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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. ? 1998, 2000 document no. p14145ej3v0ds00 (3rd edition) date published september 2000 ns cp (k) printed in japan photocoupler ps2765-1 high isolation voltage ac input response type 4-pin sop photocoupler - nepoc tm series - the mark ? ? ? ? shows major revised points. description the ps2765-1 is an optically coupled isolator containing gaas light emitting diodes and an npn silicon phototransistor. this package is mounted in a plastic sop (small outline package) for high density applications. the package has shield effect to cut off ambient light. features ? isolation distance (0.4 mm min.) ? ac input response ? sop (small outline package) type ? high isolation voltage (bv = 3 750 vr.m.s.) ? high-speed switching (t r = 4 m s typ., t f = 5 m s typ.) ? ordering number of taping product: PS2765-1-F3, f4 ? ul approved: file no. e72422 (s) ? bsi approved: no. 8436/8437 applications ?hybrid ic ? programmable logic controllers ? power supply
data sheet p14145ej3v0ds00 2 ps2765-1 package dimensions (unit: mm) top view 1. anode, cathode 2. cathode, anode 3. emitter 4. collector 43 12 40.5 7.00.3 4.4 0.50.3 0.15 +0.10 C0.05 0.10.1 2.10.2 2.54 0.4 +0.10 C0.05 0.25 m photocoupler construction parameter unit (min.) air distance 5 mm creepage distance 5 mm isolation distance 0.4 mm
data sheet p14145ej3v0ds00 3 ps2765-1 ordering information part number package packing style application part number *1 ps2765-1 4-pin sop magazine case 100 pcs ps2765-1 PS2765-1-F3 embossed tape 3 500 pcs/reel ps2765-1-f4 *1 for the application of the safety standard, following part number should be used. absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit diode forward current (dc) i f 50 ma power dissipation p d 80 mw peak forward current *1 i fp 1.0 a transistor collector to emitter voltage v ceo 40 v emitter to collector voltage v eco 5v collector current i c 40 ma power dissipation derating d p c / c1.5mw/ c power dissipation p c 150 mw isolation voltage *2 bv 3 750 vr.m.s. operating ambient temperature t a C55 to +100 c storage temperature t stg C55 to +150 c *1 pw = 100 m s, duty cycle = 1 % *2 ac voltage for 1 minute at t a = 25 c, rh = 60 % between input and output
data sheet p14145ej3v0ds00 4 ps2765-1 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 5 ma 1.1 1.4 v terminal capacitance c t v = 0 v, f = 1 mhz 30 pf transistor collector to emitter dark current i ceo i f = 0 ma, v ce = 40 v 100 na coupled current transfer ratio (i c /i f ) *1 ctr i f = 5 ma, v ce = 5 v 50 100 400 % collector saturation voltage v ce (sat) i f = 10 ma, i c = 2 ma 0.3 v isolation resistance r i-o v i-o = 1 kv dc 10 11 w isolation capacitance c i-o v = 0 v, f = 1 mhz 0.4 pf rise time *2 t r v cc = 5 v, i c = 2 ma, r l = 100 w 4 m s fall time *2 t f 5 *1 ctr rank n: 50 to 400 (%) *2 test circuit for switching time v cc v out i f r l = 100 w 50 w pulse input in monitor pw = 100 s duty cycle = 1/10 m
