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data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 1 general description the ap3407/a is a 1.4mhz fixed frequency, current mode, pwm synchronous buck (step-down) dc-dc converter, capable of drivin g a 1.2a load with high efficiency, excellent line and load regulation. the device integrates synchronous p-channel and n-channel power mosfet switches with low on-resistance. it is id eal for powering portable equipment that runs from a single li-ion battery. a standard series of indu ctors are available from several different manufacturers optimized for use with the ap3407/a. this feature greatly simplifies the design of switch-mode power supplies. the ap3407/a is available in sot-23-5. features ? input voltage range: 2.5v to 5.5v ? output voltage: 0.6v to v in ? adj output ? fixed 1.4mhz frequency ? high efficiency up to 95% ? output current: 1.2a ? current mode control ? 100% duty cycle in dropout ? built-in over current protection ? built-in short circuit protection ? built-in thermal shutdown protection ? built-in uvlo function ? built-in soft-start applications ? datacom ? portable device ? smart phone figure 1. package type of ap3407/a sot-23-5
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 2 1 2 34 5 en gnd sw fb vin 1 2 34 5 vin gnd en sw fb pin configuration k package (sot-23-5) (for ap3407) (for ap3407a) figure 2. pin configuratio n of ap3407/a (top view) pin description pin number ap3407 ap3407a pin name function 1 3 en control input pin. forcing this pin above 1.5v enables the ic. forcing this pin below 0.4v shuts down the ic. when the ic is in shutdown mode, all functions are disabled to decrease the supply current below 1.2a 2 2 gnd ground pin 3 5 sw power switch output pin. inductor connection to drain of the internal pfet and nfet switches 4 1 vin supply input pin. bypass to gnd with a 4.7 f or greater ceramic capacitor 5 4 fb this is the feedback pin of the device. connect this pin directly to the output if th e fixed output voltage version is used. for the adjustable version an external resistor divider is connected to this pin.
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 3 functional block diagram figure 3. functional block diagram of ap3407/a
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 4 ordering information ap3407 - g1: green circuit type blank: ap3407 a: ap3407a part number marking id package temperature range green green packing type AP3407KTR-G1 gja tape & reel sot-23-5 -40 to 85 oc ap3407aktr-g1 gjb tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. absolute maximum ratings (note 1) parameter symbol value unit input voltage v in -0.3 to 6.0 v feedback voltage v fb -0.3 to v in +0.3 v en pin voltage v en -0.3 to v in +0.3 v sw pin voltage v sw -0.3 to v in +0.3 v thermal resistance ja 265 oc/w thermal resistance jc 60 oc/w power dissipation p d 0.377 w operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10sec) t lead 260 oc note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. note 2: the junction temperature rise is given by t rising =p d * ja , where p d is the power dissipated by regulator, ja is the thermal resistance from junction of the die to the ambient temperature; the junction temperature, t j is given by t j =t a +t r , where t a is the ambient temperature. tr: tape & reel k: sot-23-5
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 5 recommended operating conditions parameter symbol min max unit input voltage v in 2.5 5.5 v maximum output current i out (max) 1.2 a operating ambient temperature t a -40 85 oc electrical characteristics v in =v dd =v pvdd =3.3v, t a =25 , unless otherwise specified. parameters symbol conditions min typ max unit input voltage v in 2.5 5.5 v quiescent current i q v fb =0.65v 62 100 a shutdown supply current i stby v en =gnd 0.1 1 a reference voltage v ref for adjustable output voltage 0.588 0.6 0.612 v feedback bias current i fb v fb =v in -0.1 0.1 a output voltage accuracy ? v out -2 2 % pmosfet r on r ds(on)_ p i sw = 200ma 0.28 ? nmosfet r on r ds(on) _n i sw = -200ma 0.25 ? switch current limit i lim v fb =0.55v 1.5 2.0 a v h 1.5 en pin threshold v l 0.4 v uvlo threshold v uvlo v dd rising 2.3 uvlo hysteresis v hys 0.2 v oscillator frequency f osc 1.12 1.40 1.68 mhz max. duty cycle d max v fb =0v 100 min. duty cycle d min v fb =6.5v 0 % n-mos sw leakage current v in =3.3v, v sw =3.3v 0.1 a soft-start time t 1 ms thermal shutdown t otsd 160 oc thermal shutdown hysteresis t hys 20 oc
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 6 23456 72 80 88 96 efficiency (%) input voltage (v) v out =2.5v i out =0.5a i out =1.0a 200 400 600 800 1000 1200 2.47 2.48 2.49 2.50 2.51 output voltage (v) output current (ma) v in =3.3v v out =2.5v 200 400 600 800 1000 1200 40 45 50 55 60 65 70 75 80 85 90 95 100 efficiency (%) output current (ma) v in =3.3v v out =2.5v typical performance characteristics figure 4. efficiency vs. output current figure 5. efficiency vs. input voltage figure 6. output voltage vs. output current figure 7. frequency vs. input voltage 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 1.3 1.4 1.5 1.6 1.7 1.8 frequency (mhz) input voltage (v) i out =300ma
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) figure 8. frequency vs. temperature figure 9. feedback voltage vs. temperature figure 10. ocp current limit vs. temperature figure 11. r ds (on)_up vs. temperature -40 0 40 80 120 160 1.2 1.3 1.4 1.5 1.6 1.7 frequency (mhz) temperature ( o c) v in =3.3v v out =2.5v -40 0 40 80 120 160 0.57 0.58 0.59 0.60 0.61 0.62 feedback voltage (v) temperature ( o c) v in =3.3v -40 0 40 80 120 160 1.2 1.4 1.6 1.8 2.0 2.2 ocp current limit (a) temperature ( o c) v in =3.3v v fb =0.55v -40 0 40 80 120 160 0.0 0.1 0.2 0.3 0.4 0.5 r ds(on)-up ( ? ) temperature ( o c) v in =3.3v i sw =200ma
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) figure 12. r ds (on)_low vs. temperature -40 0 40 80 120 160 0.12 0.16 0.20 0.24 0.28 0.32 r ds(on)-low ( ? ) temperature ( o c) v in =3.3v i sw =200ma
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 9 typical application ap3407/a-adj l c out c in v in r2 r1 v out f 2.2 h f en vin sw fb gnd figure 13. typical application of ap3407/a
data sheet 1.2a, 1.4mhz high efficiency synchr onous dc-dc buck converter ap3407/a dec. 2011 rev. 1. 3 bcd semiconductor manufacturing limited 10 mechanical dimensions sot-23-5 unit: mm(inch) 2.820(0.111) 0 . 0 0 0 ( 0 . 0 0 0 ) 0.300(0.012) 0.950(0.037) 0 . 9 0 0 ( 0 . 0 3 5 ) 0.100(0.004) 0.200(0.008) 8 0 3.020(0.119) 0.400(0.016) 0 . 1 5 0 ( 0 . 0 0 6 ) 1 . 3 0 0 ( 0 . 0 5 1 ) 0.200(0.008) 1.800(0.071) 2.000(0.079) 0 . 7 0 0 ( 0 . 0 2 8 ) r e f t y p
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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