) products should be properly treated at all situations from esd potential resulting from human, equipments or other possible esd sources. notes ? the contents of this data sheet are subject to change with out notice. please confirm the specifications and delivery conditions when placing your order. peeling direction top cover tape carrier tape <10 0 ?
DM3030-w2455bet rev:1 page:8/9 acx advanced ceramic x mechanical & environmental characteristics item requirements procedure solderability 1. no apparent damage 2. more than 95% of the terminal electrode shall be covered with new solder 1. preheat: 120 ? 5 o c 2. solder: 245 ? 5 o c for 5 ? 1 sec soldering strength (termination adhesion 1. 9.8n minimum 1. solder specimen onto test jig. 2. a pply push force at 0.5mm/s until electrode pads are peeled off or ceramic are broken. pushing force is applied to longitude direction deflection (substrate bending) 1. no apparent damage 1. solder specimen onto test jig (fr4, 1.6mm) using the recommend soldering profile. 2. apply a bending force of 2mm deflection 3. time 10sec heat/humidity resistance 1. no apparent damage 2. fulfill the electrical specification after test 1. temperature: 85 ? 2 o c 2. humidity: 90% ~ 95% rh 3. duration: 100048hrs 4. recovery: 1-2hrs thermal shock (temperature cycle) 1. no apparent damage 2. fulfill the electrical specification after test 1. one cycle/step 1 125 5 ? c for 30 min step 2 - 40 5 ? c for 30 min 2. no of cycles 100 3. recovery:1-2 hrs low temperature resistance 1. no apparent damage 2. fulfill the electrical specification after test 1. temperature: -40 o ? 5 o c 2. duration: 500 24hrs 3. recovery: 1-2hrs 90mm pressure rod r230
DM3030-w2455bet rev:1 page:9/9 acx advanced ceramic x soldering conditions ? typical soldering profile for lead-free process reflow soldering : notes ? the contents of this data sheet are subject to change with out notice. please confirm the specifications and delivery conditions when placing your order. temperature ( o c) pre-heating 60-180s time (s.) 10s max. 250 o c 150-200 o c 217 o c 60-150s. advanced ceramic x corp. 16 tzu chiang road, hsinchu industrial district hsinchu hsien 303, taiwan tel:886-3-5987008 fax:886-3-5987001 e-mail: acx@acxc.com.tw http://www.acxc.com.tw
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