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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. high isolation voltage safety standard type multi photocoupler series - nepoc series - photocoupler ps2571-1,-4,ps2571l-1,-4 the mark ? ? ? ? shows major revised points. document no. pn10238ej01v0ds (1st edition) (previous no. p13857ej2v0ds00) date published february 2003 cp(k) printed in japan ? ? ? ? nec compound semiconductor devices 1998, 2003 description the ps2571-1, -4 and ps2571l-1, -4 are optically coupled isolators containing gaas light emitting diodes and npn silicon phototransistors. the ps2571-1, -4 are in a plastic dip (dual in-line package) and the ps2571l-1, -4 are lead bending type (gull- wing) for surface mount. features ? high isolation voltage (bv = 5 000 vr.m.s.) ? high current transfer ratio (ctr = 200 % typ.) ? high-speed switching (t r = 3 m s typ., t f = 5 m s typ.) ? ordering number of taping product : ps2571l-1-e3, e4, f3, f4 ? ul approved: file no. e72422 (s) ? bsi approved: no. 8343/8344 ? csa approved: no. ca 101391 ? nemko approved: no. p98102650 ? demko approved: no. 308152 ? semko approved: no. 9832161/01 ? fimko approved: no. f1 11899 ? vde0884 approved (option) applications ? power supply ? telephone, fax ? fa/oa equipment ? programmable logic controller
data sheet pn10238ej01v0ds 2 ps2571-1,-4,ps2571l-1,-4 package dimensions (in millimeters) dip type 19.80.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 4.60.5 6.50.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 ps2571-1 ps2571-4 6.50.5 0.25 +0.1 C0.05 0.25 +0.1 C0.05 4.60.35 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 ps2571-1 6.50.5 0.25 +0.1 C0.05 19.80.5 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m ps2571-4 6.50.5 0 to 15? 7.62 0.25 +0.1 C0.05 16 15 1 2 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9,11,13,15. emitter 10,12,14,16. collector 14 13 34 12 11 56 10 9 78 top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view 16 15 1 2 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9,11,13,15. emitter 10,12,14,16. collector 14 13 34 12 11 56 10 9 78 top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view
data sheet pn10238ej01v0ds 3 ps2571-1,-4,ps2571l-1,-4 lead bending type ps2571l-4 ps2571l-1 4.60.5 0.90.25 9.600.4 0.05 to 0.2 6.50.5 0.25 +0.1 C0.05 3.50.3 2.54 1.250.15 0.25 m 0.15 19.80.5 6.50.5 3.50.3 2.54 1.250.15 0.25 m 0.15 0.90.25 9.600.4 0.25 +0.1 C0.05 0.05 to 0.2 4.60.35 3.50.3 2.54 1.250.15 0.25 m 0.90.25 9.600.4 ps2571l-1 6.50.5 0.05 to 0.2 0.15 0.25 +0.1 C0.05 3.50.3 2.54 1.250.15 0.25 m 0.90.25 9.600.4 ps2571l-4 19.80.5 6.50.5 0.15 0.25 +0.1 C0.05 0.05 to 0.2 16 15 1 2 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9,11,13,15. emitter 10,12,14,16. collector 14 13 34 12 11 56 10 9 78 top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view 16 15 1 2 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9,11,13,15. emitter 10,12,14,16. collector 14 13 34 12 11 56 10 9 78 top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view
data sheet pn10238ej01v0ds 4 ps2571-1,-4,ps2571l-1,-4 lead bending type for long distance 4.60.5 6.50.5 0 to 15? 10.16 3.50.3 3.850.4 3.150.35 2.54 1.250.15 0.500.10 0.25 m 4.60.5 4.60.35 6.50.5 3.50.3 3.850.4 3.150.35 1.250.15 2.54 0.500.10 0.25 m 3.50.3 2.54 0.25 m 1.250.15 0.90.25 11.8 0.250.2 0.25 10.16 10.16 0.90.25 0.250.2 3.50.3 0.25 m 1.250.15 2.54 0 to 15? 10.16 4.60.35 ps2571l2-1 ps2571l1-1 ps2571l2-1 ps2571l1-1 6.50.5 +0.2 C0.5 11.8 +0.2 C0.5 +0.1 C0.05 0.25 +0.1 C0.05 0.25 6.50.5 0.25 0.25 +0.1 C0.05 0.25 +0.1 C0.05 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view 4 3 1 2 1. anode 2. cathode 3. emitter 4. collector top view
