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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
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without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. 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the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos integrated circuit pd444016-y 4m-bit cmos fast sram 256k-word by 16-bit extended temperature operation data sheet document no. m15391ej3v0ds00 (3rd edition) date published september 2006 ns cp(k) printed in japan the mark shows major revised points. the revised points can be easily searched by copying an "" in the pdf file and s pecifying it in the "find what:" field. description the pd444016-y is a high speed, low power, 4,194,304 bits (262,144 words by 16 bits) cmos static ram. operating supply voltage is 5.0 v 0.5 v. the pd444016-y is packaged in 44-pin plastic tsop (ii). features ? 262,144 words by 16 bits organization ? fast access time : 8, 10, 12 ns (max.) ? byte data control : /lb (i/o1 - i/o8), /ub (i/o9 - i/o16) ? output enable input for easy application ? single +5.0 v power supply ordering information part number package access time supply current ma (max.) ns (max.) at operating at standby pd444016g5-8y-7jf 44-pin plastic tsop (ii) 8 220 10 pd444016g5-10y-7jf (10.16 mm (400)) 10 200 pd444016g5-12y-7jf (normal bent) 12 190 pd444016g5-8y-7jf-a 8 220 pd444016g5-10y-7jf-a 10 200 pd444016g5-12y-7jf-a 12 190 remark products with - a at the end of the part num ber are lead-free products.
2 pd444016-y data sheet m15391ej3v0ds pin configuration (marking side) / indicates active low signal. 44-pin plastic tsop (ii) (10.16 mm (400)) (normal bent) [ pd444016g5- y-7jf ] [ pd444016g5- y-7jf-a ] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 a0 a1 a2 a3 a4 /cs i/o1 i/o2 i/o3 i/o4 v cc gnd i/o5 i/o6 i/o7 i/o8 /we a5 a6 a7 a8 a9 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 a17 a16 a15 /oe /ub /lb i/o16 i/o15 i/o14 i/o13 gnd v cc i/o12 i/o11 i/o10 i/o9 nc a14 a13 a12 a11 a10 a0 - a17 : address inputs i/o1 - i/o16 : data inputs / outputs /cs : chip select /we : write enable /oe : output enable /lb, /ub : byte data select v cc : power supply gnd : ground nc : no connection remark refer to package drawing for the 1-pin index mark.
3 pd444016-y data sheet m15391ej3v0ds block diagram gnd v cc /we /oe /cs input data controller sense amplifier / switching circuit column decoder address buffer a0 | a17 address buffer row decoder memory cell array 4,194,304 bits output data controller /lb /ub i/o9 - i/o16 i/o1 - i/o8 truth table /cs /oe /we /lb /ub mode i/o supply current i/o1 - i/o8 i/o9 - i/o16 h not selected high impedance high impedance i sb l l h l l read d out d out i cc l h d out high impedance h l high impedance d out l l l l write d in d in l h d in high impedance h l high impedance d in l h h output disable high impedance high impedance l h h high impedance high impedance remark : don?t care
4 pd444016-y data sheet m15391ej3v0ds electrical specifications absolute maximum ratings parameter symbol condition rating unit supply voltage v cc ?0.5 note to +7.0 v input / output voltage v t ?0.5 note to v cc +0.5 v operating ambient temperature t a ?40 to +85 c storage temperature t stg ?55 to +125 c note ?2.0 v (min.) (pulse width : 2 ns) caution exposing the device to stress above those listed in absolute maximum rating could cause permanent damage. the device is not meant to be operated under conditions outside the limits described in the operational section of this speci fication. exposure to absolute maximum rating conditions for extended periods may affect device reliability. recommended operating conditions parameter symbol condition min. typ. max. unit supply voltage v cc 4.5 5.0 5.5 v high level input voltage v ih 2.2 v cc +0.5 v low level input voltage v il ?0.5 note +0.8 v operating ambient temperature t a ?40 +85 c note ?2.0 v (min.) (pulse width : 2 ns)
5 pd444016-y data sheet m15391ej3v0ds dc characteristics (recommended operating conditions unless otherwise noted) parameter symbol test condition min. typ. max. unit input leakage current i li v in = 0 v to v cc ?2 +2 a output leakage current i lo v i/o = 0 v to v cc , /cs = v ih or /oe = v ih ?2 +2 a or /we = v il or /lb = v ih or /ub = v ih operating supply current i cc /cs = v il , cycle time : 8 ns 220 ma i i/o = 0 ma, cycle time : 10 ns 200 minimum cycle time cycle time : 12 ns 190 standby supply current i sb /cs = v ih , v in = v ih or v il 40 ma i sb1 /cs v cc ? 0.2 v, 10 v in 0.2 v or v in v cc ? 0.2 v high level output voltage v oh i oh = ?4.0 ma 2.4 v low level output voltage v ol i ol = +8.0 ma 0.4 v remarks 1. v in : input voltage v i/o : input / output voltage 2. these dc characteristics are in comm on regardless of product classification. capacitance (t a = 25 c, f = 1 mhz) parameter symbol test condition min. typ. max. unit input capacitance c in v in = 0 v 6 pf input / output capacitance c i/o v i/o = 0 v 8 pf remarks 1. v in : input voltage v i/o : input / output voltage 2. these parameters are not 100% tested.
