application specification dual in- line package (dip) programming switches 114--1056 1 of 7 loc b e 2011 tyco electronics corporation, a te connectivity ltd. company all rights reserved *trademark te connectivity, te connectivity (logo), and te (logo) are trademarks. other logos, product and/or company names may be trademarks of their respecti ve owners. tooling assistance center 1 -- 800 -- 722 -- 1111 product information 1--800--522--6752 this controlled document is subject to change. for latest revision and regional customer service, visit our website at www.te.com (7000 and 7100 series) 03 may 11 rev d all numerical values are in metric units [with u.s. customary units in brackets]. dimensions are in millimeters [and inches]. unless otherwise specified, dimensions have a tolerance of + 0.13 [+ .005] and angles have a tolerance of + 2 _ . figures and illustrations are for i dentification only and are not drawn to scale. 1. introduction this specification covers the requirements for application of dip programming switches (7000 and 7100 series) for printed circuit (pc) boar d applications. 7000 seri es switches are designed for a lif e of 7, 000 cycl es per pole. 7100 series switc hes are recommended for pr ogramming applicat ions where the number of cycles is limited to 2,000 per pole. switches are manually rocker actuated and are designed for wave soldering on printed circuit (pc) boards or insertion into dip sockets with in--row centerline spacing of 7.62 [.300]. 7000 series switches are black, and are available in 2 through 12 positions, while 7100 series switches are blue and available in 2 through 12 positions. both series are available with a premium seal, an economy seal, or unsealed in the raised rocker (standard profile) or flush rocker profile (low profile). in addition, 7000 series switches are available with a side rocker profile (side actuated). both s eries are individual single--pole, si ngle--throw (spst). 7000 series raised rocker profile switches may have ganged rockers for single--pole, double--throw (spdt) and double--pole, double--throw (dpdt) make--before--break circuits. the unsealed switches are designed for socket applications and the sealed switches are designed for soldering directly to the pc board. the sealants prevent flux and other contaminants from entering the switch during soldering and cleaning. the raised rocker and side rocker profiles come unsealed or with an optional economy or premium masking top seal. the flush rocker profile comes unsealed or with an optional economy tape top seal or premium masking top seal. the multi--pole switches come unsealed only. all switches come standard with a bottom seal. switches are designed for use in logic level switching applications. when corresponding with personnel, use the terminology provided in this specification to facilitate your inquiries for information. basic terms and features of this product are provided in figure 1. figure 1 raised rocker white dot identifies pin 1 solder tail housing position number flush rocker white dot identifies pin 1 standard profile switch side rocker switch low-profile switch note i
114- 1056 rev d 2 of 7 2. reference material 2.1. revision summary revisions to this application specification include: s changed company logo 2.2. customer assistance reference product base part number 435802 and product code 4546 are representative of dip programming switches (7000 and 7100 series). use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. such information can be obtained through a local representative or, after purchase, by calling product information at the number at the bottom of page 1. 2.3. drawings customer drawings for product part numbers are available from the service network. if there is a conflict between the information contained in the customer drawings and this specification or with any other technical documentation supplied, the information contained in the customer drawings takes priority. 2.4. specifications product specifications 108--7519 (7000 series) and 108--7532 (7100 series) provide product performance and test information. qualification test reports 501--135 (7000 series) and 501--128 (7100 series) provide an independent corporate test report to show the switch conforms to the above mentioned product specifications. 2.5. instructional material instruction sheets (408--series) provide product assembly instructions or tooling setup and operation procedures and customer manuals (409--series) provide machine setup and operating procedures. documents available which pertain to this product are: 408--7779 dual in--line package (dip) programming switches (7000 and 7100 series) 2.6. manuals manual 402--40 can be used as a guide to soldering. this manual provides information on various flux types and characteristics with the commercial designation, flux removal procedures, and a guide for information on soldering problems. 3. requirements 3.1. safety do not stack product shipping containers so high that the containers buckle or deform. 3.2. limitations the switches are designed to operate within a temperature range of --55 _ to 105 _ c[--67 _ to 221 _ f]. 3.3. storage a. ultraviolet light prolonged exposure to ultraviolet light may deteriorate the chemical composition of components used in the switches. b. shelf life the switches should remain in the shipping containers until ready for use to prevent damage. these products should be used on a first in, first out basis to avoid storage contamination.
