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w29ee011 128k 8 cmos flash memory publication release date: april 11, 2006 - 1 - revision a18 table of contents- 1. general des cription ......................................................................................................... 3 2. features ....................................................................................................................... .......... 3 3. pin config urations............................................................................................................. 4 4. block diagram .................................................................................................................. .... 5 5. pin descri ption................................................................................................................ ..... 5 6. functional d escription.................................................................................................... 6 6.1 read m ode ..................................................................................................................... 6 6.2 page write mode ............................................................................................................ 6 6.3 software-protected data write ....................................................................................... 6 6.4 hardware data protection .............................................................................................. 7 6.5 data polling (dq7)-write status detection .................................................................... 7 6.6 toggle bit (dq6)-write status dete ction........................................................................ 7 6.7 5-volt-only softwar e chip er ase..................................................................................... 7 6.8 product identif ication ...................................................................................................... 7 7. table of operat ing modes .............................................................................................. 8 7.1 operating mode selection .............................................................................................. 8 7.2 command codes for softwar e data prot ection ............................................................. 8 7.2.1 software data protecti on acquisitio n flow ...............................................................9 7.3 command codes for softw are chip erase .................................................................. 10 7.3.1 software chip erase acquisiti on flow ....................................................................10 7.4 command codes for produc t identification.................................................................. 11 7.4.1 software product identific ation acquisi tion fl ow ....................................................11 8. electrical chara cteristics......................................................................................... 12 8.1 absolute maximu m ratings .......................................................................................... 12 8.2 dc characteri stics ........................................................................................................ 12 8.2.1 operating charac teristic s .......................................................................................12 8.2.2 power-up ti ming ....................................................................................................12 8.2.3 capacit ance............................................................................................................13 8.3 ac characte ristics ........................................................................................................ 13 8.3.1 ac test c onditions .................................................................................................13 8.3.2 ac test load and waveform s................................................................................13 8.3.3 read cycle timi ng parame ters..............................................................................14 8.3.4 byte/page-write cycle timing para meters .............................................................14 8.3.5 data polling and toggle bit timing pa rameters .....................................................15 9. timing wave forms ............................................................................................................. 16 9.1 read cycle timi ng diagram......................................................................................... 16 9.2 #we controlled write cy cle timing di agram............................................................... 16 9.3 #ce controlled write cy cle timing di agram ............................................................... 17
w29ee011 - 2 - 9.4 page write cycle timing di agram................................................................................ 17 9.5 #data polling timi ng diagra m .................................................................................... 18 9.6 toggle bit timi ng diagram ........................................................................................... 18 9.7 page write timing diagram softwar e data protec tion mode ...................................... 19 9.8 reset software data protec tion timing diagram......................................................... 19 9.9 5 volt-only software chip erase timing diagr am ........................................................ 20 10. ordering info rmatio n..................................................................................................... 21 11. how to read the top marking...................................................................................... 22 12. package dime nsions ......................................................................................................... 23 12.1 32-pin p- dip ................................................................................................................. 23 12.2 32-pin pl cc ................................................................................................................. 23 12.3 32-pin tsop (8 x 20 mm)............................................................................................. 24 12.4 32-pin stsop (8 x 14 mm) .......................................................................................... 24 13. version hi story ................................................................................................................ .25
