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36 chip beads & inductors introduction chip components guide products guide samwha?s cb , cba ,cm , cd series of chip components consist of compact, high performance beads and inductors. their innovative components and case structures mean low dc resistance and outstanding highfrequency characteristics. these series are designed for a variety of applications, facilitating component selection for individual circuit requirements. product name application material part number impedance/ dimensions inductance range cb ga 10~4000 cb gk 60~1000 cb gm 5~1000 cb pa 11~600 cb pm 50~600 cb um 50~120 cba ga 30~1000 cba gk 60~1000 cba gm 30~1000 chip ferrite signal line ferrite cm f 0.047~33 h inductors (f) chip ceramic signal line ceramic cd c 1.0~470nh inductors (c) 1608 2012 3216 3216 general frequency (a) chip ferrite beads chip ferrite beads array signal line ultra high power line(u) high power line (p) signal line (g) general frequency (a) medium frequency (k) medium frequency (k) high frequency (m) high frequency (m) 1608 2012 1005 1608
37 chip beads & inductors part numbering cb 1608 g a 102 t yt?? h series cba 3216 g a 102 n4 e yt??? cm 1608 f r22 k t yta?? cd 1608 c 22n j t yta?? mark product name cb chip ferrite beads cba chip ferrite beads array cm chip ferrite inductors cd chip ceramic inductors h? dimension mark dimension 1005 1.0mm ? 0.5mm 1608 1.6mm ? 0.8mm 2012 2.0mm ? 1.25mm 3216 3.2mm ? 1.6mm mark tolerance g ? 2% j ? 5% k ? 10% m ? 20% n ? 30% c ? 0.2nh s ? 0.3nh d ? 0.5nh ha applications mark applications g signal line p high power line u ultra high power line h? material mark material a general frequency k medium frequency m high frequency f ferrite c ceramic h- inductance h inductance tolerance h? number of circuits mark packaging b bulk pack t tape & reel pack e embossed tape pack h packaging code 22n = 22nh 3n3 = 3.3nh 2r2 = 2.2 h r22 = 0.22 h h? impedance 300 = 30 201 = 200 601 = 600 102 = 1000 n4 = 4 array
56 chip ferrite beads array features 1. good reliability (monolithic structure) 2. high impedance characteristics 3. flow/reflow solder application product identifications shape & dimensions applications 1. computer and its peripherals 2. cd-rom, dvd, md lines 3. i/o lines of notebook pcs, w/ps 4. digital tvs and vtrs cba 3216 g a 102 n4 e ? h series code cba : chip ferrite beads array h? dimension code the first two digits : length(mm) the last two digits : width(mm) ha application code g : signal line h? impedance value code the first two digits are significant the last digit is the number of zeros following h? material code a : general frequency k : medium frequency m : high frequency h- number of circuits n4 = 4 array h? packaging code t : reed paper packaging e : reed embossed tape packaging b : bulk packaging model l w t b d e cba3216 3.2 ? 0.2 1.6 ? 0.2 0.9 ? 0.2 0.3 ? 0.2 0.4 ? 0.15 0.8 ? 0.1 (unit:mm)
57 chip ferrite beads array specifications 1bsu/p *nqfebodf %$3ftjtubodf 3bufe$vssfou 5ftu'sfrvfodz nby n"
nby <.)[> $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#("/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ? $#(,/ ?
58 chip ferrite beads array electrical characteristics impedance 60 45 30 15 0 1 10 100 1000 cba 3216 ga 300 n4 x z r impedance 300 225 150 75 0 1 10 100 1000 cba 3216 ga 151 n4 x z r impedance 120 90 60 30 0 1 10 100 1000 cba 3216 ga 600 n4 x z r impedance 240 180 120 60 0 1 10 100 1000 cba 3216 ga 121 n4 x z r impedance 400 300 200 100 0 1 10 100 1000 cba 3216 ga 201 n4 x z r impedance 400 300 200 100 0 1 10 100 1000 cba 3216 ga 221 n4 x z r impedance 800 600 400 200 0 1 10 100 1000 cba 3216 ga 601 n4 x z r impedance 600 450 300 150 0 1 10 100 1000 cba 3216 ga 471 n4 x z r impedance 400 300 200 100 0 1 10 100 1000 cba 3216 ga 301 n4 x z r
59 chip ferrite beads array electrical characteristics impedance 1200 900 600 300 0 1 10 100 1000 cba 3216 ga 102 n4 x z r impedance 300 240 180 60 120 0 1 10 100 1000 cba 3216 gk 151 n4 x z r impedance 200 150 100 50 0 1 10 100 1000 cba 3216 ga 600 n4 x z r impedance 240 180 120 60 0 1 10 100 1000 cba 3216 ga 121 n4 x z r impedance 400 300 200 100 0 1 10 100 1000 cba 3216 gk 221 n4 x z r impedance 500 400 300 100 200 0 1 10 100 1000 cba 3216 gk 301 n4 x z r impedance 800 500 400 200 0 1 10 100 1000 cba 3216 gk 471 n4 x z r impedance 800 600 400 200 0 1 10 100 1000 cba 3216 gk 601 n4 x z r impedance 1200 900 600 300 0 1 10 100 1000 cba 3216 gk 102 n4 x z r
60 chip ferrite beads array specifications 1bsu/p *nqfebodf %$3ftjtubodf 3bufe$vssfou 5ftu'sfrvfodz nby n"
nby <.)[> $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ? $#"(./ ?
