cra04s www.vishay.com vishay revison: 24-jun-13 1 document number: 31043 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 thick film chip resistor array the cra04s thick film resistor array is constructed on a high grade ceramic body with convex terminations. a small package enables the design of high density circuits. the single component reduces board space, component counts, and assembly costs. features ? convex terminal array with square corners ? wide ohmic range: 10r to 1m0 ? 4 or 8 terminal package with isolated resistors ? lead (pb)-free solder cont acts on ni barrier layer ? pure tin plating provides compat ibility with lead (pb)-free and lead containing soldering processes ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 notes (1) rated voltage: . (2) the power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow suppor t of the printed-circuit boar d (thermal resistance). the rate di ssipation applies only if the permitted film temp erature of 155 c is no t exceeded. notes (3) preferred way for ordering products is by use of the part number. (4) please refer to the table packaging, see next page. standard electrical specifications model circuit power rating p 70 c w limiting element voltage max. v ? temperature coefficient ppm/k tolerance % resistance range ? e-series cra04s 03 0.063 50 100 1 10 to 1m 24 + 96 200 2; 5 24 zero-ohm-resistor: r max. ? 50 m ? , i max. = 1 a technical specifications parameter unit cra04s rated dissipation at 70 c (2) w per element 0.063 limiting element voltage (1) v ? 50 insulation voltage (1 min) v dc/ac peak 100 category temperature range c - 55 to + 155 insulation resistance ? > 10 9 part number and product description part number: cra04s08347k0jtd (3) model terminal style pin circuit value tolerance packaging (4) special cra04 s 04 08 3 = 03 r = decimal k = thousand m = million 0000 = 0 ? jumper f = 1 % g = 2 % j = 5 % z = 0 ? jumper td tc pz up to 2 digits product description: cra04s 08 03 473 j rt7 e3 cra04s 08 03 473 j rt7 e3 model terminal count circuit type resistance value tolerance packaging (4) lead (pb)-free cra04s 04 08 03 473 = 47 k ? 4702 = 47 k ? 10r0 = 10 ? 100 = 10 ? 000 = 0 ? jumper f = 1 % g = 2 % j = 5 % z = 0 ? jumper rt7 rt6 pz e3 = pure tin termination finish first two digits (3 for 1 %) are significant. last digit is the multiplier. p x r a04s 834 0 cr jd k 0t 7
cra04s www.vishay.com vishay revison: 24-jun-13 2 document number: 31043 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 circuit derating dimensions the dimensions shown are for a 8 pin part. for parts with different pin numbers use th e same pitch and add or substract pads as required. packaging model tape width diameter pitch pieces/reel packaging code paper tape part number product description cra04s 8 mm 180 mm/7" 2 mm 10 000 td rt7 330 mm/13" 2 mm 20 000 tc rt6 330 mm/13" 2 mm 50 000 pz pz 03 circuit 4 pin 8 pin - 55 - 25 0 25 50 75 100 125 155 175 120 100 8 0 60 40 20 0 70 ambient temperature in c rated power in % ae e pin ? no # dimensions in millimeters laa 1 bb*p nom. tw 4 1.0 0.1 - 0.33 0.15 0.25 0.65 0.35 1.0 8 2.0 0.2 0.30 0.4 0.15 0.25 0.50 0.45 1.0 tol. - 0.15 0.15 0.10 0.1 - 0.1 0.15 solder pad dimensions in millimeters cwdabe wave 0.45 1.45 0.2 0.4 0.5 0.3
cra04s www.vishay.com vishay revison: 24-jun-13 3 document number: 31043 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes (1) figures are given for a single element. (2) solderability is specified for 2 years after production or requalification. permitted storage time is 20 years. test procedures and requirements en 60115-1 test ? (clause) conditions of test requirements permissible change ( ? r / r ) (1) stability class 1 or better stability class 2 or better stability for product types: 10 ? to 1 m ? 10 ? to 1 m ? cra04s resistance (4.5) - 1 % 2 %; 5 % temperature coefficient (4.8.4.2) (20/- 55/20) c and (20/125/20) c 100 ppm/k 200 ppm/k overload (4.13) u = 2.5 x ( p 70 x r ) 1/2 ? 2 x u max. ; 0.5 s (0.25 % r + 0.05 ? ) (0.5 % r + 0.05 ? ) solderability (4.17.5) (2) aging 4 h at 155 c, dryheat solder bath method; 235 c; 2 s visual examination good tinning ( ? 95 % covered) no visible damage resistance to soldering heat (4.18.2) solder bath method; (260 5) c; (10 1) s (0.25 % r + 0.05 ? ) (0.5 % r + 0.05 ? ) rapid change of temperature (4.19) 30 min at lct = - 55 c; 30 min at uct = 125 c; 5 cycles (0.25 % r + 0.05 ? ) (0.5 % r + 0.05 ? ) damp heat, steady state (4.24) (40 2) c; 56 days; (93 3) % rh (1 % r + 0.05 ? ) (2 % r + 0.1 ? ) climatic sequence (4.23) 16 h at uct = 125 c; 1 cycle at 55 c; 2 h at lct = - 55 c; 1 h/1 kpa at 15 c to 35 c; 5 cycles at 55 c u = ( p 70 x r ) 1/2 u = u max. ; whichever is less severe (1 % r + 0.05 ? ) (2 % r + 0.1 ? ) endurance at 70 c (4.25.1) u = ( p 70 x r ) 1/2 u = u max. ; whichever is less severe 1.5 h on; 0.5 h off; 70 c; 1000 h (1 % r + 0.05 ? ) (2 % r + 0.1 ? ) extended endurance (4.25.1.8) duration extended to 8000 h (2 % r + 0.1 ? ) (4 % r + 0.1 ? ) endurance at upper category temperature (4.25.3) uct = 125 c; 1000 h (1 % r + 0.05 ? ) (2 % r + 0.1 ? ) applicable specifications ? en 60115-1 ? ? en 140400 ? ? en 140401-802 ? ? iec 60068-2-x ? ? eia 481 generic specification ? sectional specification ? detail specification ? variety of environmental test procedures ? packaging of smd components
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