w29ee011 publication release date: april 11, 2006 - 3 - revision a18 1. general description the w29ee011 is a 1-megabit, 5-volt only cmos flash memory organized as 128k 8 bits. the device can be programmed and erased in-system with a standard 5v power supply. a 12-volt v pp is not required. the unique cell architecture of the w2 9ee011 results in fast program/erase operations with extremely low current consumption (compared to other comparable 5-volt flash memory products). the device can also be programmed and er ased using standard eprom programmers. 2. features y single 5-volt program and erase operations y fast page-write operations ? 128 bytes per page ? page program cycle: 10 ms (max.) ? effective byte-program cycle time: 39 s ? optional software-protected data write y fast chip-erase operation: 50 ms y read access time: 90/150 ns y page program/erase cycles: 1k/10k y ten-year data retention y software and hardware data protection y low power consumption ? active current: 25 ma (typ.) ? standby current: 20 a (typ.) y automatic program timing with internal v pp generation y end of program detection ? toggle bit ? data polling y latched address and data y ttl compatible i/o y jedec standard byte-wide pinouts y available packages: 32-pin 600 mil dip, 32-pin tsop (8 x 20 mm), 32-pin stsop (8 x 14 mm), 32-pin plcc, and lead-free 32-pin plcc
w29ee011 - 4 - 3. pin configurations 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 dq0 dq1 dq2 gnd a7 a6 a5 a4 a3 a2 a1 a0 nc a16 a15 a12 v #we a14 a13 a8 a9 a11 #oe a10 #ce dq7 dq6 dq5 dq4 dq3 dd nc 32-pin dip 5 6 7 9 10 11 12 13 a7 a6 a5 a4 a3 a2 a1 a0 dq0 29 28 27 26 25 24 23 22 21 30 31 32 1 2 3 4 8 20 19 18 17 16 15 14 d q 1 d q 2 g n d d q 3 d q 4 d q 5 d q 6 a14 a13 a8 a9 a11 #oe a10 #ce dq7 a 1 2 a 1 6 n c v d d # w e a 1 5 32-pin plcc 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 a3 a2 a1 a0 dq0 dq1 dq2 gnd #oe a10 #ce dq7 dq6 dq5 dq4 dq3 32-pin tsop a15 a12 a7 a6 a5 a4 v #we a14 a13 a8 dd a11 a9 nc 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 a16 nc n c
w29ee011 publication release date: april 11, 2006 - 5 - revision a18 4. block diagram control output buffer decoder core array #ce #oe #we a0 . . a16 . . dq0 dq7 v dd gnd 5. pin description symbol pin name a0 ? a16 address inputs dq0 ? dq7 data inputs/outputs #ce chip enable #oe output enable #we write enable v dd power supply gnd ground nc no connection
w29ee011 - 6 - 6. functional description 6.1 read mode the read operation of the w29ee011 is controlled by #ce and #oe, both of which have to be low for the host to obtain data from the outputs. #ce is used for device selection. when #c e is high, the chip is de-selected and only standby power will be consumed . #oe is the output control and is used to gate data from the output pins. the data bus is in high impedance state when either #ce or #oe is high. refer to the timing waveforms for further details. 6.2 page write mode the w29ee011 is programmed on a page basis. ever y page contains 128 bytes of data. if a byte of data within a page is to be changed, data for the entire page must be loaded into the device. any byte that is not loaded will be erased to "ffh" during programming of the page. the write operation is initiated by forcing #c e and #we low and #oe high. the write procedure consists of two steps. step 1 is the byte-load cycle, in which the ho st writes to the page buffer of the device. step 2 is an internal programming cycl e, during which the data in the page buffers are simultaneously written into the memory array for non-volatile storage. during the byte-load cycle, the addresses are latc hed by the falling edge of either #ce or #we, whichever occurs last. the data are latched by the ri sing edge of either #ce or #we, whichever occurs first. if the host loads a second byte into the page buffer within a byte-load cycle time (t blc ) of 200 s, after the initial byte-load cycle, the w29ee011 w ill stay in the page load cycle. additional bytes can then be loaded consecutively. the page load cycle will be terminated and the internal programming cycle will start if no additional byte is loaded into the page buffer within 300 s (t blco ) from the last byte-load cycle, i.e., there is no subsequent #we high-to-low transition after the last rising edge of #we. a 7 to a 16 specify the page address. all bytes that are loaded into the page buffer must have the same page address. a 0 to a 6 specify the byte address within the page. the bytes may be loaded in any order; sequential loading is not required. in the internal programming cycle, all data in t he page buffers, i.e., 128 bytes of data, are written simultaneously into the memory array. before the completion of the internal programming cycle, the host is free to perform other tasks such as fetching dat a from other locations in the system to prepare to write the next page. 6.3 software-protected data write the device provides a jedec-approved optional softw are-protected data write. once this scheme is enabled, any write operation requires a series of thre e-byte program commands (with specific data to a specific address) to be performed before the dat a load operation. the three-byte load command sequence begins the page load cycle, without which t he write operation will not be activated. this write scheme provides optimal protection against inadvertent write cycles, such as cycles triggered by noise during system power-up and power-down. the w29ee011 is shipped with the software data protection enabled. to enable the software data protection scheme, perform the three-byte command cycle at the beginning of a page load cycle. the device will then enter the software data protection m ode, and any subsequent write operation must be preceded by the three-byte program command cycle. once enabled, the software data protection will remain enabled unless the disable commands are issued. a power transition will not reset the software data protection feature. to reset the device to unprotected mode, a six-byte command sequence is required. see table 3 for specific code s and figure 10 for the timing diagram.