61 chip ferrite beads array electrical characteristics impedance 120 90 60 30 0 1 10 100 1000 cba 3216 gm 300 n4 x z r impedance 300 240 180 120 60 0 1 10 100 1000 cba 3216 gm 121 n4 x z r impedance 200 150 100 50 0 1 10 100 1000 cba 3216 gm 600 n4 x z r impedance 600 450 300 150 0 1 10 100 1000 cba 3216 gm 201 n4 x z r impedance 240 160 80 0 1 10 100 1000 cba 3216 gm 800 n4 x z r impedance 600 450 300 150 0 1 10 100 1000 cba 3216 gm 301 n4 x z r impedance 1000 750 500 250 0 1 10 100 1000 cba 3216 gm 471 n4 x z r impedance 1200 900 600 300 0 1 10 100 1000 cba 3216 gm 601 n4 x z r impedance 2000 1500 1000 500 0 1 10 100 1000 cba 3216 gm 102 n4 x z r
76 reliability and test conditions chip ferrite beads array item requirements test conditions operating temperature range storage temperature range solderability more than 90% of the terminal electrode shall be covered with new solder preheat temperature : 100~150 ? preheat time : 60 sec. solder temperature : 230 10 ? soldering time : 4 sec. resistance to soldering heat reflow soldering 1. no damage such as cracks should be caused in chip element 2. more than 75% of the terminal electrode shall be covered with new solder 3. impedance shall not change more than 30% more than 50% of the terminal electrode shall be covered with new solder preheat temperature : 100~150 ? preheat time : 60 sec. solder temperature : 270 10 ? soldering time :10 0.5 sec. preheat temperature : 150 ? preheat time : 60 sec. solder temperature : 230 10 ? soldering time :10 sec. max. (reflow soldering profile) 1. no mechanical damage 2. impedance shall not change more than 30% humidity resistance high temperature load resistance high temperature resistance temperature : 40 2 ? humidity : 90 2%rh time : 500 12 hours measurement at room ambient temperature after placing for 24 hours temperature : 85 2 ? time : 500 12 hours measurement at room ambient temperature after placing for 24 hours temperature : 85 2 ? applied current : rated current time : 1000 12 hours measurement at room ambient temperature after placing for 24 hours -55 ? ~ +125 ? 40 ? max., 70%rh max. at packing condition - chip beads chip inductors
77 reliability and test conditions chip ferrite beads array chip beads chip inductors item requirements test conditions humidity lood resistance low temperature resistance temperature : -40 5 ? time : 1000 12 hours measurement at room ambient temperature after placing for 24hours thermal shock 1. -40 3 ? for 30 minutes 2. 85 3 ? for 30 minutes 3. repeat 100 cycle vibration frequency : 10~55 hz amplitude : 1.5 mm direction : x, t, z sweep time : 2 hours for each axis 1. no mechanical damage 2. impedance shall not change more than 30% temperature : 40 2 ? humidity : 90 2% rh applied current : rated current time : 500 12 hours measurement at room ambient temperature after placing for 24hours flexure strength drop drop 10 times on a concrete floor from a height of 100 cm no mechanical damage type 4 array a [mm] 0.8 b [mm] 0.8 c [mm] 3.0 d [mm] 0.4 w [kgf] 5.0 bending strength the terminal electrode shall be neither break off nor the chip damage
78 packaging bulk packaging reel packaging leader and blank portion 1pmzcbht#py 1dt1pmzcbh "#$ 2? 2njo 2? %&8 ? ? ? type 1005 1608 2012 3216 array q?ty(pcs) 10,000 4,000 (t)0.85 (t)1.25 3,000 3,000 4,000 3,000 (unit:mm)
79 packaging taping dimension embossing tape unit : mm "#$% 5zqf ? ? ? ? unit : mm "#$%5 5zqf ? ? ? ? nby
paper tape
80 land pattern design land patten design chip ferrite beads, chip ceramic/ferrite inductors chip ferrite beads array unit : mm 5zqf " # $ unit : mm 5zqf " # $ %
81 ? typocal performance characteristics soldering profile soldering profile specifications which provide more details for the proper and safe use described product are available upon request. all specifications are subject to change without notice. reflow soldering 250 pre-heating 60 sec. min 60 sec. min 10 sec. max soldering 230 5 cooling 200 150 100 250 pre-heating 60 sec. min 60 sec. min 3 sec. max soldering 230 5 cooling 200 150 100 2 sec. max soldering iron : 30w max. diameter of soldering iron : 1.2 mm max. 300 to flow soldering flow soldering

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