samtec usa ?tel: 1-800-samtec-9 or 812-944-6733 ?fax: 812-948-5047 samtec uk ?tel: 01236 739292 ?fax: 01236 727113 samtec asia pacific ?tel: 65-745-5955 ?fax: 65-841-1502 samtec germany ?tel: +49 (0) 89 / 89460-0 ?fax: +49 (0) 89 / 89460-299 samtec france ?tel: 01 60 95 06 60 ?fax: 01 60 95 06 61 samtec italy ?tel: 39 039 6890337 ?fax: 39 039 6890315 samtec japan ?tel: 81-424-42-8318 ?fax: 81-424-42-8319 samtec china ?tel: 86-21-5385-4089 ?fax: 86-21-5385-4047 samtec taiwan ?tel: (02) 2395-1677 ?fax: (02) 2395-1689 due to technical progress, all designs, specifications and components are subject to change without notice. factsheet f-200 cpc2 110 b 01 sg cpc2 108??2?g?u cpc2 116 e 03 sg choice of (0,64mm) .025" or (1,27mm) .050" pitch choice of cavity up or down robust phosphor bronze leads with soft gold plating cpc2 no. of positions other option plating option sg = 30 " (0,76 m) soft gold (.9999 pure) 04, 08, 10, 16, 20, 24, 28 note: some sizes, styles and options are non-standard, non-returnable. cu option (cavity up) leave blank for cavity down cu = cavity up ldc = (1,52mm) .060" thick cupped lid with (0,76mm) .030" cavity ldf = (0,76mm) .030" thick flat lid 1 specifications materials: insulator material: liquid crystal polymer contact material: phosphor bronze operating temp range: -65 c to +105 c with tin; -65 c to +125 c with gold plating: au over 50 " (1,27 m) ni current rating: testing now! max processing temp: 230 c for 60 seconds smt lead coplanarity: (0,10mm) .004" max body style lead pitch b = (0,64mm) .025" pitch e = (1,27mm) .050" pitch specify body style from chart no. of positions x pitch / 2 + (3,81) .150 (0,20) .008 (0,71) .028 typ no. of positions x pitch / 2 + (1,50) .059 a d c no. of positions x pitch / 2 + (0,08) .003 b (2,31) .091 (2,79) .110 (1,65) .065 (0,81) .032 (1,14) .045 body style 01 02 03 a (3,81) .150 (7,62) .300 (12,70) .500 b (7,54) .297 (11,35) .447 (16,43) .647 c (9,68) .381 (13,49) .531 (18,57) .731 lead pitch b e d (0,64) .025 (1,27) .050 chip package cpc2 series standard option (cavity down) also available optional lids for chip/wire bond protection.
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