w29ee011 publication release date: april 11, 2006 - 7 - revision a18 6.4 hardware data protection the integrity of the data stored in the w29ee011 is also hardware protected in the following ways: (1) noise/glitch protection: a #we pulse of less than 15 ns in duration will not initiate a write cycle. (2) v dd power up/down detection: the programming and read operation are inhibited when v dd is less than 3.8v. (3) write inhibit mode: forcing #oe low, #ce high, or #we high will inhibit the write operation. this prevents inadvertent writes during power-up or power-down periods. 6.5 data polling (dq7)-write status detection the w29ee011 includes a data polling feature to indica te the end of a programming cycle. when the w29ee011 is in the internal programming cycle, any attempt to read dq 7 of the last byte loaded during the page/byte-load cycle will receive the complement of the true data. once the programming cycle is completed. dq 7 will show the true data. 6.6 toggle bit (dq6)-write status detection in addition to data polling, the w29ee011 provid es another method for determining the end of a program cycle. during the internal programming cycle, any consecutive attempts to read dq 6 will produce alternating 0's and 1's. when the programmi ng cycle is completed, this toggling between 0's and 1's will stop. the device is t hen ready for the next operation. 6.7 5-volt-only software chip erase the chip-erase mode can be initiated by a six-by te command sequence. after the command loading cycles, the device enters the internal chip eras e mode, which is automatically timed and will be completed in 50 ms. the host system is not requir ed to provide any control or timing during this operation. 6.8 product identification the product id operation outputs the manufacture r code and device code. programming equipment automatically matches the device with it s proper erase and programming algorithms. the manufacturer and device codes can be accessed by software or hardware operation. in the software access mode, a six-byte command sequence can be used to access the product id. a read from address 0000h outputs the manufacturer code (dah). a read from address 0001h outputs the device code (c1h). the product id operation can be terminated by a three-byte command sequence. in the hardware access mode, access to the product id is activated by forcing #ce and #oe low, #we high, and raising a9 to 12 volts. note: the hardware sid read function is not included in all parts; please refer to ordering information for details.
w29ee011 - 8 - 7. table of operating modes 7.1 operating mode selection operating range = 0 to 70 c (ambient temperature), v dd = 5v 10%, v ss = 0v, v hh = 12v pins mode #ce #oe #we address dq. read v il v il v ih a in dout write v il v ih v il a in din standby v ih x x x high z write inhibit x v il x x high z/d out x x v ih x high z/d out output disable x v ih x x high z 5-volt software chip erase v il v ih v il a in d in product id v il v il v ih a0 = v il ; a1 ? a16 = v il ; a9 = v hh manufacturer code da (hex) v il v il v ih a0 = v ih ; a1 ? a16 = v il ; a9 = v hh device code c1 (hex) 7.2 command codes for software data protection to enable protection to disable protection byte sequence address data address data 0 write 5555h aah 5555h aah 1 write 2aaah 55h 2aaah 55h 2 write 5555h a0h 5555h 80h 3 write - - 5555h aah 4 write - - 2aaah 55h 5 write - - 5555h 20h
w29ee011 publication release date: april 11, 2006 - 9 - revision a18 7.2.1 software data protection acquisition flow software data protection enable flow load data aa to address 5555 load data 55 to address 2aaa load data a0 to address 5555 load data aa to address 5555 load data 55 to address 2aaa load data 80 to address 5555 load data aa to address 5555 load data 55 to address 2aaa load data 20 to address 5555 software data protectio n disable flow pause 10 ms exit sequentially load up to 128 bytes of page data pause 10 ms exit (optional page load operation) notes for software program code: data format: dq7 ? dq0 (hex) address format: a14 ? a0 (hex)
w29ee011 - 10 - 7.3 command codes for software chip erase byte sequence address data 0 write 5555h aah 1 write 2aaah 55h 2 write 5555h 80h 3 write 5555h aah 4 write 2aaah 55h 5 write 5555h 10h 7.3.1 software chip erase acquisition flow load data aa to address 5555 load data 55 to address 2aaa load data 80 to address 5555 load data aa to address 5555 load data 55 to address 2aaa load data 10 to address 5555 pause 50 ms exit notes for software chip erase: data format: dq7 ? dq0 (hex) address format: a14 ? a0 (hex)
w29ee011 publication release date: april 11, 2006 - 11 - revision a18 7.4 command codes for product identification software product identification entry software product identification exit byte sequence address data address data 0 write 5555h aah 5555h aah 1 write 2aaah 55h 2aaah 55h 2 write 5555h 80h 5555h f0h 3 write 5555h aah - - 4 write 2aaah 55h - - 5 write 5555h 60h - - pause 10 s pause 10 s 7.4.1 software product iden tification acquisition flow product identification entry(1) load data aa to address 5555 load data 55 to address 2aaa load data 80 to address 5555 load data aa to address 5555 load data 55 to address 2aaa load data 60 to address 5555 pause 10 s product identification mode(2, 3) read address = 0 data = da read address = 1 data = c1 product identification exit(1) load data aa to address 5555 load data 55 to address 2aaa load data fo to address 5555 pause 10 m s normal mode (4) notes for software product identification: (1) data format: dq7 ? dq0 (hex); address format: a14 ? a0 (hex). (2) a1 ? a16 = v il ; manufacture code is read for a0 = v il ; device code is read for a0 = v ih . (3) the device does not remain in identification mode if power down. (4) the device returns to standard operation mode.
