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amis-30660 high-speed can transceiver data sheet 1.0 general description t he amis-30660 can tra n sc eiver is th e inte rface bet w e en a control l er ar e a net w o rk ( c a n ) protoco l con t roller a nd th e ph ysic al b u s and ma y b e use d in both 12v a n d 24v s y stems . t he transceiver prov id es differenti a l transm i t capab ilit y to t he bus a nd diff erenti a l receiv e capa bil i t y to th e can contro ll er. due to th e w i de commo n-m ode v o ltag e r ang e of the r e ceiv er in put s, the amis-30 660 is ab le to reac h outst and ing leve ls of electrom agn eti c susce ptibi lit y (ems). simila r l y, e x trem el y lo w el ectroma g n e tic emiss i o n ( e me) is ac hi ev ed b y the e x c e l l ent m a tc hin g o f the outp u t sign als. 2.0 key features ? f u ll y c o mp atibl e w i t h the iso 118 98-2 sta n d a rd ? certifie d ?authenticati on o n c a n t r ansceive r conforma nce (d1.1)? ? high s pee d (up to 1mbit/s) ? ideal l y s u ite d for 12v an d 24 v i ndustri a l an d automotiv e a pplic atio ns ? lo w eme com m on-mo de cho k e is no lo ng er requ ired ? differenti a l rec e iver w i t h w i d e common-mo d e rang e (+ /- 35v) for high em s ? no distur banc e of the bus lin e s w i th an un- po w e re d nod e ? t r ansmit data (t xd) domin ant time-out functi on ? t hermal protec tion ? bus pins pr ote c ted aga inst trans i ents in a n automotiv e env ironme n t ? sile nt mode in w h ich th e trans mitter is disab l ed ? short circuit pr oof to supp l y v o ltag e an d gro und ? log ic leve l in p u ts compatib le w i t h 3.3v dev ic es 3.0 technical characteristics table 1: technic a l characteristics sy mbo l parameter con d iti ons min. max. unit v canh dc voltage at pin canh 0 < v cc < 5.25v; no time limit -45 +45 v v canl dc voltage at pin canl 0 < v cc < 5.25v; no time limit -45 +45 v v i( dif ) ( bus _dom ) differential bus output voltage in d o minant state 42.5 ? < r lt < 60 ? 1 . 5 3 v t pd( r e c - dom ) propagation dela y t x d to rxd see figure 7 70 245 ns t pd( dom - r e c ) propagation dela y t x d to rxd see figure 7 100 245 ns c m- r ang e input common-m ode range for co mparato r guar anteed differential receiver threshold an d leakage current -35 +35 v v cm- peak common-mo de peak see figures 8 an d 9 (notes) -500 500 mv v cm-s tep common-mo de step see figures 8 an d 9 (notes) -150 150 mv not e : the parameters v c m -peak and v cm - s t e p guara n tee low electromagne tic em ission. 1 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.amis.com
amis-30660 high-speed can transceiver data sheet 4.0 ordering information orderi ng c ode ( tube s) orderi ng c ode ( t ape ) marketin g na m e package tem p . ra nge 0canh-0 02-x t d 0canh-0 02-x t p amis 30660n ga soic- 8 green -40c ? 125 c 5.0 block dia g ram f i gure 1: b l ock diagram canh canl amis -30660 gn d rx d v cc 2 7 6 5 time r s 1 dri v e r co ntr o l the r mal shutd o w n v cc 8 4 pd20 07060 7 . 1 tx d 3 v ref co mp v cc / 2 + r i( c m ) r i( c m ) 2 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.amis.com amis-30660 high-speed can transceiver data sheet 6.0 typical application 6.1 a p p licatio n sch e matic f i gure 2: a pplication diagram am i s - 306 60 canh can l gn d rx d tx d vref 2 1 3 45 6 7 8 p c 20 04091 8.2 v cc s ca n cont roller vbat 5v-r e g in o u t 47 n f 60 ? 60 ? can bus 47 n f 60 ? 