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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays . 1/14 tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 www.rohm.co 3-phase brushless motor pre-driver BD63000MUV general description BD63000MUV is pre-driver of 3-phase brushless motor. it generates a driving signal from the hall sensor and drives pwm through the input control signal. since there is a built-in booster circuit, nch-nch mos transistors can be used on the external power transistor. in addition, the power supply can use 12v or 24v and it has various controls and protection functions built-in, making it useful for a variety of purposes. because it adopts small packages, it can also be used on small diameter motors. features ?? built-in 120 commutation logic circuit. ?? driving with nch-nch mos transistors. ?? pwm control mode (low side arm switching). ?? built-in power-saving circuit. ?? cw/ccw function. ?? short brake function. ?? fg output (open drain). ?? built-in protection circui t for current limiting, overheating, under voltage, over voltage, motor lock. applications ?? oa machines. ?? other general civil equipments. key specifications ?? power supply voltage rating: 30v ?? operating temperature r ange: -40c to +85c ?? stand-by current: 1.2ma(max.) ?? range of in-phase input voltage for hall input: v reg -1.7v(max.) ?? current limit detect voltage: 0.2v 10% ?? uvlo lock out voltage: 6.0v(typ.) ?? ovlo lock out voltage 1: 16.0v(typ.) ?? ovlo lock out voltage 2: 28.5v(typ.) package w(typ.) x d(typ.) x h(max.) vqfn028v5050 5.00mm x 5.00mm x 1.00mm typical application circuit hup hun hvp hvn hwp hwn enb cw brkb vcc fg gnd hu hv hw m uh rcl pwmb vreg lpe vg cp1 cp2 28 16 4 3 5 2 17 18 19 20 21 22 24 27 23 8 6 9 11 14 12 7 10 13 26 25 1 ul vh vl wh wl u v w 15 0.1f 0.1f 200 200 200 10k 47f 0.1f 0.01f 0.01f 0.01f 0.1f 0.1 1k 470pf 0.1f 0.1f 0.1f vqfn028v5050 fig.1 application circuit
2/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 pin configuration block diagram hup hun hvp hvn hwp hwn tsd uvlo logic enb cw brkb 6 vcc fg osc gnd uh rcl vreg pwmb vreg lpe charge pump vreg pre driver vg cp1 cp2 28 16 4 3 5 2 17 18 19 20 21 22 24 27 23 8 6 9 11 14 12 7 10 13 26 25 ovlo 1 ul vh vl wh wl u v w 15 pin description pin no. pin name function pin no. pin name function 1 fg fg output 15 rcl detect voltage input for over current 2 pwmb pwm input (negative logic) 16 gnd gnd 3 cw cw/ccw input (h:cw, l:ccw) 17 hup u phase hall input 4 enb enable (negative logic) 18 hun u phase hall input 5 brkb brake input (negative logic) 19 hvp v phase hall input 6 ul u phase lower output 20 hvn v phase hall input 7 u u phase output feedback 21 hwp w phase hall input 8 uh u phase upper output 22 hwn w phase hall input 9 vh v phase upper output 23 vreg vreg output (turn off at stand-by) 10 v v phase output feedback 24 lpe setting about motor lock protection and olvo (h/m/l input) 11 vl v phase lower output 25 cp1 charge pump setting 1 12 wl w phase lower output 26 cp2 charge pump setting 2 13 w w phase output feedback 27 vg charge pump output 14 wh w phase upper output 28 vcc power supply fig.3 block diagram fig.2 pin configuration (top view) cw enb brkb ul pwmb fg uh vh v vl wl w hvp hun hup gnd hvn hw p vcc vg cp2 cp1 lpe vreg u wh rcl hw n 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
3/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 description of operation 1) commutation logic (120 commutation) truth table cw (cw=h or open) ccw (cw=l) hu hv hw uh ul vh vl wh wl uh ul vh vl wh wl fg h l h pwm -------------------- pwm* h l l l h l pwm -------------------- pwm* l l l h l l pwm -------------------- pwm* l l h l h l l l pwm -------------------- pwm* l h h l l l pwm -------------------- pwm* h l l l h l pwm -------------------- pwm* l l h l h l pwm -------------------- pwm* l l pwm -------------------- pwm* h l l l hi-z l h h h l l l pwm -------------------- pwm* pwm -------------------- pwm* l l h l hi-z l l h l l h l pwm -------------------- pwm* l l pwm -------------------- pwm* h l hi-z * when pwmb=l pwm="h" when pwmb=h pwm="l". 