w29ee011 - 12 - 8. electrical characteristics 8.1 absolute maximum ratings parameter rating unit power supply voltage to gnd potential -0.5 to +7.0 v operating temperature 0 to +70 c storage temperature -65 to +150 c d.c. voltage on any pin to ground potential except #oe -0.5 to v dd +1.0 v transient voltage (< 20 ns) on any pin to ground potential -1.0 to v dd +1.0 v voltage on #oe pin to ground potential -0.5 to 12.5 v note: exposure to conditions beyond those listed under absolute maximum ratings may adversely affect the life and reliability of the device. 8.2 dc characteristics 8.2.1 operating characteristics (v dd = 5.0v 10%, gnd = 0v, t a = 0 to 70 c) limits parameter sym. test conditions min. typ. max. unit power supply current i cc #ce = #oe = v il , #we = v ih , all i/os open address inputs = v il /v ih , at f = 5 mhz - - 50 ma standby v dd current (ttl input) i sb 1 #ce = v ih , all i/os open other inputs = v il /v ih - 2 3 ma standby v dd current (cmos input) i sb 2 #ce = v dd -0.3v, all i/os open other inputs = v dd -0.3v/gnd - 20 100 a input leakage current i li v in = gnd to v dd - - 1 a output leakage current i lo v in = gnd to v dd - - 10 a input low voltage v il - -0.3 - 0.8 v input high voltage v ih - 2.0 - v dd +0.5 v output low voltage v ol i ol = 2.1 ma - - 0.45 v output high voltage v oh i oh = -0.4 ma 2.4 - - v 8.2.2 power-up timing parameter symbol typical unit power-up to read operation t pu .read 100 s power-up to write operation t pu .write 5 ms
w29ee011 publication release date: april 11, 2006 - 13 - revision a18 8.2.3 capacitance (v dd = 5.0v, t a = 25 c, f = 1 mhz) parameter symbol conditions max. unit i/o pin capacitance c i/o v i/o = 0v 12 pf input capacitance c in v in = 0v 6 pf 8.3 ac characteristics 8.3.1 ac test conditions (v dd = 5v 10%) parameter conditions input pulse levels 0v to 3v input rise/fall time < 5 ns input/output timing level 1.5v/1.5v output load 1 ttl gate and c l = 30 pf for 70 ns and 100 pf for others. 8.3.2 ac test load and waveforms +5v 1.8k ohm d out 1.3k ohm 100 pf for 90/120/150 ns 30 pf for 70 ns (including jig and scope) input test point 0v 1.5v 3v test point 1.5v output
w29ee011 - 14 - 8.3.3 read cycle timing parameters (v dd = 5.0v 10 %, v dd = 5.0 5 % for 70 ns, gnd = 0v, t a = 0 to 70 c) w29ee011-90 w29ee011-15 parameter symbol min. max. min. max. unit read cycle time trc 90 - 150 - ns chip enable access time tce - 90 - 150 ns address access time taa - 90 - 150 ns output enable access time toe - 45 - 70 ns #ce low to active output tclz 0 - 0 - ns #oe low to active output tolz 0 - 0 - ns #ce high to high-z output tchz - 45 - 45 ns #oe high to high-z output tohz - 45 - 45 ns output hold from address change toh 0 - 0 - ns 8.3.4 byte/page-write cycle timing parameters parameter symbol min. typ. max. unit write cycle (erase and program) twc - - 10 ms address setup time tas 0 - - ns address hold time tah 50 - - ns #we and #ce setup time tcs 0 - - ns #we and #ce hold time tch 0 - - ns #oe high setup time toes 10 - - ns #oe high hold time toeh 10 - - ns #ce pulse width tcp 70 - - ns #we pulse width twp 70 - - ns #we high width twph 150 - - ns data setup time tds 50 - - ns data hold time tdh 10 - - ns byte load cycle time tblc 0.22 - 200 s byte load cycle time-out tblco 300 - - s note: all ac timing signals observe the following guideli nes for determining setup and hold times: (a) high level signal's reference level is v ih and (b) low level signal's reference level is v il .
