tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 1 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? applications 32-pin 5x5mm leadless smt package ? 2g / 3g / 4g wireless infrastructure ? lte / wcdma / cdma / edge ? if and rf applications ? general purpose wireless product features functional block diagram ? integrates dsa + amp functionality ? 50-4000 mhz broadband performance ? 13 db gain @ 2.14 ghz ? 3.9 db noise figure @ max gain setting ? +21.5 dbm p1db ? +38.5 dbm oip3 ? +5 v supply voltage ? 88 ma operating current ? mttf > 1000 years general description pin configuration the tqm8m9077 is a digitally controlled variable gain amplifier (dvga) with a broadband frequency range of 50 to 4000 mhz. the dvga features high linearity and low noise while providing digital variable gain with a 31.5 db of range in 0.5 db steps through a 6- bit serial mode control interface. this combination of perf ormance parameters makes the dvga ideal for receiver applications requiring gain control with high iip3. the tqm8m9077 integrates a high performance digital step attenuator and a high linearity, broad band gain block. both stages are internally matched to 50 ohms and do not require any external matching components. a serial output port enables cascading with other serial controlled devices . the tqm8m9077 is packaged in a rohs-compliant , compact 5x5 mm surface-mount leadless package . superior thermal des ign allows the product to have a minimum mttf rating of 1000 years at a mounting temperature of +85o c. the tqm8m9077 is targeted for use in wireless infrastructure, point-to-point, or can be used for any gener al purpose wireless application. ordering information part no. description tqm8m9077 digital variable gain amplifier TQM8M9077-PCB 0.3-4.0 ghz evaluation board standard t/r size = 2500 pieces on a 13? reel. pin # symbol 1 ampin 2, 3, 13, 28, 30, 31, 32 gnd (ground) 4 attout 5, 6, 7, 8, 9, 10 acg1-6 11, 15, 16, 18-24 nc (no connect) 14 sod 12 attin 17 vdd 25 clk 26 sid 27 le 29 ampout backside paddle rf/dc ground
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 2 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -65 to 150 c rf input power, cw, 50 ,t = 25oc +24 dbm supply voltage (v dd ) +6 v digital input voltage v dd +0.5 v operation of this device outside the parameter ranges give n above may cause permanent damage. recommended operating conditions parameter min typ max units v dd 4.75 5 5.25 v i dd 87 ma operating temp. range -40 +85 c t ch (for >10 6 hours mttf) 190 c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended opera ting conditions. electrical specifications test conditions unless otherwise noted: t lead =+25c, v dd =+5v (configured as dsa followed by amp) parameter conditions min typical max units operational frequency range 50 4000 mhz test frequency 2140 mhz gain 11 13 db gain control range 31.5 db gain accuracy (0.3 + 4% of atten. setting) max db attenuation step 0.5 db time rise / fall 10% / 90% rf 90 ns time on, time off 50% ctl to 10% / 90% rf 100 ns input return loss -17 db output return loss -10.5 db output p1db +21.5 dbm output ip3 see note 1 +35.5 +38.5 dbm noise figure at max gain level 3.9 db supply voltage +5 v supply current 70 88 110 ma thermal resistance (rth) channel to case 41 c/w notes: 1. oip3 measured with two tones at an output power of +3 dbm / tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the oip3 using a 2:1 rule.