2) enable input terminal (enb) output of each phase can be set to on/off (negative logic) through enb terminal. when applied voltage is below v ena , the motor is driven (enable), when applied voltage is v stby , the motor suspends (stand-by). stand-by mode has precedence to other control input signal, vreg output will be off. in addition, enb terminal is pulled up by internal power supply through a resistance of 100k ? (typ.) 30k ? . enb operation h or open stand-by l enable 3) pwm input terminal (pwmb) speed can be controlled by inputting pwm signal into pwmb terminal (negative logic). synchronous rectifier pwm can be realized through lower switching. when pwmb=" l", lo wer output that belongs to hall input logic is ?h?. when pwmb="h" or open, lower output is ?l?. when pwmb="h" or open status is detected 104s(typ.), the synchronous rectifier will be off. synchronous rectifier will be on through rising and falling edges of subsequent pwmb. additionally, pwmb terminal is pulled up by vreg through a resistance of 100k ? (typ.) 30k ? . pwmb low side output h or open l l h 4) brake input terminal (brkb) motor rotation can be quickly stopped by brkb terminal (negative logic). when brkb="l", lower output will short brake all "h". when brkb="h" or open, then short brake action will be released. what?s more, brkb terminal is pulled up by vreg through a resistance of 100k ? (typ.) 30k ? . brkb operation h or open normal l short brake 5) cw/ccw input terminal (cw) rotation direction can be switched with cw terminal. when cw="h" or open, the direction is cw, when cw="l", the direction will be ccw. though we do not recommend switching rotation direction when motor is rotating, if rotation direction is switched when rotating, the rotation speed will become hall frequency, which will be up to less than 40hz and it will be switched to set rotation direction after the action short brake. and the cw terminal is pulled up by vreg through a resistance of 100k ? (typ.) 30k ? . cw direction h or open cw l ccw
4/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 6) fg output fg output is reshaped hall u phase signal and output throug h fg terminal. it is not output in stand-by mode. in addition, because fg terminal is output from open drain, please use resistance of about 10k ? ~ 100k ? to pulled up from outside. 7) hall input hall input amplifier is designed with hysteresis ( 15mv(typ.) in order to prevent in correct action due to noise inside. so please set bias current for hall element to make am plitude of hall input voltage over minimum input voltage (v hallmin ). here, we recommend you to connect the ceramic capacitor with about 100pf ~ 0.01f between difference input terminals of hall amplifier. what?s more, because the in-phase input voltage range (v hallcm , 0v ~ vreg-1.7v(typ.)) is designed for hall input amplifier, so when bias to hall element, please set within this range. when hall inputs all become "h" or "l", detect circuit through hall input abnormalities to ma ke driver output all "l". 8) booster circuit there is built-in booster circuit used to drive upper nch mos transistor. vg terminals can produce a boost voltage (from the vcc voltage + 2 vf voltage (7v(typ.) reduced by internal regulator) through connecting capacitors between cp1-cp2 and between vg-vcc. we recommend c onnected condensers to be over 0.1f. in addition, because there is built-in protection circuit for in sufficient booster, when vg voltage is below v guvon (vcc+4v (typ.)), driver outputs will all be "l". 9) current limit circuit (cl circuit) output current limit (current limit: cl) circuit can be fo rmed by connecting a low resistor used for testing current between rcl terminal & gnd terminal. when rcl voltage is det ected over 0.2v(typ.), lower output will all become "l". it (32s(typ.)) resets automatically after a set amount of time. this action does not synchronize with the action that pwm signal is input into pwmb terminal. 10) thermal shut down circuit (tsd circuit) when chip temperature of driver ic rises and exceeds t he set temperature (175c(typ. )), the thermal shut down circuit (thermal shut down: tsd) begins working. at this ti me, the driver outputs all become "l". in addition, the tsd circuit is designed with hysteresis (25c( typ.)), therefore, when the chip temperature drop s, it will return to normal working condition. moreover, the purpose of the tsd circuit is to protect driver ic from thermal breakdown, therefore, temperature of this circuit will be over working temperature when it is started up. thus, thermal design should have sufficient margin, so do not take continuous use and action of the circuit as precondition. 