w29ee011 publication release date: april 11, 2006 - 15 - revision a18 8.3.5 data polling and toggle bit timing parameters w29ee011-90 w29ee011-15 parameter sym. min. max. min. max. unit #oe to data polling output delay toep - 45 - 70 ns #ce to data polling output delay tcep - 90 - 150 ns #oe to toggle bit output delay toet - 45 - 70 ns #ce to toggle bit output delay tcet - 90 - 150 ns
w29ee011 - 16 - 9. timing waveforms 9.1 read cycle timing diagram address a16-0 dq7-0 data valid data valid high-z #ce #oe #we t rc v ih t olz t clz t oe t ce t oh t aa t chz t ohz high-z 9.2 #we controlled write cycle timing diagram address a16-0 dq7-0 data valid internal write starts #ce #oe #we t as t cs t oes t ah t blco t wc t ch t oeh t wph t wp t ds t dh
w29ee011 publication release date: april 11, 2006 - 17 - revision a18 9.3 #ce controlled write cycle timing diagram high z data valid internal write starts dq7-0 t as t ah t blco t wc t cph t oeh t dh t ds t cp t oes address a16-0 #ce #oe #we 9.4 page write cycle timing diagram address a16-0 byte 0 byte 1 byte 2 byte n-1 byte n internal write start dq7-0 t wc t blco t blc t wph t wp #ce #oe #we
w29ee011 - 18 - 9.5 #data polling timing diagram address a16-0 dq7-0 t x x x x t cep t oeh t oep t oes wc #ce #oe #we 9.6 toggle bit timing diagram address a16-0 dq6 t oeh t oes t wc #ce #oe #we
w29ee011 publication release date: april 11, 2006 - 19 - revision a18 9.7 page write timing diagram so ftware data protection mode 5555 5555 aa 55 a0 three-byte sequence for software data protection mode byte/page load cycle starts internal write starts byte n (last byte) byte 0 sw2 sw1 sw0 address a16-0 dq6 2aaa t wp t wph t blc t blco byte n-1 t wc #ce #oe #we 9.8 reset software data protection timing diagram sw2 sw1 sw0 address a16-0 dq7-0 sw3 sw4 sw5 internal programming starts six-byte sequence for resetting software data protection mode t wc t wp t wph t blc t blco 5555 2aaa 5555 5555 2aaa 5555 aa 55 80 aa 55 20 #ce #oe #we
w29ee011 - 20 - 9.9 5 volt-only software chip erase timing diagram sw2 sw1 sw0 address a16-0 dq7-0 sw3 sw4 sw5 internal programming starts six-byte code for 5v-only software chip erase t wc t wp t wph t blc t blco 5555 2aaa 5555 5555 2aaa 5555 aa 55 80 aa 55 10 #ce #oe #we
w29ee011 publication release date: april 11, 2006 - 21 - revision a18 10. ordering information part no. access time (ns) power supply current max. (ma) standby vdd current max. ( a) package cycling hardware sid read function w29ee011-90 90 50 100 600 mil dip 1k y w29ee011-15 150 50 100 600 mil dip 1k y w29ee011t-90 90 50 100 tsop (8 x 20 mm) 1k y w29ee011t-15 150 50 100 tsop (8 x 20 mm) 1k y w29ee011q-90 90 50 100 stsop (8 x 14 mm) 1k y w29ee011q-15 150 50 100 stsop (8 x 14 mm) 1k y w29ee011p-90 90 50 100 32-pin plcc 1k y w29ee011p-15 150 50 100 32-pin plcc 1k y w29ee011-90b 90 50 100 600 mil dip 10k y w29ee011-15b 150 50 100 600 mil dip 10k y w29ee011t90b 90 50 100 tsop (8x20mm) 10k y w29ee011t15b 150 50 100 tsop (8x20mm) 10k y w29ee011q90b 90 50 100 stsop (8x14mm) 10k y w29ee011q15b 150 50 100 stsop (8x14mm) 10k y w29ee011p90b 90 50 100 32-pin plcc 10k y w29ee011p15b 150 50 100 32-pin plcc 10k y w29ee011-90n 90 50 100 600 mil dip 1k n w29ee011-15n 150 50 100 600 mil dip 1k n w29ee011p90n 90 50 100 32-pin plcc 1k n w29ee011p15n 150 50 100 32-pin plcc 1k n w29ee011p90z 90 50 100 lead-free 32-pin plcc 1k y w29ee011p15z 150 50 100 lead-free 32-pin plcc 1k y w29ee011q90z 90 50 100 stsop (8x14mm) 10k y notes: 1. winbond reserves the right to make changes to its products without prior notice. 2. purchasers are responsible for perfo rming appropriate quality assurance test ing on products intended for use in applications where personal injury might occur as a consequence of product failure. 3. in hardware sid read column: y = with sid read function; n = without sid read function.