data sheet pn10238ej01v0ds 5 ps2571-1,-4,ps2571l-1,-4 photocoupler construction parameter unit (min.) air distance 7 mm outer creepage distance 7 mm inner creepage distance 4 mm isolation distance 0.4 mm ordering information part number package packing style safety standard approval application part number *1 ps2571-1 4-pin dip magazine case 100 pcs standard products ps2571-1 ps2571l-1 (ul, csa, bsi, ps2571l-1-e3 embossed tape 1 000 pcs/reel nemko, semko, ps2571l-1-e4 demko, fimko ps2571l-1-f3 embossed tape 2 000 pcs/reel approved) ps2571l-1-f4 ps2571-4 16-pin dip magazine case 20 pcs ps2571-4 ps2571l-4 ps2571-1-v 4-pin dip magazine case 100 pcs vde0884 approved ps2571-1 ps2571l-1-v products (option) ps2571l-1-v-e3 embossed tape 1 000 pcs/reel ps2571l-1-v-e4 PS2571L-1-V-F3 embossed tape 2 000 pcs/reel ps2571l-1-v-f4 ps2571-4-v 16-pin dip magazine case 20 pcs ps2571-4 ps2571l-4-v *1 for the application of the safety standard, following part number should be used.
data sheet pn10238ej01v0ds 6 ps2571-1,-4,ps2571l-1,-4 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit ps2571-1, ps2571l-1 ps2571-4, ps2571l-4 diode forward current (dc) i f 50 ma reverse voltage v r 6v power dissipation derating d p d / c 0.7 0.55 mw/ c power dissipation p d 70 55 mw/ch peak forward current *1 i fp 1a transistor collector to emitter voltage v ceo 40 v emitter to collector voltage v eco 5v collector current i c 40 ma/ch power dissipation derating d p c / c 1.5 1.2 mw/ c power dissipation p c 150 120 mw/ch isolation voltage *2 bv 5 000 vr.m.s. operating ambient temperature t a - 55 to +100 c storage temperature t stg - 55 to +150 c *1 pw = 100 m s, duty cycle = 1 % *2 ac voltage for 1 minute at t a = 25 c, rh = 60 % between input and output
data sheet pn10238ej01v0ds 7 ps2571-1,-4,ps2571l-1,-4 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 10 ma 1.2 1.4 v reverse current i r v r = 5 v 5 m a terminal capacitance c t v = 0 v, f = 1.0 mhz 50 pf transistor collector to emitter dark current i ceo v ce = 40 v, i f = 0 ma 100 na coupled current transfer ratio (i c /i f ) *1 ctr i f = 5 ma, v ce = 5 v 80 200 400 % collector saturation voltage v ce (sat) i f = 10 ma, i c = 2 ma 0.3 v isolation resistance r i-o v i-o = 1.0 kv dc 10 11 w isolation capacitance c i-o v = 0 v, f = 1.0 mhz 0.5 pf rise time *2 t r v cc = 10 v, i c = 2 ma, r l = 100 w 3 m s fall time *2 t f 5 *1 ctr rank (ps2571-1,ps2571l-1 only) *2 test circuit for switching time d : 100 to 300 % pw = 100 s duty cycle = 1/10 m pulse input v cc v out r l = 100 w 50 w i f in monitor
data sheet pn10238ej01v0ds 8 ps2571-1,-4,ps2571l-1,-4 typical characteristics (t a = 25 c, unless otherwise specified) 75 50 25 0255075 100 125 150 0.7 mw/?c 0.55 mw/?c ps2571-1 ps2571l-1 ps2571-4 ps2571l-4 150 100 50 25 50 75 100 125 150 0 1.5 mw/?c 1.2 mw/?c ps2571-1 ps2571l-1 ps2571-4 ps2571l-4 100 10 1 0.1 0.01 0.0 0.5 1.0 1.5 2.0 diode power dissipation p d (mw) ambient temperature t a (?c) diode power dissipation vs. ambient temperature transistor power dissipation p c (mw) ambient temperature t a (?c) forward current i f (ma) forward voltage v f (v) collector to emitter dark current i ceo (na) collector saturation voltage v ce(sat) (v) ambient temperature t a (?c) transistor power dissipation vs. ambient temperature forward current vs. forward voltage collector to emitter dark current vs. ambient temperature collector current vs. collector saturation voltage collector current i c (ma) collector current i c (ma) collector to emitter voltage v ce (v) collector current vs. collector to emitter voltage 0.1 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 2 ma i f = 1 ma 5 ma 10 ma 20 ma 50 ma 68 4 2 010 50 40 30 20 10 10 ma 50 ma 20 ma 5 ma i f = 1 ma C50 C25 0 25 50 75 100 0.1 1 10 100 1 000 10 000 v ce = 40 v 25 v 10 v 5 v 0 ?c C25 ?c C50 ?c +60 ?c +25 ?c t a = +100 ?c