11) under voltage lock out circuit (uvlo circuit) there is a built-in under voltage lock out circuit (under vo ltage lock out: uvlo circuit) used to ensure the lowest power supply voltage for drive ic to work and to prevent error action of ic. when vcc voltage declined to v uvl (6v (typ.)), all of the driv er outputs should be "l". at the same time, uvlo circuit is designed with hysteresis (1v(typ.)), so when vcc voltage reaches more than v uvh (7v(typ.)), it will enter normal working condition. 12) over voltage lock out circuit (ovlo circuit) there is built-in over voltage lock out circuit (over voltage lock out: ovlo circ uit) used to restrain rise of vcc voltage when motor decelerating. when lpe terminal is at ?m? and vcc voltage is over v ovh1 (16v(typ.)), and when lpe terminal is at ?h? or ?m? and vcc voltage of is over v ovh2 (28.5v(typ.)), a certain time (4ms(typ.)) of short brake action will be conducted. what?s more, because ovlo circui t is designed with hysteresis (1v(typ.)), therefore, when v ovh1 is below v ovl1 (15v(typ.)) and when v ovh2 is below v ovl2 (27.5v(typ.)), it can return to normal working condition after a certain time of short brake action. 13) motor lock protection circuit (mlp circuit) there is built-in motor lock protection circuit (motor lock protection: mlp), on/off of mlp circuit and ovlo threshold can be set from lpe terminal. m onitor hall signals, when the lpe = "h" or "m", if hall signal logic does not change to 1.1sec(typ.), driver outputs will all be locked as "l". latch can be released via standby status or through switching brkb/cw logic. moreover, when pwmb = "h" or open state is detected for about 15ms, latch can be released by rising and falling edges of subsequent pwmb . however, when lpe = "l", when short brake action (including switching rotation direction) enables or tsd ci rcuit works, mlp circuit doesn't work. and lpe terminal is pulled up by vreg through a resistance of 100k ? (typ.) 30 k ? . lpe monitoring time ovlo threshold h or open 1.1sec(typ.) 30% v ovh2 , v ovl2 m 1.1sec(typ.) 30% v ovh1 , v ovl1 l disable v ovh2 , v ovl2
5/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 14) pre-driver output driving signal is output to external output power transistor through drive signal generated from internal logic output drive signal is output for external power supply transist or. driving voltage of upper gat e is vg voltage (vcc+7v(typ.)) and driving voltage of lower gate is vreg voltage (5v(typ. )). in addition, a dead time (1s ~ 2s(typ.)) is designed between driving signals of upper gate and lower gate in order to prevent upper and lower fet from being set to on synchronously when pwm is rectified synchronously. due to t he influence of the motor?s c ounter electromotive force, the output feedback terminal might swing under gnd potenti al. when excessive current occurs (about over 30ma), incorrect action or even damage might be caused. t herefore, please insert a resistor of about 100 ? ~ 510 ? before putting into use. moreover, we recommend you to use out put feedback terminal with a slow rate of over 50ns. 15) control signal sequence though we recommend you input control signals of enb, cw, pwmb, brkb and lpe terminals after inputting vcc, if input control signals before inputting vcc, there won?t be any problem. if lpe terminal is set to "h" or "m" when being started, please be informed that if motor rotation cannot be detected within the set time (edge of fg signal cannot be input), then the mlp circuit starts and motor fails to start. moreover, the order of priority is set to control signal and ic internal signal. please refer to the following table. priority of control signal priority input / internal signals 1 st enb, uvlo 2 nd brkb?? ,cw ?? ,pwmb 3 rd tsd, mlp, hallerr 4 th ovlo 5 th vg_uvlo 6 th brkb 7 th cl 8 th pwmb, cw note ?? means rising and falling edges of signal. for signal name, please see state transition diagram.