data sheet p14145ej3v0ds00 5 ps2765-1 typical characteristics (t a = 25 c, unless otherwise specified) ambient temperature t a (?c) diode power dissipation p d (mw) diode power dissipation vs. ambient temperature ambient temperature t a ( ?c) transistor power dissipation p c (mw) transistor power dissipation vs. ambient temperature forward voltage v f (v) forward current i f (ma) forward current vs. forward voltage collector to emitter voltage v ce (v) collector current i c (ma) collector current vs. collector to emitter voltage ambient temperature t a (?c) collector to emitter dark current i ceo (na) collector to emitter dark current vs. ambient temperature collector saturation voltage v ce(sat) (v) collector current i c (ma) collector current vs. collector saturation voltage 210 150 180 60 90 120 30 25 50 75 100 0 100 10 1 0.1 0.01 0.0 0.5 1.0 1.5 2.0 0 ?c C25 ?c C50 ?c +60 ?c +25 ?c t a = +100 ?c 68 4 2 010 35 30 20 25 15 5 10 10 ma 5 ma C25 0 25 50 75 100 1 10 100 1 000 10 000 v ce = 20 v 40 v 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 2 ma 5 ma 10 ma i f = 1ma i f = 25 ma 20 ma 15 ma 100 40 60 80 20 0 25 50 75 100
data sheet p14145ej3v0ds00 6 ps2765-1 frequency response frequency f (khz) normalized gain gv long term ctr degradation time (hr) ctr (relative value) forward current i f (ma) current transfer ratio ctr (%) current transfer ratio vs. forward current normalized to 1.0 at t a = 25 ?c, i f = 5 ma, v ce = 5 v ambient temperature t a (?c) normalized current transfer ratio ctr normalized current transfer ratio vs. ambient temperature switching time t ( s) m load resistance r l ( w) switching time vs. load resistance load resistance r l ( w) switching time vs. load resistance switching time t ( s) m 1.2 1.4 C50 1.0 0.8 0.6 0.4 0.2 0.0 C25 025 50 75 100 100 10 1 10 k 1 k 100 10 i c = 2 ma, v cc = 5 v, ctr = 200 % 0 C5 C10 C15 C20 C25 0.1 1 10 100 1 000 100 w 300 w r l = 1 k w 0.1 1 10 100 0 50 100 150 200 250 300 350 400 v ce = 5 v, n = 3 t f t r t d t s 0.1 1 10 100 1 000 i f = 1 ma, v cc = 5 v, ctr = 200 % 10 100 1 k 10 k 100 k t f t s t r t d 1.2 1.0 0.0 0.4 0.2 0.8 0.6 10 2 10 3 110 4 10 5 10 6 i f = 1 ma, t a = 25 ?c i f = 5 ma, t a = 25 ?c i f = 20 ma, t a = 25 ?c i f = 20 ma, t a = 60 ?c i f = 5 ma
remark the graphs indicate nominal characteristics.
data sheet p14145ej3v0ds00 7 ps2765-1 taping specifications (in millimeters) outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.550.1 1.750.1 5.50.1 12.00.2 4.60.1 2.40.1 7.40.1 0.3 8.00.1 tape direction PS2765-1-F3 ps2765-1-f4 outline and dimensions (reel) packing: 3 500 pcs/reel 12.4 +2.0 C0.0 805.0 f 13.00.5 f 330 f 1.50.5 2.00.5 6.01 21.00.8 f 1 2 0 ? 6 0 ? 1.5
data sheet p14145ej3v0ds00 8 ps2765-1 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 235 c or below (package surface temperature) ? time of temperature higher than 210 c 30 seconds or less ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt % is recommended.) 60 to 120 s (preheating) 210 ?c 100 to 160 ?c package surface temperature t (?c) time (s) (heating) to 10 s to 30 s 235 ?c (peak temperature) recommended temperature profile of infrared reflow (2) dip soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt % is recommended.) (3) cautions ?fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly between the photocouplers input and output or between corrector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.
data sheet p14145ej3v0ds00 9 ps2765-1 [memo]
data sheet p14145ej3v0ds00 10 ps2765-1 [memo]
data sheet p14145ej3v0ds00 11 ps2765-1 [memo]
ps2765-1 caution within this device there exists gaas (gallium arsenide) material which is a harmful substance if ingested. please do not under any circumstances break the hermetic seal. nepoc is a trademark of nec corporation. m8e 00. 4 the information in this document is current as of september, 2000. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).

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