data sheet pn10238ej01v0ds 9 ps2571-1,-4,ps2571l-1,-4 0 C5 C10 C15 C20 0.5 1 2 5 10 20 50 100 200 500 i c = 1 ma, v cc = 5 v 100 w 300 w r l = 1 k w t a = 25 ?c t a = 60 ?c 1.2 1.0 0.8 0.6 0.4 0.2 0 10 2 10 3 10 4 10 5 forward current i f (ma) ambient temperature t a (?c) load resistance r l ( w ) frequency f (khz) normalized current transfer ratio ctr current transfer ratio ctr (%) normalized gain g v load resistance r l ( w ) normalized current transfer ratio vs. ambient temperature current transfer ratio vs. forward current switching time vs. load resistance switching time vs. load resistance frequency response time (hr) ctr (relative value) long term ctr degradation switching time t ( s) m switching time t ( s) m 1.2 C50 1.0 0.8 0.6 0.4 0.2 0.0 C25 0 25 50 75 100 normalized to 1.0 at t a = 25 ?c, i f = 5 ma, v ce = 5 v 0.01 0.1 1 10 100 0 50 100 150 200 250 300 100 10 1 0.1 10 k 1 k 100 10 i c = 2 ma, v cc = 10 v, ctr = 220 % t f t r t d t s 10 100 1 k 10 k 100 k 0.1 1 10 100 1 000 t r t d t f t s i f = 5 ma, v cc = 5 v, ctr = 220 % i f = 5 ma (typ.) v ce = 5 v remark the graphs indicate nominal characteristics.
data sheet pn10238ej01v0ds 10 ps2571-1,-4,ps2571l-1,-4 taping specifications (in millimeters) tape direction ps2571l-1-e3 ps2571l-1-e4 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.00.1 0.4 5.30.1 8.00.1 outline and dimensions (reel) packing: 1 000 pcs/reel 7.50.1 16.00.3 10.30.1 1.5 +0.1 C0 2.00.5 r 1.0 13.00.2 f 21.00.8 f 2542.0 80.01.0 2.00.5 f f 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10238ej01v0ds 11 ps2571-1,-4,ps2571l-1,-4 tape direciton ps2571l-1-f3 ps2571l-1-f4 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.00.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 C0 outline and dimensions (reel) packing: 2 000 pcs/reel 2.00.5 r 1.0 13.00.2 f 21.00.8 f 3302.0 1001.0 2.00.5 f f 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10238ej01v0ds 12 ps2571-1,-4,ps2571l-1,-4 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) cautions ?fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly between the photocouplers input and output or between collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.
data sheet pn10238ej01v0ds 13 ps2571-1,-4,ps2571l-1,-4 usage cautions 1. protect against static electricity when handling. 2. avoid storage at a high temperature and high humidity.
data sheet pn10238ej01v0ds 14 ps2571-1,-4,ps2571l-1,-4 m8e 00. 4 - 0110 the information in this document is current as of february, 2003. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).
nec compound semiconductor devices hong kong limited hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-01 fax: +49-211-6503-487 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0302 nec compound semiconductor devices, ltd. 5th sales group, sales division tel: +81-44-435-1588 fax: +81-44-435-1579 e-mail: salesinfo@csd-nec.com for further information, please contact ps2571-1,-4,ps2571l-1,-4 safety information on this product caution gaas products the product contains gallium arsenide, gaas. gaas vapor and powder are hazardous to human health if inhaled or ingested. ? do not destroy or burn the product. ? do not cut or cleave off any part of the product. ? do not crush or chemically dissolve the product. ? do not put the product in the mouth. follow related laws and ordinances for disposal. the product should be excluded from general industrial waste or household garbage.

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