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  january 2012 doc id 15497 rev 5 1/14 14 stac2932b hf/vhf/uhf rf power n-channel mosfets features gold metallization excellent thermal stability common source push-pull configuration p out = 300 w min. with 20 db gain @ 175 mhz in compliance with the 2002/95/ec european directive st air cavity packaging technology - stac ? package description the stac2932b is a gold metallized n-channel mos field-effect rf power transistor, intended for use in 50 v dc large signal applications up to 250 mhz. the stac2932b benefits from the latest generation of efficient, patent-pending package technology, otherwise known as stac ? figure 1. pin connection stac244b air cavity 1 1 2 2 3 1. drain 2. gate 3. source (bottom side) table 1. device summary order code marking base qty. package packaging STAC2932BW stac2932 (1) 20 stac244b tray 1. for more details please refer to chapter 7: marking, packing and shipping specifications . www.st.com
contents stac2932b 2/14 doc id 15497 rev 5 contents 1 electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 marking, packing and shipping specifications . . . . . . . . . . . . . . . . . . . 12 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
stac2932b electrical data doc id 15497 rev 5 3/14 1 electrical data 1.1 maximum ratings (t case = 25 c) 1.2 thermal data table 2. absolute maximum ratings symbol parameter value unit v (br)dss (1) 1. t j = 150 c drain source voltage 125 v v dgr drain-gate voltage (r gs = 1 m )125v v gs gate-source voltage 20 v i d drain current 40 a p diss power dissipation 625 w t j max. operating junction temperature 200 c t stg storage temperature -65 to +150 c table 3. thermal data symbol parameter value unit r thjc junction - case thermal resistance 0.28 c/w
electrical characteristics stac2932b 4/14 doc id 15497 rev 5 2 electrical characteristics t case = +25 c 2.1 static 2.2 dynamic table 4. static (per side) symbol test conditions min. typ. max. unit v (br)dss v gs = 0 v i ds = 100 ma 125 v i dss v gs = 0 v v ds = 50 v 50 a i gss v gs = 20 v v ds = 0 v 250 na v gs(q) v ds = 10 v i d = 250 ma 1.5 2.5 4.0 v v ds(on) v gs = 10 v i d = 10 a 3.0 v g fs v ds = 10 v i d = 5 a 5 s c iss v gs = 0 v v ds = 50 v f = 1 mhz 468 pf c oss 206 pf c rss 16 pf table 5. dynamic symbol test conditions min. typ. max. unit p out v dd = 50 v, i dq = 2 x 250 ma, p in = 4 w, f = 175 mhz 300 390 w h d v dd = 50 v, i dq = 2 x 250 ma, p in = 4 w, f = 175 mhz 55 68 %
stac2932b impedance doc id 15497 rev 5 5/14 3 impedance figure 2. current conventions note: measured gate to gate and drain to drain, respectively. table 6. impedance data freq. (mhz) z in ( )z dl ( ) 175 mhz 2.0 - j2.0 3.5 + j5.2
typical performance stac2932b 6/14 doc id 15497 rev 5 4 typical performance figure 3. capacitances vs drain supply voltage figure 4. output power vs drain supply voltage             #apacitancesp& 6dd6 #oss #rss #iss !-v                        0out7 6dd6 0in7 0in7 0in7 ".w )uht 0+] ,gt [p$ 7fdvh  & figure 5. output power vs gate voltage figure 6. output power vs input power                        0out7 6gs6 4case  ? # 4case  ? # 4case  ? # !-v )uht 0+] ,gt [p$ 7fdvh   & 0in 7               0out7 )nputpower7 6dd6 6dd6 )uht 0+] ,gt [p$ 7fdvh  & !-v
