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tb6595fl/flg 2006-3-6 1 toshiba bi-cd integrated ci rcuit silicon monolithic tb6595fl/flg dual-bridge driver ic for dc motor tb6595fl/flg is a quad-bridge driver ic for dc motor with output transistor in ld mos structure with low on-resistor. two input signals, in1 and in2, can chose one of four modes such as cw, ccw, short brake, and stop mode.. features ? power supply voltage for motor: vm < = 6 v (max) ? power supply voltage for control: v cc = 2.7~6.0 v ? output current: : 0.8 a (max) ? low on resistor: 1.5 ? (typ.@vm=5v,vcc=5v) ? standby (power save)system ? cw/ccw/short brake/stop function modes. ? built-in thermal shutdown circuit * this product has a mos structure and is sensitive to electrostatic discha rge. when handling this product, ensure that the environment is protec ted against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. weight qon36-p-0606-0.50 : 0.08 g (typ.) the following conditions apply to solderability: *solderability 1. use of sn-37pb solder bath *solder bath temperature = 230 o c *dipping time = 5 seconds *number of times = once *use of r-type flux 2. use of sn-3.0ag-0.5cu solder bath *solder bath temperature = 245 o c *dipping time = 5 seconds *number of times = once *use of r-t yp e flux
tb6595fl/flg 2006-3-6 2 block diagram (/% 7dd )#sjehf " "*/ "*/ 7. "0 "0 1(/%" #0 #0 $pouspm -phjd" #*/ #*/ $pouspm -phjd# )#sjehf $ )#sjehf % $*/ $*/ 7. $0 $0 1(/%$ %0 %0 $pouspm -phjd$ %*/ %*/ $pouspm -phjd% $18. 54% 45#:" 45#:# /$ %18. "18. #18. 45#:% 45#:$ /$ 1(/%# 1(/%% )#sjehf # 7. 7. 24 22
tb6595fl/flg 2006-3-6 3 input/output function *oqvu 0vuqvu */ */ 45#: 18. 065 065 .pef ) - ! ! 4ipsucsblf ) ! 'psxbsesfwfstf ! - - - 4ipsucsblf ) ! 'psxbsesfwfstf ! - - - 4ipsucsblf ) ! ! - 0'' )jhijnqfebodf
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operating description ? to prevent penetrating current, dead time t is provided in the ic. " gnd " gnd " gnd t2=500ns (typ.) out2 out1 out1 out1 out2 out2
tb6595fl/flg 2006-3-6 4 absolute maximum ratings (ta = 25c) characteristics symbol rating unit remark vm 6 v supply voltage v cc 6 input voltage v in ?0. 2 to 6 v in1, in2, pwm, stby output current i out 0.8 a power dissipation p d 0.78 w note1 operating temperature t opr ? 20 to 85 c storage temperature t stg ? 55 to 150 c note 1: this value is obtained by 50 30 1.6 mm glass-epoxy pcb mounting occupied 40% of copper area. operating range (ta = ? 20 to 85 c) characteristics symbol min typ. max unit supply voltage (v cc ) v cc 2.7 5 5.5 v supply voltage (vm) vm 2.2 5 5.5 v output current iout ? ? 0.6 a
tb6595fl/flg 2006-3-6 5 electrical characteristics (unless otherwise specified, v cc =5 v, vm = 5 v, ta = 25c) characteristics symbol test condition min typ. max unit i cc (stp) stop mode ? 1.3 1.8 i cc2 (w) cw/ccw mode ? 1.3 1.8 i cc3 (sb) short break mode ? 1.3 1.8 ma i cc4 (stb) ? ? 10 supply current im(stb) standby(power save) mode ? ? 1 a v inh 2 ? v cc + 0.2 input voltage v inl ? 0.2 ? 0.8 hysteresis voltage v in (his) (not tested) ? 0.2 ? v i inh 5 15 25 control circuit input current i inl ? ? 1 a v insh 2 ? v cc + 0.2 input voltage v insl ? 0.2 ? 0.8 v i insh 5 10 20 standby circuit input current i insl ? ? 1 a i o = 0.2a ? 0.3 0.4 output saturating voltage v sat (u + l) i o = 0.6a ? 0.9 1.2 v i l (u) ? ? 1 output leakage current i l (l) vm = 5.5 v ? ? 1 a v f (u) i o = 0.6 a ? 1 1.2 diode forward voltage v f (l) i o = 0.6 a ? 1 1.2 v thermal shutdown circuit operating temperature t sd ? 170 ? thermal shutdown hysteresis ? t sd (not tested) ? 20 ? c
tb6595fl/flg 2006-3-6 6 application example note) ~ vm1, vm2, vm3 and vm4 pins should be connected outside. ~ utmost care is necessary in the design of the output, v cc , v m , and gnd lines since the ic may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper groundi ng, or by short-circuiting between contiguous pins. 7. )48" "0 .pups #0 )48# #0 .pups $0 )48$ $0 .pups %0 )48% %0 .pups "*/ "*/ $pouspm -phjd " 7. 7. 7. 7dd (/% 1( 1( 1( 1( "18. "0 45#:" #*/ #*/ $pouspm -phjd # #18. 45#:# $*/ $*/ $pouspm -phjd $ $18. 45#:$ %*/ %*/ $pouspm -phjd % %18. 45#:% $16 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 1psu 7. ?o 7dd ?o 24 22
tb6595fl/flg 2006-3-6 7 requests concerning use of qon outline drawing of package when using qon, please take in to account the following items. caution (1) do not carry out soldering on the island section in the four corners of the package (the section shown on the lower surface drawing with diagonal lines) with the aim of increasing mechanical strength. (2) the island section exposed on the package surface (the section shown on the upper surface drawing with diagonal lines) must be used as (note 6) below while electrically insulated from outside. note 6: ensure that the island section (the secti on shown on the lower surface drawing with diagonal lines) does not come into contact with solder from through-holes on the board layout. ? when mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the ic (measures to prevent anti-static, leaks, etc.). ? when incorporating into a set, adop t a set design that does not apply voltage directly to the island section. (upper surface) (lower surface)
tb6595fl/flg 2006-3-6 8 package dimensions 20/1 unit : mm weight: 0.08 g (typ.)
tb6595fl/flg 2006-3-6 9 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
tb6595fl/flg 2006-3-6 10 points to remember on handling of ics (1) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (2) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (3) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be ex posed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-em f into consideration in system design.
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