pb rohs e1uda18-30.000m-cb e1u d a 18 -30.000m - cb series rohs compliant (pb-free) resistance welded short hc-49/us crystal frequency tolerance/stability 30ppm at 25c, 50ppm over 0c to +70c mode of operation at-cut fundamental cut leads cut leads to 2.540 0.500 (0.100" 0.020") value added option prefix nominal frequency 30.000mhz load capacitance 18pf parallel resonant electrical specifications nominal frequency 30.000mhz frequency tolerance/stability 30ppm at 25c, 50ppm over 0c to +70c aging at 25c 5ppm/year maximum load capacitance 18pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 40 ohms maximum mode of operation at-cut fundamental drive level 1mwatt maximum storage temperature range -40c to +125c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c lead integrity mil-std-883, method 2004 lead termination sn 2m - 6m mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a mechanical dimensions (all dimensions in millimeters) line marking 1 e30.000m e=ecliptek designator m=mhz www.ecliptek.com | specification subject to change without notice | rev e 8/13/2010 | page 1 of 4 6.35 min 2.50 max 4.88 0.20 dia 0.457 0.051(x2) 4.70 max 11.18 max
e1uda18-30.000m-cb 2.540 0.500 www.ecliptek.com | specification subject to change without notice | rev e 8/13/2010 | page 2 of 4 v alue ad ded option - cut leads all dimensions are in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e1uda18-30.000m-cb high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev e 8/13/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e1uda18-30.000m-cb low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev e 8/13/2010 | page 4 of 4
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