stac2932b typical performance doc id 15497 rev 5 7/14 figure 7. output power vs input power and case temperature figure 8. efficiency vs output power and case temperature                    0out7 )nputpower7 4case  ? # 4case  ? # 4case  ? # )uht 0+] 9gg 9 ,gt [p$ !-v                         %fficiency /utputpower7 4case  ? # 4case  ? # 4case  ? # )uht 0+] 9gg 9 ,gt [p$ $0y
test circuit stac2932b 8/14 doc id 15497 rev 5 5 test circuit figure 9. 175 mhz test circuit schematic (production test circuit) %14' ($ ($ ?)#2?$'69''0?)4170&? ?64#05/+55+10?.+0'5?+5?=??????? ???????6;2 ?&+/'05+105?#6?%1/210'06?5;/$1.5?#4'?4'('4'0%'?(14?%1/210'06? 2.#%'/'06?5''?5*''6? ($ 016'5 % $ % %14' % 4 % 4 ($ 4 % %14' % 6 6 %14' ($ % ($ 4 4 % % 4 6 g f % % % % % % 6 % 6 8ii 64#05/+55+10?.+0'?&+/'05+105 % $ # $ # # % % $ # $ ## % % # ?52#%' # % % % % % $ .+ ($ 8 // +0 &+/    % $ #    &+/'05+10?6#$.' % 8ii table 7. 175 mhz test circuit part list component description c1, c2, c14, c15, c24, c25 1200 pf atc 700b chip capacitor c5 75 pf atc 100b chip capacitor c6 st406 variable capacitor c9, c10 47 pf atc 100b chip capacitor c11, c12, c13 43 pf atc 100b chip capacitor c16, c18 470 pf atc 100b chip capacitor c17, c19, c20, c21 10,000 pf atc 200b chip capacitor c22, c23 0.1 f 200 v chip capacitor c28 10 f 100 v electrolytic capacitor c29 0.8 - 8 pf variable capacitor r1, r2, r5, r6 430 , 1/2 w chip resistor
stac2932b test circuit doc id 15497 rev 5 9/14 component description r3, r4 270 1/2 w axial lead resistor b1 rg-316 50 11.8" thru ferrite toroidal b2 rg-142 50 11.8" t1 4:1, rg-316 25 , 5.9", 2 turns thru ferrite core t2 1:4, 25 semi-rigid cable, od.141?, 5.9" l1 /4 inductor, rg-142 50 , 11.8", 3 turns thru ferrite toroid fb1,fb5 ferrite toroidal fb2, fb6 multi-aperture core fb3, fb4 surface mount ferrite bead pcb rogers ultralam 2000, er 2.55, 0.060? table 7. 175 mhz test circuit part list (continued) figure 10. circuit layout
package mechanical data stac2932b 10/14 doc id 15497 rev 5 6 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack is an st trademark.
stac2932b package mechanical data doc id 15497 rev 5 11/14 figure 11. stac244b mechanical data drawing table 8. stac244b mechanical data dim. mm min. typ. max. a5.08 5.59 a1 4.32 4.83 b4.32 5.33 c9.65 9.91 d 17.78 18.08 e 33.88 34.19 f0.10 0.15 g1.02 h1.45 1.70 i4.83 5.33 j9.27 9.52 k 27.69 28.19 l 3.12 3.23 3.33 m 3.35 3.45 3.56
marking, packing and shipping specifications stac2932b 12/14 doc id 15497 rev 5 7 marking, packing and shipping specifications figure 12. marking layout table 9. packing and shipping specifications order code packaging pcs per tray dry pack humidity lot code STAC2932BW tray 20 < 10 % not mixed table 10. marking specifications symbol description w wafer process code cz assembly plant xxx last 3 digit of diffusion lot vy diffusion plant mar country of origin cz test and finishing plant y assembly year yy assembly week
stac2932b revision history doc id 15497 rev 5 13/14 8 revision history table 11. document revision history date revision changes 20-mar-2009 1 first release. 29-jun-2010 2 updated features and description on cover page. 12-aug-2011 3 update figures on coverpage and section 6: package mechanical data . inserted section 7: marking, packing and shipping specifications . minor text changes. 05-sep-2011 4 update l and m dimensions table 8 on page 11 . 12-jan-2012 5 minor text changes to improve readability.
stac2932b 14/14 doc id 15497 rev 5 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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