60 ? v cc gn d 6.2 pin descrip tio n 6.2.1. pin out (t op view ) f i gure 3: p i n configuratio n 5 6 7 8 1 2 3 4 tx d rx d s v ref gnd canl canh v cc amis- 30660 p c 20040918.3 3 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.amis.com amis-30660 high-speed can transceiver data sheet 6.3 pin descrip tio n tabl e 2: pi n o u t pin name descrip tion 1 txd transmi t data i n put; l o w i nput domi nant dri v er; i n ternal pul l - up cu rrent 2 gnd g r ou nd 3 v cc suppl y vol t age 4 rxd recei v e data out put; domi nant tr a n smi tter l o w o u tput 5 v ref reference vol t ag e output 6 canl lo w - l e vel can b u s l i ne (l ow i n do mi nant mode) 7 canh hi gh-l e vel can b u s l i ne (hi gh i n domi nant mode) 8 s si l ent mode control i nput; i n ternal pul l - do w n curre nt 7.0 functional description 7.1 op eratin g mod es t he behavi o r of amis-3066 0 und er vario u s conditi ons is illustrate d in t able 3 bel o w . in case the device is p o w e red, on e of two oper ating m o d e s can be s e le cted throug h pi n s. tabl e 3: fu ncti onal tabl e of amis30660; x = don? t care vcc pin t x d pin s pin c a n h pin c a n l bus st ate pin rx d 4.75 to 5.25.v 0 0 (or fl oati n g ) hi gh lo w domi nant 0 4.75 to 5.25.v x 1 vcc/2 vcc/2 r e cessive 1 4.75 to 5.25.v 1 (or fl oati n g ) x vcc/2 vcc/2 r e cessive 1 vcc amis-30660 high-speed can transceiver data sheet 8.4 dc an d t i ming ch aracte r ist i cs v cc = 4.75 to 5.25v; t j unc = -4 0 to + 150c; r lt =6 0 ? ?unless specifie d other w i se. tabl e 6: dc and ti mi ng character i sti c s sy mbo l parameter con d iti ons min. ty p . max. unit suppl y (pin v cc ) i cc suppl y curre nt domi nant; v tx d = 0v r e cessive; v tx d = v cc 25 2 45 4 65 8 ma ma trans m itter data inp u t (pi n tx d ) v ih hi gh-l e vel i nput vol t age o u tput recessi ve 2.0 - v cc + 0 . 3 v v il lo w - l e vel i nput vol t age o u tput d o mi nant -0.3 - +0.8 v i ih hi gh-l e vel i nput current v txd = v cc - 1 0 + 1 a i il lo w - l e vel i nput current v txd = 0v -75 -200 -350 a c i input capaci t ance not tested - 5 10 pf mode sele ct (pi n s) v ih hi gh-l e vel i nput vol t age si l ent mode 2.0 - v cc + 0 . 3 v v il lo w - l e vel i nput vol t age hi gh-speed mod e -0.3 - +0.8 v i ih hi gh-l e vel i nput current v s =2v 20 30 50 a i il lo w - l e vel i nput current v s =0.8v 15 30 45 a recei v e r da ta outp ut (pin rx d) v oh hi gh-l e vel output vol t age i rx d = - 10ma 0.6 x v cc 0.75 x v cc v v ol lo w - l e vel output vol t age i rx d = 6ma 0.25 0.45 v referen ce vol t a g e out put (pin v ref ) v ref reference ou tput vol t age -50a < i vref < + 50a 0.45 x v cc 0.50 x v cc 0.55 x v cc v v ref_c m reference outp u t vol t age for f u l l common mode rang e -35v amis-30660 high-speed can transceiver data sheet figure 5: hysteres is of the rece iver v rx d v i ( di f)(hy s ) hi g h low 0,5 0,9 p c 20040829.7 h ysteresi s f i gure 6: test cir c uit for timing characteristics am i s - 30660 v cc gnd 2 3 canh canl v re f 5 6 7 r lt c lt p c 200400 18. 5 s 8 rx d 4 tx d 1 60 ? 1 00 p f 10 0 nf +5 v 20 p f 8 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om amis-30660 high-speed can transceiver data sheet f i gure 7: timing diagram for a c characteristics canh canl tx d rx d dom i nant 0, 9v 0, 5v r e ce ssi v e 0, 7 x v cc v i( d i f ) = v canh - v canl t d(t x d - b u s on) t d(b u s on-r x d ) t pd(rec-dom ) t d ( t x d- buso f f ) t d ( buso f f - rx d) t pd(dom -rec) p c 20040829.6 0, 3 x v cc hi gh low f i gure 8: b a sic test set- up for e l ectr o magnetic measur ement 10 nf am i s - 30660 v cc gnd 2 3 canh canl v ref 5 6 7 p c 20040918.6 s 8 rx d 4 tx d 1 30 ? ac tiv e probe 100 nf +5 v 20 pf g enerator 30 ? 6.2 k ? 