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42 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick 42 new generation 5-in-1 for multimediacard plus applicable to four memory card standards - sd memory card, multimediacard, multimediacard plus, memory stick and xd-picture card. push-push ejection mechanism applied in both card types. ? ? features for desktop pcs, notebook pcs, various personal digital assistants, digital still cameras, digital camcorders, digital photo frames, facsimile machines and printers. for home audio equipment (tvs and set top boxes) for audio systems for headphone players ? ? ? ? applications typical specifications product line memory stick standard mount / reverse mount surface mounting type push-push type 250v ac 1minute applicable media structure items specifications media ejection structure mounting type mounting style 10 ? to 60 ? 1,000m
min. 150m
max. 500m
max. 5,000cycles sd memory card multimediacard tm multimediacard plus tm xd-picture card operating temperature range performance contact resistance initial connector contacts detection switch insertion and removal cycle voltage proof insulation resistance initial standard mount reverse mount media ejection structure push-push type mounting system stand-off mm 0 product no. SCDG1a0101 SCDG2a0101 drawing no. 1 2 packing system taping new combine type connector (for sd memory card, multimediacard, multimediacard plus, memory stick, xd-picture card) SCDG series

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! 43 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module 43 combine type connector(for sd memory card, multimediacard, multimediacard plus, memory stick, xd-picure card) SCDG series pc board mounting hole dimensions viewed from the mounting face side 2 unit:mm no. style dimensions 1 number for pin assign 1sd #9 2sd #1 3 mmc plus #10 4sd #2 5 mmc plus #11 6sd #3 7sd #4 8 memorystick #10 9 memorystick #9 10 memorystick #8 11 memorystick #7 12 memorystick #6 number for pin assign 13 memorystick #5 14 memorystick #4 15 memorystick #3 16 memorystick #2 17 memorystick #1 18 sd #5 19 mmc plus #12 20 sd #6 21 mmc plus #13 22 sd #7 23 sd #8 24 sd sw.com number for pin assign 25 sd sw.cd 26 xd #1 27 xd #0(cd) 28 xd #2 29 xd #3 30 xd #4 31 xd #5 32 xd #6 33 xd #7 34 xd #8 35 xd #9 36 xd #10 number for pin assign 37 xd #11 38 xd #12 39 xd #13 40 xd #14 41 xd #15 42 xd #16 43 xd #17 44 xd #18 45 sd sw.wp number for pin assign 1sd #9 2sd #1 3 mmc plus #10 4sd #2 5 mmc plus #11 6sd #3 7sd #4 8 memorystick #10 9 memorystick #9 10 memorystick #8 11 memorystick #7 12 memorystick #6 number for pin assign 13 memorystick #5 14 memorystick #4 15 memorystick #3 16 memorystick #2 17 memorystick #1 18 sd #5 19 mmc plus #12 20 sd #6 21 mmc plus #13 22 sd #7 23 sd #8 24 sd sw.com number for pin assign 25 sd sw.cd 26 xd #1 27 xd #0(cd) 28 xd #2 29 xd #3 30 xd #4 31 xd #5 32 xd #6 33 xd #7 34 xd #8 35 xd #9 36 xd #10 number for pin assign 37 xd #11 38 xd #12 39 xd #13 40 xd #14 41 xd #15 42 xd #16 43 xd #17 44 xd #18 45 sd sw.wp
50 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick soldering conditions example of reflow soldering condition reference 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca k or cc t . 3. temperature profile surface of products 200 100 240 ? (max.) 230 ? (min.) 150 ? 180 ? time (s) 10 sec.(max.) 90 ? 30 sec. room temperature temperature (?c ) pre-heating heating time sec. 1. when soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. caution is therefore required. 2. avoid use of water-soluble soldering flux, since it may corrode the product. 3. check and conform to reflow soldering requirements under actual mass production conditions. 4. pc board warping may alter the characteristics. please take this into consideration when designing patterns and layout. 5. the card specifications are provided by the above manufactures. products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. cautions for using this product small memory card connectors

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