6/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 absolute maximum ratings (ta=25c) item symbol limit unit power supply voltage v cc -0.3 to +30.0* 1 v vg voltage v g -0.3 to +38.0* 1 v v (uh,vh,wh) -0.3 to +38.0 v output voltage of pre-driver v (ul,vl,wl) -0.3 to +7.0 v fg terminal voltage v fg -0.3 to +7.0 v voltage of other output terminals v i/o -0.3 to +5.5 v output current of pre-driver i omax(out) 15* 1 ma fg output current i omax(fg) 5* 1 ma vreg output current i omax(vreg) -30* 1 ma operating tem perature range t opr -40 to +85 c storage temperature range t stg -55 to +150 c power dissipation pd 0.38* 2 w junction temperature t jmax 150 c *1 do not exceed pd. *2 ic only. derating in done at 3.04mw/c for operating above ta=25c. recommended operating range (ta=25c) item symbol range unit power supply voltage v cc 8.0 to 26.4 v
7/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 electrical characteristic (unless otherwise specified ta=25c, v cc =24v) limit item symbol min. typ. max. unit condition [whole] circuit current i cc - 2.5 5.0 ma v enb =0v stand-by current i stby - 0.6 1.2 ma enb=open vreg voltage v reg 4.5 5.0 5.5 v i o =-10ma [booster circuit] vg voltage v g v cc +6 v cc +7 v cc +8 v vg uvlo voltage v guvon v cc +3 v cc +4 v cc +5 v [driver output] high side output voltage h v ohh v g -0.6 v g -0.2 v g v i o =-5ma high side output voltage l v ohl 0 0.2 0.6 v i o =5ma low side output voltage h v olh 4.1 4.8 5.5 v i o =-5ma low side output voltage l v oll 0 0.2 0.6 v i o =5ma [hall input] input bias current i hall -2.0 -0.1 2.0 a v in =0v range of in-phase input voltage v hallcm 0 - v reg -1.7 v minimum input voltage v hallmin 50 - - mv p-p hys level v hallhy+ 5 15 25 mv hys level v hallhy- -25 -15 -5 mv [input of control enb] input current i enb -75 -45 -25 a v enb =0v standby voltage v stby 2.0 - v reg v enable voltage v ena 0 - 0.8 v [input of control pwmb, cw, brkb] input current i in -80 -50 -30 a v in =0v voltage input h v inh 2.0 - v reg v voltage input l v inl 0 - 0.8 v minimum input pulse width t plsmin 1 - - msec cw, brkb [input of control lpe e] input current i lpe -80 -50 -30 a v lpe =0v input voltage h v lph 0.8 v reg - v reg v input voltage m v lpm 0.4 v reg - 0.6 v reg v input voltage l v lpl 0 - 0.2 v reg v [fg output] output voltage l v fgol 0 0.1 0.3 v i o =2ma [current limit] detect voltage v cl 0.18 0.20 0.22 v [uvlo] release voltage v uvh 6.5 7.0 7.5 v lock out voltage v uvl 5.5 6.0 6.5 v [ovlo] release voltage1 v ovl1 14.0 15.0 16.0 v lpe="m" lock out voltage1 v ovh1 15.0 16.0 17.0 v lpe="m" release voltage2 v ovl2 26.5 27.5 28.5 v lpe="h" or "l" lock out voltage2 v ovh2 27.5 28.5 29.5 v lpe="h" or "l"
8/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 timing chart pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm pwm hall u hall v hall w fg cw direction (cw=h or open) ccw direction (cw=l) fg output hall u hall v hall w u v w u v w
9/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 state transition diagram legend: dir: motor rotational direction lp: motor lock protection lpc: internal counter for the motor lo ck protection (watch-dog timer) state transition f hall : hall signal frequency command signal hall error: hu=hv=hw &: logical "and" +: logical "or" note) all values are typical. detect hall edge & lpe=h or m within 1.1sec. run short brake (lpc=reset) brk brk ____ dir change cw f hall >40hz f hall <40hz f hall <40hz & brk ____ brkb dir lp timer (lpc=run, lpe=h or m only) lpe lpc reset hall edge undetected & lpe=h or m both side drivers off (lpc=reset) both side drivers off low side driver off tsd ____ tsd after 32 s over current hall error + vg_uvlo both side drivers off with latch lpc overflow dir change + brk + pwmb fall edge after pwmb=h over 15ms. stand-by (lpc=reset, driver off) enb=h ? vreg off enb ____ _____ enb & uvlo enb + uvlo ovlo short brake after 4ms hall error ________ vg_uvlo _________ & enb + uvlo
10/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 i/o equivalence circuits fg 5 pwmb brkb cw 100k 10k vreg enb 100k 10k internal reg lpe 100k 10k vreg 10k vcc vreg 145k 50k hup hun hvp hvn hwp hwn vreg 2k rcl 250k 2k vreg vg uh vh wh u v w 100k vreg ul vl wl 100k 35 internal reg cp1 20 cp2 20 vg vcc power dissipation package thermal resistor board j-a [c/w] board (4) 27.4 board (3) 38.3 board (2) 142.0 board (1) 328.9 note values about heat reducing curve and packaged thermal re sistor are tested values . 0.0 1.0 2.0 3.0 4.0 5.0 0 25 50 75 100 125 150 ambient temperature [c] pd [w] iv) 4 layers pcb (5505mm 2 ) iii) 4 lay ers pc b (10.29mm 2 ) ii) 1 layer pcb (0mm 2 ) i) package only *(): copper foil pattern area size pc b s iz e : 74.2mm x 74.2mm x 1.6mmt iv) 4.56w ii) 0.88w i) 0.38w iii) 3.26w fig.4 i/o equivalence circuits fig.5 derating curve (vqfn028v5050)