47 n f 6.2 k ? spectrum anay z e r 9 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om amis-30660 high-speed can transceiver data sheet f i gure 9: common- mode v o ltage p e a k s ( s ee measurement set- up f i gure 8) canh canl r e ce ssi v e v i( c o m ) = v canh + v canl v c m -peak p c 20040829.7 v cm- p e a k v cm - s te p 10 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om amis-30660 high-speed can transceiver data sheet 11 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om 9.0 pack age outline soic-8: plastic small outl i ne; eight le ads; bo d y w i dth 1 50mi l amis-30660 high-speed can transceiver data sheet 10.0 soldering 1 0 . 1 introd uc tion t h is text gives a ver y bri e f insight to a comple x tech nol og y. a more in-d epth acco unt o f solderin g ics can be foun d i n the amis ?dat a han dbo ok ic2 6 ; integrated c i rcuit packa ges ? (docume n t order num ber 9 3 98 65 2 90 01 1). t here is no sol deri ng metho d that is idea l for all surface mount ic packages. wave sold erin g is not al w a ys suita b le f o r surface mount ics, or for printed circu i t boar ds w i t h hi gh p o pul ation dens iti e s. in these situatio ns reflo w sold erin g is often use d . 10.2 re-flo w so ld erin g re-flo w s o ld eri ng req u ir es sol der past e (a su spens ion of fin e sold er partic l es, flux and bin d in g ag ent) to be a ppl ied to t he pr i n ted-c i rc uit boar d b y scr ee n printi ng, sten cilli ng or pr ess u re-s yrin ge d i s pens ing before packag e pl ace m ent. severa l metho d s e x ist for re-flo w i ng; for e x a m ple, infrar ed/ conv ecti on h e a t ing in a conv e y or t y p e ove n . t h roughp ut times (preh e ati ng, sold erin g an d cooli ng) var y b e t w e en 1 00 a n d 200 seco nds, dep en din g on heati ng meth o d . t y pic a l r e flo w peak tem per atures ra nge fro m 215 to 25 0 c. t he t op-surface temper atu r e of the pack ages s h o u ld pr eferab l y b e ke pt bel o w 23 0c. 10.3 w a v e so ld eri n g conv entio na l singl e w a v e s o ld erin g is n o t recomm end e d for s u rfac e mount dev ices (smds) or pr inted circu i t b oards w i th a hig h compo nent d e n sit y , as so lder bridg i ng a nd n on- w e tti ng ca n prese n t major prob lems. t o overcome these pr obl ems the dou ble- w a ve sold erin g method w a s spe c ificall y d e ve lo ped. if w a ve so lder i ng is use d , the follo w i n g con d i t ions must be o b serve d for opt imal resu lts: ? use a do ub le- w a v e so lder in g method, comp rising a turbul e n t w a ve w i th h i gh up w a rd pre ssure foll o w e d b y a smooth la minar w a v e . ? f o r packag e s w i t h le ads o n tw o s i d e s an d a pitch (e): o larg e r than or equ al to 1.27m m, the footprint long itudi na l a x is is preferred t o be par all e l to the transport directi on of the printe d-circ uit boar d. o smaller th an 1 . 27mm, the footprint lo ng it ud inal a x is must be par all e l to the trans p o rt di rection of the printe d-circu i t boar d. t he footprint must inco rporate so ld er thiev e s at the d o w n stre am en d. ? f o r pack a g e s w i t h lea d s on four s i des, the footprint m u st be plac ed at a 45 d egre e an gle to th e tra n s port d i rectio n of the pri nted- circuit bo ard. t he footpri n t mu st incorpor ate sold er thieves do w n stream a nd at the sid e corners. durin g pl acem ent and b e fore solderi ng, t he packa ge must be fixed w i t h a dropl et of adh esive. t he adh esive ca n be a ppli ed b y scr een printi ng, pin tra n sfer or s y ri ng e disp ensi ng. t he pack a g e ca n be sol der ed after the adh es ive is cure d. t y pic a l d w e ll ti me is fo ur sec onds at 2 50c . a mildl y - a ctiv at ed fl u x w i ll e limin ate th e n e ed for r e mova l of corrosiv e r e sid ues in most app licati ons. 1 0 . 