hlmp-yxxx t-1 (3 mm) alingap led lamps data sheet description this family of t-1 lamps is widely used in general purpose indicator and back lighting applications. the optical design is balanced to yield superior light output and wide viewing angles. several intensity choices are available in each color for increased design ?exibility. applications status indicator backlighting front panels light pipe sources lighted switches features high luminous intensity output low power consumption choice of bright colors C deep red C red C red-orange C orange C amber C green high e?ciency versatile mounting on pcb or panel i.c. compatible/low current requirement popular t-1 diameter package reliable and rugged rohs compliant notes: 1. all dimensions are in millimeter (inches). 2. tolerance is 0.25mm (.010) unless otherwise stated. 3. lead spacing is measured where the leads emerge from the package. 5.2 0.205 typ 0.45 x 0.4 (0.018 x 0.016) cathode 3.8 0.15 3.5 0.138 3.1 0.2 0.122 0.008 4.1 0.2 0.161 0.008 24.0 0.945 (min) 1.0 0.04 (max) 1.0 0.04 (min) 2.54 0.1 package dimension
2 selection guide color part number package description luminous intensity, iv (mcd) @ 20 ma viewing angle, 2 ? () min. typ. max. deep red hlmp-y651-g00xx untinted, non-di?used 140 300 45 red hlmp-y601-j00xx untinted, non-di?used 240 680 red-orange hlmp-y951-k00xx untinted, non-di?used 310 680 yellow orange hlmp-y901-j00xx untinted, non-di?used 240 680 hlmp-y902-j00xx tinted, non-di?used 240 680 amber hlmp-y701-g00xx untinted, non-di?used 140 400 green hlmp-y802-f00xx tinted, non-di?used 110 240 part numbering system maximum iv bin options 0: open (no max. limit) others: please refer to the iv bin table minimum iv bin options please refer to the iv bin table color bin options 0: full color bin distribution mechanical options 00: bulk hlmp - y x x x - x x x xx
3 electrical /optical characteristic at t a = 25c description symbol part number min. typ. max. units test conditions peak wavelength peak hlmp-y651 hlmp-y601 hlmp-y951 hlmp-y90x hlmp-y701 hlmp-y802-f00xx 652 633 622 611 595 575 nm measurement at peak dominant wavelength d hlmp-y651 hlmp-y601 hlmp-y951 hlmp-y90x hlmp-y701 hlmp-y802-f00xx 635.0 620.0 610.0 599.5 582.0 564.5 638.0 627.0 615.0 605.0 592.0 572.0 646.0 635.0 620.0 610.5 597.0 576.5 nm note 1 spectrum half width hlmp-y651 hlmp-y601 hlmp-y951 hlmp-y90x hlmp-y701 hlmp-y802-f00xx 15 15 17 17 15 11 nm forward voltage v f hlmp-y651 hlmp-y601 hlmp-y951 hlmp-y90x hlmp-y701 hlmp-y802-f00xx 2.0 2.0 2.0 2.0 2.0 2.1 2.2 2.2 2.2 2.4 2.2 2.4 vi f = 20ma (figure 1) notes: 1. the dominant wavelength, d , is derived from the chromaticity diagram and represents the color of the lamp. absolute maximum ratings at t a = 25c parameter hlmp-yxxx units dc forward current 20 ma peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma reverse voltage (i r = 100 a) 5 v junction temperature 110 c power dissipation 48 mw storage temperature range -40 to +100 c operating temperature range -40 to +100 c solder temperature 260c 5 sec
4 figure 1. forward current vs. forward voltage. f igure 2. relative luminous intensity vs. forward current. figure 3. ambient temperature vs. maximum dc forward curr ent. figure 4. relative luminous intensity vs. angular displacement for hlmp-y651, hlmp-y601, hlmp-y951 and hlmp-y701. figure 5. relative luminous intensity vs. angular displacement for hlmp-y90x and hlmp-y80x. figure 6. wavelength vs. relative luminous intensity. 0 2 4 6 8 1 0 1 2 1 4 1 6 1 8 20 00.5 11 .5 2 2.5 f orward vol t age - v f orward curren t- ma green deep red, red red - orange, amber yellow - orange 0 0.2 0.4 0.6 0.8 1 05 1 0 1 520 dc f orward curren t - ma rela ti ve lum i nous i n t ens it y (normal iz ed a t 20ma) 0 0.25 0.5 0.75 1 - 90 - 60 - 300 306090 angular d i splacemen t - degrees normal iz ed i n t ens it y 0 5 1 0 1 5 20 25 0 1 02030405060708090 amb i en t t empera t ure - c f orward curren t - ma 0 0.25 0.5 0.75 1 - 90 - 60 - 30 0 30 60 90 angular d i splacemen t - degrees normal iz ed i n t ens it y
5 intensity bin limits bin intensity range (mcd) min. max. f 110.0 140.0 g 140.0 180.0 h 180.0 240.0 j 240.0 310.0 k 310.0 400.0 l 400.0 520.0 m 520.0 680.0 n 680.0 880.0 p 880.0 1150.0 q 1150 1500 tolerance for each bin limit is 15%. color bin limits table color category # lambda (nm) min. max. red-orange 1 610.5 613.5 2 613.5 616.5 3 616.5 619.5 yellow- orange 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 amber 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 7 594.5 597.0 green 2 573.5 576.5 3 570.5 573.5 4 567.5 570.5 5 564.5 567.5 tolerance for each bin limit is 1.0 nm. precautions: assembly method: this product is not meant for auto-insertion. lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. during lead forming, the leads should be bent at a point at least 3mm from the base of the lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering at normal temperature. it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-1664n - october 14, 2009 disclaimer: avagos products and software are not speci?cally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, fo all loss, damage, expense or liability in connection with such use. figure 7. recommended wave soldering pro?le. precautions: (cont.) soldering conditions: care must be taken during pcb assembly and soldering process to prevent damage to led component. the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without stando?. recommended soldering conditions: wave soldering manual solder dipping pre-heat temperature 105c max. C pre-heat time 60 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering pro?le to ensure the soldering pro?le used is always conforming to recommended soldering condition. if necessary, use ?xture to hold the led component in proper orientation with respect to the pcb during soldering process. proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. recommended pc board plated through hole sizes for led component leads: led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. 0 30 40 90 1 00 250 200 1 50 1 00 50 ti me (m i nu t es) pre h ea t t urbulen t wave lam i nar wave h o t a i r k n if e recommended so l der: sn63 (leaded so l der a ll oy) sac305 (lead free so l der a ll oy) f l ux: rosin f l - ux so l der bath temperature: 245 c 5 c (maximum peak temperature = 250 c) dwe ll time: 1 .5 sec - 3.0 sec (maximum = 3sec) note: a ll ow for board to be sufficient l y coo l ed to room temperature before exerting t empera t ure ( c) 1 0 20 70 60 50 80 mechanica l force.
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