AFBR-2310Z fiber optic receiver for multi ghz analog links data sheet description the AFBR-2310Z is a compact, high performance, cost eff ective receiver for multi ghz analog communication over single mode optical fi ber. the receiver incorporates a wide bandwidth, low dark current ingaas/inp pin photodiode packaged inside a to- header, together with a high performance e-phemt rf amplifi er and its bias network. a receptacle designed according to the cei/iec 61754-13 standard allows coupling of the optical signal by means of a fc fi ber patchcord. the receiver is optimized for operation at 1310 nm and 1550 nm but may be used over a wide wavelength range ranging from 850 nm to 1600 nm, with reduced perfor- mance. the amplifi er low noise fi gure and pin high responsivity allow for a high sensitivity and thus a high splitting ratio in branched passive optical networks. access to the rf output as well as bias of pin and amplifi er is through a fl exible printed circuit board. the rf output requires external ac coupling. the receptacle is designed for assembly into a properly shaped aperture in the customer box wall or fi xture. features ? compact package ??? low dark current pin ? high performance rf amplifi er ? fc single mode fi ber connectorized optical receptacle ? low power consumption ? flex interconnect to customer pcb ? minimal external circuitry required ? rohs6 compliant ? pairs to afbr-1310z fiber optic transmitter for multi ghz analog links specifi cations ? nominal 50 ohm rf output impedance ? 3.3 v rf amplifi er and pin bias voltage ? 200 v/w typical conversion gain ? 200 mhz to 5.5 ghz frequency range applications ? analog optical links for satellite signal distribution ? in-building antenna remote systems
2 table 1. absolute maximum ratings [1] parameter symbol minimum typical maximum unit notes storage temperature (non-operating) ts -40 85 c operating temperature ta -40 85 c relative humidity (non condensing) rh 85 % rf amplifi er/pin supply voltage 0 5.0 v optical input power pin 7 dbm rf amplifi er output dc voltage vout 5 v esd capability (hbm) v esdhbm 250 v flex soldering temperature 300 c for manual soldering, no longer than 2 sec/pad. it is advisable to pre-heat the customer pcb. notes: 1. absolute maximum ratings are those values beyond which functional performance is not intended, device reliability is not im plied, and damage to the device may occur. table 2. recommended operating conditions [2] parameter symbol minimum typical maximum unit notes operating temperature ta 0 85 c relative humidity (non condensing) rh 80 % rf amplifi er supply voltage vcc 3.135 3.3 3.465 v notes: 2. typical operating conditions are those values for which functional performance and device reliability is implied. table 3. electro-optical specifi cations [3] parameter symbol conditions min. nom. max. unit notes rf output impedance ro 50 ? gain ripple ? g 0.2 to 5.5 ghz 4 db rf conversion gain g 200 v/w @ 1 ghz rf amplifi er supply current icc t = 0-85 c 16 40 ma no light input input referred noise t = 0-85 c 10 pw/hz wavelength range ? 850 1310 1600 nm note 4 3 db bandwidth 7 ghz low cutoff frequency 40 mhz input optical power 2 dbm notes: 3. all o/e parameters refer to 1310 nm and 1550 nm wavelength optical input signal 4. the receiver is optimized for operation at 1310 nm and 1550 nm but may be used over a wide wavelength range ranging from 850 nm to 1600 nm, with reduced performance
3 schematic diagram figure 1. schematic diagram figure 2. electrical pinout (top view after 90 bending of the fl exible pcb) pad function 1 ground 2 rf amp/pin bias 3 rf amp/pin bias 4 ground 5 ground 6 rf out 7 ground rf amp 6 rf out fc optical connector pin light in 5 ground 4 ground 3 rf amp/pin bias 2 rf amp/pin bias 1 ground 7 ground 1 2 3 4 5 6 7 electrical pinout
4 figure 3. mechanical layout of analog receiver. the fl ex is shown before bending. all dimensions are in [mm]. figure 4. flex outline. all dimensions are in [mm]. figure 5. example of fl ex bending when soldered onto a pcb. all dimensions a re in [mm]. package information the AFBR-2310Z receiver is housed in a to-46 header, joint to a robust fc plastic receptacle, as shown in fi gure 3. figure 4 shows the mechanical outline of the fl ex. a nut with washer is used to fi x the receiver to the customer box wall. the aperture in the box wall should be designed in order to avoid rotation of the receptacle. a dust cap is provided for shipping, and should be used whenever the receiver is not connected to a fi ber patch cord. 4 15.8 r3 r0.7 r0.5 r0.2 r0.1 2.3 1.2 1 0.8 0.4 c 2.6 c 8.5 c 5.4 iso ( 5 : 1 ) 7 12 6 .8 4.7 1.4 0.9 9.4 area of flex board intended to be bent pad 1 4 15.5 max m8x0.75 fc-port according to iec 61754-13 6.8 2.4 r4 18.8
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2011 avago technologies. all rights reserved. av02-3183en - october 7, 2011 figure 6. mechanical dimensions of nut+washer. all dimensions are in [mm]. handling information when soldering the fl ex to the customer pcb, it is advisable to avoid heating or touching with the hot iron the plastic receptacle and the header to fl ex interconnections. the fl ex circuit can be soldered to the customer pcb by hand soldering or with automatic equipment (like hot bar). a washless fl ux should be used to solder the fl ex pads to the pcb. this device is sensitive to esd discharge. to protect the device, it is important to use normal esd handling pre- cautions. these include use of grounded wrist straps, work-benches and fl oor wherever a receiver is handled. mounting hardware a nut with integrated washer is used to assemble the receiver to a panel (see figure 6). recommended application circuit figure 7 shows the recommended application circuit. proper 50 ohm controlled impedance traces are required on the rf output. the rf output has to be ac coupled to the next amplifi er stage. the rf amp/pin bias pads should be connected to a 8.2 ohm impedence controlled trace, terminated with a 8.2 ohm resistor in parallel to an inductor. filtering caps are required on the bias line. figure 7. recommended application circuit a-a a a sw 13 2 2.6 3.6 m 8 x 0.75 r7.5 r4.6 r4 1 nf 50 ohm 100 nf vcc next amplifier stage rf amp rf amp/pin bias rfout fc optical pin 1 nf ground ground ground ground 8.2 ohm 15 nh
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