w29ee011 - 22 - 11. how to read the top marking example: the top marking of 32l-plcc w29ee011p15n 1 st line: winbond logo 2 nd line: the part number: w29ee011p15n 3 rd line: the lot number 4 th line: the tracking code: 149 o b ra 149: packages made in ?01, week 49 o: assembly house id: a means ase, o means ose, ...etc. b: ic revision; a m eans version a, b means version b, ...etc. ra: process code w29ee011p15n 2138977a-a12 149obra
w29ee011 publication release date: april 11, 2006 - 23 - revision a18 12. package dimensions 12.1 32-pin p-dip 1.dimensions d max. & s include mold flash or tie bar burrs. 2.dimension e1 does not include interlead flash. 3.dimensions d & e1 include mold mismatch an d are determined at the mold parting line. 6.general appearance spec. should be based o n final visual inspection spec. . 1.37 1.22 0.054 0.048 notes: symbol min. nom. max. max. nom. min. dimension in inches dimension in mm a b c d e a l s a a 1 2 e 0.050 1.27 0.210 5.33 0.010 0.150 0.016 0.155 0.018 0.160 0.022 3.81 0.41 0.25 3.94 0.46 4.06 0.56 0.008 0.120 0.670 0.010 0.130 0.014 0.140 0.20 3.05 0.25 3.30 0.36 3.56 0.555 0.550 0.545 14.10 13.97 13.84 17.02 15.24 14.99 15.49 0.600 0.590 0.610 2.29 2.54 2.79 0.090 0.100 0.110 b 1 1 e e 1 a 1.650 1.660 41.91 42.16 015 0.085 2.16 0.650 0.630 16.00 16.51 protrusion/intrusion. 4.dimension b1 does not include dambar 5.controlling dimension: inches 15 0 seating plane e a 2 a a c e base plane 1 a 1 e l a s 1 e d 1 b b 32 1 16 17 12.2 32-pin plcc notes: l c 1 b 2 a h e e e b d h d y a a 1 seating plane e g g d 1 13 14 20 29 32 4 5 21 30 1. dimensions d & e do not include interlead flash. 2. dimension b1 does not include dambar protrusion/intrusion. 3. controlling dimension: inches 4. general appearance spec. should be based on final visual inspection sepc. symbol min. nom. max. max. nom. min. dimension in inches dimension in mm a b c d e h e l y a a 1 2 e b 1 g d 3.56 0.50 2.80 2.67 2.93 0.71 0.66 0.81 0.41 0.46 0.56 0.20 0.25 0.35 13.89 13.97 14.05 11.35 11.43 11.51 1.27 h d g e 12.45 12.9 5 13.46 9.91 10.41 10.92 14.86 14.99 15.11 12.32 12.45 12.57 1.91 2.29 0.004 0.095 0.090 0.075 0.495 0.49 0 0.485 0.595 0.590 0.585 0.430 0.410 0.390 0.530 0.51 0.490 0.050 0.453 0.450 0.447 0.553 0.550 0.547 0.014 0.010 0.008 0.022 0.018 0.016 0.032 0.026 0.028 0.115 0.105 0.110 0.020 0.140 1.12 1.42 0.044 0.056 0 10 10 0 0.10 2.41
w29ee011 - 24 - package dimensions, continued 12.3 32-pin tsop (8 x 20 mm) a a a 2 1 l l 1 y c e h d d b e m 0.10(0.004) min. nom. max. min. nom. max. symbol a a b c d e e l l y 1 1 2 a h d note: controlling dimension: millimeters dimension in inches 0.047 0.006 0.041 0.039 0.037 0.007 0.008 0.009 0.005 0.006 0.007 0.720 0.724 0.728 0.311 0.315 0.319 0.780 0.787 0.795 0.020 0.016 0.020 0.024 0.031 0.000 0.004 1 3 5 0.002 1.20 0.05 0.15 1.05 1.00 0.95 0.17 0.12 18.30 7.90 19.80 0.40 0.00 1 0.20 0.23 0.15 0.17 18.40 18.50 8.00 8.10 20.00 20.20 0.50 0.50 0.60 0.80 0.10 3 5 dimension in mm __ __ __ __ __ __ __ __ __ __ __ __ __ __ __ __ 12.4 32-pin stsop (8 x 14 mm) a a a 2 1 l l 1 y e h d d c min. dimension in inches nom. max. min. nom. max. symbol 1.20 0.05 0.15 1.05 1.00 0.95 0.17 0.10 0.50 0.00 0 0.22 0.27 ----- 0.21 12.40 8.00 14.00 0.50 0.60 0.70 0.80 0.10 35 0.047 0.006 0.041 0.040 0.035 0.007 0.009 0.010 0.004 ----- 0.008 0.488 0.315 0.551 0.020 0.020 0.024 0.028 0.031 0.000 0.004 035 0.002 a a b c d e e l l y 1 1 2 a h d dimension in mm b e
w29ee011 publication release date: april 11, 2006 - 25 - revision a18 13. version history version date page description a9 feb. 1998 6 add pause 10 ms 7 add pause 50 ms 8 correct the time 10 ms to 10 s 1, 17 add cycing 100 item a10 jun. 1998 1, 10, 11, 12, 17 add 70 ns bining a11 aug. 1998 1, 2, 17, 19 add tsop package a12 jul. 1999 1, 17 change endurance cycles as 1k/10k 1, 11, 12, 17 delete 70, 120 ns bining 1, 17, 18 delete sop package a13 dec. 2000 4, 17 add in hardware sid read function note a14 mar. 2001 1, 17, 18 add in tsop (8 x 14 mm) package 17 correct part no. in ordering information a15 feb. 19, 2002 4 modify v dd power up/down detection in hardware data protection 18 add how to read the top marking 1, 17, 20 rename tsop (8 x 14 mm) as stsop (8 x 14 mm) a16 feb. 17, 2004 1, 17 add in lead-free 32-pin plcc package a17 april 15 ,2005 23 add important notice a18 april 11, 2006 21 add w29ee011q90z package
w29ee011 - 26 - important notice winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical im plantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other ap plications intended to support or sustain life. further more, winbond products are not intended for applications wherein failure of winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. winbond customers using or selling these products fo r use in such applications do so at their own risk and agree to fully indemnify winbond for any damages resulting from such improper use or sales. headquarters no. 4, creation rd. iii, science-based industrial park, hsinchu, taiwan tel: 886-3-5770066 fax: 886-3-5665577 http://www.winbond.com.tw/ taipei office tel: 886-2-8177-7168 fax: 886-2-8751-3579 winbond electronics corporation america 2727 north first street, san jose, ca 95134, u.s.a. tel: 1-408-9436666 fax: 1-408-5441798 winbond electronics (h.k.) ltd. no. 378 kwun tong rd., kowloon, hong kong fax: 852-27552064 unit 9-15, 22f, millennium city, tel: 852-27513100 please note that all data and specifications are subject to change without notice. all the trade marks of products and companies mentioned in this data sheet belong to their respective owners. winbond electronics (shanghai) ltd. 200336 china fax: 86-21-62365998 27f, 2299 yan an w. rd. shanghai, tel: 86-21-62365999 winbond electronics corporation japan shinyokohama kohoku-ku, yokohama, 222-0033 fax: 81-45-4781800 7f daini-ueno bldg, 3-7-18 tel: 81-45-4781881 9f, no.480, rueiguang rd., neihu district, taipei, 114, taiwan, r.o.c.

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