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 3 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? serial control interface the tqm8m9077 has a cmos spi tm input compatible serial interface. this serial contro l interface converts the serial data input stream to parallel output word. the input is 3-wire (cl k, le and serin) spi tm input compatible. at power up, the serial control interface resets the dsa to the minimum gain state. the 6-bit serin word is loaded into the regi ster on rising edge of the clk, msb first. when le is high, clk is disab led. serin (msb in first 6-bit word) control logic truth table test conditions: 25oc, v dd = +5v 6 - bit control word to dsa lsb msb gain relative to maximum gain d5 d4 d3 d2 d1 d0 1 1 1 1 1 1 reference : il 1 1 1 1 1 0 0.5 db 1 1 1 1 0 1 1 db 1 1 1 0 1 1 2 db 1 1 0 1 1 1 4 db 1 0 1 1 1 1 8 db 0 1 1 1 1 1 16 db 0 0 0 0 0 0 31.5 db any combination of the possible 64 states will provide a r eduction in gain of approximately the sum of the bits selected. serial control interface timing diagram clk is disabled when le is high
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 4 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? serial control timing characteristics test conditions: 25oc, v dd = +5v parameter condition min max units clock frequency 50% duty cycle 10 mhz le setup time, t lesup after last clk rising edge 10 ns le pulse width, t lepw 30 ns serin set-up time, t sdsup before clk rising edge 10 ns serin hold-time, t sdhld after clk rising edge 10 ns le pulse spacing t le le to le pulse spacing 630 ns propagation delay t plo le to parallel output valid 30 ns serial control dc logic characteristics test conditions: 25oc, v dd = +5v parameter condition min max units low state input voltage 0 0.8 v high state input voltage 2.1 vdd v output high voltage on serout 2.0 vdd v output low voltage on serout 0 0.8 v input current, i ih / i il on serin, le and clk -10 +10 a
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 5 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? reference design 300-4000 mhz bill of material ref des value description manufacturer part number u1 n/a digital variable gain amp triquint tqm8m9077 l1 (note 4) 47 nh inductor, 0603 coilcraft 0603cs-47nxjlw c1, c2, c3 68 pf capacitor, 0402 various c4 , c5 , c6 , c7 330 pf capacitor, 0402 various c8 1000 pf capacitor, 0603 various c11 0.01 uf capacitor, 0603 various note 4: for if applications (<300 mhz) increase l1 to 330 nh. notes: 1. see pc board specifications section for material and stackup. 2. c4, c5, c6 and c7 may be removed for operation above 700 mhz.
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 6 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? typical performance test conditions: v dd =+5 v, temp=+25c notes: 1. gain values reflect de-embedding of 0.4 db eval board rf i/ o line losses that would not be present in target applicat ions. 2. oip3 measured with two tones at an output power of +3 dbm / t one separated by 1 mhz. the suppression on the largest im3 pr oduct is used to calculate the oip3 using 2:1 rule. 3. nf values reflect de-embedding of eval board rf i/o line l osses that would not be present in target applications. 4. unless otherwise stated, performance plots shown below for dvga maximum gain state. 9 10 11 12 13 14 15 16 0 1 2 3 4 gain (db) frequency (ghz) gain vs. frequency +85c +25c 40c -40 -30 -20 -10 0 0 1 2 3 4 input return loss (db) frequency (ghz) input return loss vs. frequency +85c +25c 40c -25 -20 -15 -10 -5 0 0 1 2 3 4 output return loss (db) frequency (ghz) output return loss vs. frequency +85c +25c 40c 30 35 40 45 50 0.0 1.0 2.0 3.0 4.0 oip3 (dbm) frequency (mhz) oip3 vs. frequency 1 mhz tone spacing pout / tone = +3 dbm +85 c +25 c ?40 c 16 18 20 22 24 26 0.0 1.0 2.0 3.0 4.0 p1db (dbm) frequency (ghz) p1db vs. frequency +85 c +25 c ?40 c 0 2 4 6 8 0 0.5 1 1.5 2 2.5 3 3.5 4 nf (db) frequency (ghz) noise figure vs. frequency +85 c +25 c ?40 c -25 -20 -15 -10 -5 0 5 10 15 20 0 1 2 3 4 gain (db) frequency (ghz) gain vs. frequency max gain min gain temp.=+25c, key bit states -30 -25 -20 -15 -10 -5 0 0 1 2 3 4 input return loss (db) frequency (ghz) input return loss vs. frequency min gain temp.=+25c key bit states max gain -40 -35 -30 -25 -20 -15 -10 -5 0 0 1 2 3 4 output return loss (db) frequency (ghz) output return loss vs. frequency temp.=+25c key bit states min gain max gain frequency mhz 500 900 2140 2700 3500 4000 gain (1) db 14.1 14.0 13.0 13.0 12.4 11.4 input return loss db -15.8 -16.2 -17.6 -32.5 -12.2 -10.1 output return loss db -14.3 -22.5 -10.5 -13.9 -13.6 -9.6 output p1db dbm +21.5 +21.7 +21.5 +20.5 +19.6 +18.3 output ip3 (2) dbm +40.7 +41.2 +38.5 +37.8 +36.3 +35.6 noise figure (3) db 3.0 3.1 3.9 4.3 5.5 6.2 amplifier current ma 88
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 7 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? pin description pin # sym bol description 1 ampin amp rf input 2, 3, 13, 28, 30, 31, 32 gnd (ground) dc ground 11, 15, 16, 18-24 nc (no connect) no electrical connection. provide land pads for pcb mounting integrity. 29 ampout amp rf output / dc supply 12 attin dsa input 4 attout dsa output 5, 6, 7, 8, 9, 10 acg1-6 place external capacitor to ground for applications below 700 mhz. 14 sod serial data out 17 vdd dc supply 25 clk serial clock 26 sid serial data in 27 le latch enable backside paddle rf/dc ground rf/ dc ground. provide recommended via pattern (see page 8) a nd e nsure good solder attach for best thermal and electrical perfo rmance. applications information pc board layout pcb material (stackup): 1 oz. cu top layer 0.014 inch nelco n-4000-13 ( r =3.7 typ.) 1 oz. cu middle layer 1 core nelco n-4000-13 1 oz. cu middle layer 2 0.014 inch nelco n-4000-13 1 oz. cu bottom layer finished board thickness is 0.062.006 inches the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended.