4 ma nua l sol d e r ing f i x the com p o nent b y first sol deri ng t w o d i a g ona ll y-o p p o site end l eads. us e a lo w v o lta g e (24v or less) s o ld erin g iro n a ppli ed to the flat part of the lea d . contact time must be limite d to ten seconds at up to 300c . w hen usi ng a ded icate d tool, all oth e r lea d s can be so ld ere d in on e op erat ion w i t h in t w o t o five secon d s, bet w e e n 27 0 and 3 20c . 12 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om amis-30660 high-speed can transceiver data sheet tabl e 7: sol deri n g solderin g met h od package wav e reflo w (1) bga, sqfp not sui t abl e sui t abl e hlqfp, hs qf p, hsop, htsso p, sms not sui t abl e (2) sui t abl e plcc (3 ) , so, s o j sui t abl e sui t abl e lqfp, qfp, t q fp not recommend e d (3) ( 4) sui t abl e sso p, tss o p, vso not recommend e d (5) suitable not e s: 1. all sur f ace mount ( s md) packa ges ar e mo istur e sen s i t ive. depending upon the moisture conte n t, the max i mum temperature (w ith re spect to time ) and b ody size of the pa ckag e , th e r e is a risk that in te rnal or ex ternal pack age cr acks may o ccu r due to v aporizat ion of the moistur e in them (the so called popcor n effe ct). for detail s , re fer to the dry pack in formati o n in the ?da t a hand book ic26 ; in tegra t ed circuit pa ckage s; se cti on: pa cking method s.? 2. these pa ckage s ar e not sui t able for wav e soldering a s a sol der joint be tw ee n the printed-circuit board and hea t sin k (a t bo t tom v e rsion) can not be a c hie v ed, and as solde r may stick to the h eatsin k (on top v e rsion) . 3. if w a v e soldering is consid ered , then t he package must b e placed at a 45 de gree angle to the solder w a v e directio n. the pack age fo o t prin t must incor por ate sol der thiev e s dow nstr ea m and a t the side corners. 4. w a v e soldering i s only suitable for lq fp, tqfp and qf p package s w i th a pitch (e) equal to o r larger than 0.8mm; it i s de fini tely not sui t able for pa cka ges w i th a pitch (e ) eq ual to or smalle r than 0.65 mm. 5. w a v e soldering i s only suitable fo r s s op and tssop package s w i th a pitch (e) equ al to o r l a rger tha n 0.65mm ; it i s de fini tel y not suitable for pa ckag e s w i th a pitch (e ) eq ual to or smalle r than 0.5mm. 11.0 company or product inquiries f o r more infor m ation a b o u t ami semicond u c tor?s hig h -spe ed ca n transc e ivers, sen d an email to: auto _assp @amis.c o m. for more infor m ation abou t ami semicond u c tor, our techn o lo g y an d our prod uct, visit our web site a t: http:// w w w . amis.com dev i ces sold by amis are cov e red b y the w a rranty and paten t indem ni fi cati on prov isions appe aring in i t s terms o f sale only . am is makes no w a rranty , ex press, s t at ut o r y, implied or b y descrip tion, re garding the in form ation se t for t h here i n or regarding the freedom of the described dev ices fro m pa tent infringem ent. amis makes no w a rranty of mer c han tabili ty or fi tne ss for a n y purpose s . amis re serv es the righ t to di sco ntinu e produ ctio n and change spe c ification s an d pri c e s a t a n y time and w i thout n o tice. am i semi conductor' s produ cts are in tende d for use in commer c ial applica t ion s . app lica t ion s requiri ng ex tended tempera t ure range , unus ual e n v i ronment al requ irements, or high reliab ilit y applic a t ion s , s u ch as mili t a ry , medic a l li f e - s uppor t or lif e- s u st aini ng eq uipment, are spe c i f ica lly not recommended w i thout additional pro c e ssi ng by amis for such appli c ati ons. c opy right ?2007 am i semi cond uctor , in c. 13 a m i se m i co nd uc t o r ? m - 20682 - 003, jun 07 www.ami s .c om |
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