114- 1056 rev d 3 of 7 c. chemical exposure do not store switches near any chemicals listed below, as they may cause stress corrosion cracking in the components. alkalies ammonia citrates phosphates citrates sulfur compounds amines carbonates nitrites sulfur nitrites tartrates where the above environmental conditions exist, phosphor--bronze contacts are recommended. 3.4. pc board a. material and thickness the pc board material must be glass epoxy (fr--4 or g--10). the pc board thickness shall be 2.36 [.093]. contact product information at the number at the bottom of page 1 for suitab ility of other pc board materials and thicknesses. b. tolerance maximum allowable bow of the pc board must be 0.08 [.003] over each 25.4 [1.00] of length. c. layout the solder tail contact holes in the pc board must be precisely located to ensure proper placement and optimum performance of the switch. the layout dimensions and tolerances shown in figure 2 must be observed when preparing pc boards for the various switches. the layout shows the top (component) side of the board. figure 2 2.54+ 0.13 [.100+ .005] typ 0.89+ 0.13 [.035+ .005] dia typ 7.62+ 0.13 [.300+ .005] recommended pc board layout note: not to scale 3.5. holes the holes in the pc board for the contact solder tails must be drilled and plated through to specific dimensions giveninfigure3. 3.6. mounting requirements determine whether the switch will be soldered directly to the pc board (a sealed switch will be required), or whether the switch is to be installed in a socket (an unsealed switch can be used). a. dip socket 1. secure dip socket to pc board according to instructions packaged with socket. 2. start one row of contact leads into one row of contact cavities in socket, then rotate switch until it is parallel with socket. note i note i
114- 1056 rev d 4 of 7 figure 3 pad diameter (as required) copper thickness (as required) maximum hardness of copper 150 knoop tin/lead thickness (as required) drilled hole diameter (as required) 0.89+ 0.13 [.035+ .005] dia finished hole after plating 3. gripping ends of switch push switch into socket until it is bottomed. 4. determine which of the circuits are to be closed, then depress the applicable rockers to the on position. 5. if installing a protective dust cover, check to be sure there are no obstructions on the switch rockers or in the protective cover, then slide the cover over the top of the housing. b. pc board 1. make a layout on pc board according to dimensions shown in figure 2. 2. hold switch at a slight angle and start one row of contact leads into pc board holes. do not over--insert. switch should be rotated until second row of contact leads are aligned with opposite row of contact holes. 3. make certain all contact leads have started entry into holes. grip sides of switch and push switch into pc board until it is bottomed. 4. to hold switch in place during wave soldering, the four outside leads may be clinched inward at 45 _ . seefigure4. figure 4 clinched solder tail (inward only) 0.76 [.030] max
114- 1056 rev d 5 of 7 3.7. soldering a. flux selection solder tails must be fluxed prior to soldering. selection of the flux will depend on the type of pc board and other components mounted on the board. additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. call the product information number at the bottom of page 1 for consideration of other types of flux. flux types that are compatible with these switches are provided in figure 5. p r o c e s s s t e p cleaning flux process step organic ra (active) rosin rma (mildly active) rosin 1 heat heat extra pre--clean 2 solder solder heat 3 wash in tap water or saponifier d wash with saponifier d solder 4 rinse in tap or de--ionized water rinse in tap or de--ionized water wash in saponifier d 5 dry in ambient air or radiant heater dry in ambient or radiant heater rinse in tap or de--ionized water 6 ? ? dry in ambient air or radiant heater d reduces residue to soap. figure 5 b. solder ing process refer to paragraph 2.5 for instructional material that is available for establishing soldering guidelines. the switches can be soldered using wave soldering or equivalent soldering techniques. it is recommended using sn60 or sn62 solder for these switches. the maximum solder profile temperature should be 245+ 10 _ c [473+ 10 _ f]. these switches are not recommended for reflow process. c. cleaning after soldering, removal of fluxes, residues, and activators is necessary. automatic in--line cleaning is recommended for the sealed switch. installation in a socket is recommended for the unsealed switch. consult with the supplier of the solder and flux for recommended cleaning solvents. cleaners must be free of dissolved flux and other contaminants. it is recommended cleaning with the pc board on its edge. if using an aqueous cleaner, standard equipment such as a soak--tank or an automatic in--line machine should be used. the following is a list of common cleaning solvents that will not affect the switches for the time and temperature specified. see figure 6. vapor cleaning (with the pc board on edge) is preferred over submersion in a liquid cleaner. unsealed switches should not be submerged due to contaminants in the cleaning bath. do not ultrasonically clean switches sealed with tape or masking material. consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. refer to the manufacturer?s material safety data sheet (msds) for characteristics and handling of cleaners. trichloroethylene and methylene chloride is not recommended because of harmful occupational and environmental effects. both are carcinogenic (cancer--causing). if you have a particular solvent that is not listed, contact product information at the number at the bottom of page 1. note i caution ! danger note i
114- 1056 rev d 6 of 7 cleaner time temperature name type t i m e (minutes) t e m p e r a t u r e (maximum) alpha 2110 aqueous 1 1 0 0 _ c [ 2 1 2 _ f ] bioact ec--7 solvent 5 100 _ c [212 _ f ] butyl carbitol solvent solvent 1 ambient room isopropyl alcohol solvent 5 kester 5778 aqueous 5 kester 5779 aqueous 5 1 0 0 _ c [ 2 1 2 _ f ] loncoterge 520 aqueous 5 100 _ c [212 _ f ] loncoterge 530 aqueous 5 terpene solvent solvent 5 figure 6 d. drying when drying cleaned unsealed assemblies and pc boards, make certain that the housing temperature does not exceed 130 _ c [270 _ f]. excessive temperatures may cause housing degradation. when processing the economy sealant, make certain that the sealant temperature does not exceed 100 _ c [212 _ f] for 1 minute. this is a hot melt sealant and will reflow. 3.8. checking installed switches the solder tail must be through its intended hole in the pc board. solder fillet must be evenly formed around each solder tail. the housing of the switch must be seated on the pc board not exceeding the dimension given in figure 4. 3.9. removal and repair damaged or defective switches must not be used and should be replaced. the switches must be removed from the pc board by standard de--soldering methods. when removing or replacing switches, care must be taken not to damage other pc board components during the de--soldering process. 4. qualifications dip programming switches are not required to be agency approved. 5. tooling no tooling is required for manual placement of these switches; however, a pc board support that provides relief for protruding components must be used to prevent deformation of contact tails. the pc board support must be custom made. see figure 7. figure 7 pc board support (customer supplied) holes (ref) channel (ref) alpha, bioact, carbitol, kester, and loncoterge are trademarks of their respective owners. caution !
114- 1056 rev d 7 of 7 6. visual aid figure 8 shows a typical application of dip programming switches. this illustration should be used by production personnel to ensure a correctly applied product. applications which do not appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. figure 8. visual aid theremustbeno cracks in solder switch must be visually bottomed on pc board switch must be bottomed on socket soldered switch switch housings must not be damaged in any way removable switch
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