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 8 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? mechanical information package information & dimensions marking: part number - tqm8m9077 year, week, country code - yyww cccc assembly code ? aaxxxx pcb mounting pattern 2x 32x seating plane 5.00.1 5.00.1 1.90 1.90 1.90 1.90 4.50 1.020.08 2x 0.25 32x 0.50 pitch c 0.25 5 terminal #1 identifier (32x) 0.450x x 0.240y 0.10 c a b terminal #1 identifier 4 gnd/thermal pad 0.20 5 4.50 (1x) shape 0.10 c a b 32x 0.10 .10 c .10 c .10 c .08 c tqm8m9077 yyww ccc aaxxxx notes: 1. all dimensions are in millimeters. angles are in d egrees. 2. except where noted, this part outline conforms to j edec standard mo-270, issue b (variation dae) for extra thin profile, fine pitch, internal stacking module (ism). 3. dimension and tolerance formats conform to asme y14 .4m-1994. 4. the terminal #1 identifier and terminal numbering c onform to jesd 95-1 spp-012. 5. co-planarity applies to the exposed ground/thermal pad as well as the contact pins. 6. contact plating: electrolytic plated au over ni notes: 1. all dimensions are in millimeters. angles are in d egrees. 2. use 1 oz. copper minimum for top and bottom layer m etal. 3. vias are required under the backside paddle of this device for proper rf/dc grounding and thermal diss ipation. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diamete r of 0.25mm (0.10?). 4. ensure good package backside paddle solder attach f or reliable operation and best electrical performan ce. 5. place mounting screws near the part to fasten a bac k side heat sink. 6. do not apply solder mask to the back side of the pc board in the heat sink contact region. 7. ensure that the backside via region makes good phys ical contact with the heat sink. component side 28x 0.75 0.50 pitch 3.70 3.70 0.12 28x 0.28 25x package outline 0.66 0.76 0.38 3 1
tqm8m9077 0.05-4 ghz digital variable gain amplifier datasheet : rev d 01 - 2 0 - 1 2 - 9 of 9 - disclaimer: subject to change without notice ? 2012 triquint semiconductor, inc. connecting the d igital world to the global network ? product compliance information esd information esd rating: class 1a value: > 250v to <500v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: < 1000v test: charged device model (cdm) standard: jedec standard jesd22-c101 solderability compatible with both j-std-020 lead-free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level 3 at +260 c convection reflow per jedec standard ipc/jedec j-std-020. contact information for the latest specifications, additional product infor mation, worldwide sales and distribution locations, and in formation about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reli able. triquint makes no warranties regarding the infor mation contain herein. triquint assumes no responsibility or liabi lity whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the info rmation contained herein is provided "as is, where is" and with all faul ts, and the entire risk associated with such informatio n is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and v erify the latest relevant information before placing orders for triquint p roducts. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other i ntellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for us e as critical components in medical, life-saving, or li fe-sustaining applications, or other applications where a failure wo uld reasonably be expected to cause severe personal injury o r death.
|