11/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus maki ng impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) connecting the power supply connector backward connecting of the power supply in reverse polarity c an damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. 3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are r educed at low temperatures. 4) gnd the potential of gnd pin must be minimum potential in all operating conditions. when using both small signal and large current gnd patterns, it is recommended to isolate th e two ground patterns, placing a single ground point at the application's reference point so that t he pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signa l ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. 5) metal on the backside (define the side wher e product markings are printed as front) the metal on the backside is shorted with the backside of ic chip therefore it should be connected to gnd. be aware that there is a possibility of malfunction or destruction if it is s horted with any potent ial other than gnd. 6) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipat ion (pd) in actual operating conditions. 7) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attent ion to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destructi on from short circuits which can be caused by foreign matter entering between output s or an output and the pow er supply or gnd. 8) operation in a strong electric field use caution when using the ic in the pr esence of a strong electromagnetic fiel d as doing so may cause the ic to malfunction. 9) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit) . if the chip temperature bec omes tjmax=150c, and higher, coil output to the motor will be open. the tsd circuit is de signed only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peripheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 175 25 10) inspection of the application board during inspection of the applicat ion board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, therefore an electrical disc harge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furt hermore, when connecting to the jig duri ng the inspection process, the power supply should first be turned off and t hen removed before the inspection.
12/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 11) input terminal of ic this ic is a monolithic ic, and between eac h element there is a p+ isolation fo r element partition and a p substrate. this p layer and each element?s n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 6, when gnd (pin a) at the resistance and gnd (pin b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (pin b) at the transistor (npn) the parasitic npn transistor operates with the n laye rs of other elements close to the aforementioned parasitic diode. because of the ic?s structure, the creation of parasitic elements is inevitabl e from the electrical potential relationship. the operation of parasitic elements causes interferenc e in circuit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes the para sitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation versi on of this document formal version takes priority n n n p + p + p p substrate gnd parasitic element resistor pin a n n p + p + p p substrate gnd parasitic element pin b transistor (npn) c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element fig.6 pattern diagram of parasitic element
13/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 ordering information b d 6 3 0 0 0 mu v -e 2 part number package muv: vqfn028v5050 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram (unit : mm) vqfn028v5050 0.08 s s 1pin mark 17 8 14 22 28 15 21 0.40.1 1.0 0.5 0.25 +0.05 -0.04 2.70.1 2.70.1 c0.2 5.00.1 5.00.1 0.02 +0.03 - 0.02 (0.22) 1.0max ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin vqfn028v5050 (top view) d63000 part number marking lot number 1pin mark
14/14 datasheet datasheet BD63000MUV tsz02201-0p2p0b000130-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.co tsz22111 ? 15? 001 revision history date revision changes 11.may.2012 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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