6 pd444016-y data sheet m15391ej3v0ds ac characteristics (recommended operati ng conditions unless otherwise noted) ac test conditions input waveform (rise and fall time 3 ns) test points gnd 3.0 v 1.5 v 1.5 v output waveform test points 1.5 v 1.5 v output load ac characteristics directed with the note s hould be measured with t he output load shown in figure 1 or figure 2 . figure 1 figure 2 (t aa , t acs , t oe , t abd , t oh ) (t clz , t olz , t blz , t chz , t ohz , t bhz , t whz , t ow ) v tt = +1.5 v i/o (output) 50 z o = 50 30 pf c l +5.0 v i/o (output) 480 5 pf c l 255 remark c l includes capacitances of the probe and jig, and stray capacitances.
7 pd444016-y data sheet m15391ej3v0ds read cycle parameter symbol pd444016-8y pd444016-10y pd444016-12y unit notes min. max. min. max. min. max. read cycle time t rc 8 10 12 ns address access time t aa 8 10 12 ns 1 /cs access time t acs 8 10 12 ns /oe access time t oe 4 5 6 ns /lb, /ub access time t abd 4 5 6 ns output hold from address change t oh 3 3 3 ns /cs to output in low impedance t clz 3 3 3 ns 2, 3 /oe to output in low impedance t olz 0 0 0 ns /lb, /ub to output in low impedance t blz 0 0 0 ns /cs to output in high impedance t chz 4 5 6 ns /oe to output hold in high impedance t ohz 4 5 6 ns /lb, /ub to output hold in high impedance t bhz 4 5 6 ns notes 1. see the output load shown in figure 1 . 2. transition is measured at 200 mv from steady-state voltage with the output load shown in figure 2 . 3. these parameters ar e not 100% tested. read cycle timing chart 1 (address access) t oh t rc t aa address (input) i/o (output) previous data out data out remarks 1. in read cycle, /we should be fixed to high level. 2. /cs = /oe = /lb (or /ub) = v il
8 pd444016-y data sheet m15391ej3v0ds read cycle timing chart 2 (/cs access) address (input) t rc t aa t olz /cs (input) i/o (output) data out t ohz high impedance t acs /oe (input) t oe t clz t chz high impedance /lb, /ub (input) t blz t abd t bhz caution address valid prior to or co incident with /cs low level input. remark in read cycle, /we should be fixed to high level.
9 pd444016-y data sheet m15391ej3v0ds write cycle parameter symbol pd444016-8y pd444016-10y pd444016-12y unit notes min. max. min. max. min. max. write cycle time t wc 8 10 12 ns /cs to end of write t cw 6 7 8 ns address valid to end of write t aw 6 7 8 ns write pulse width t wp 6 7 8 ns /lb, /ub to end of write t bw 6 7 8 ns data valid to end of write t dw 4 5 6 ns data hold time t dh 0 0 0 ns address setup time t as 0 0 0 ns write recovery time t wr 0 0 0 ns /we to output in high impedance t whz 4 5 6 ns 1, 2 output active from end of write t ow 3 3 3 ns notes 1. transition is measured at 200 mv from steady-state voltage with the output load shown in figure 2 . 2. these parameters ar e not 100% tested. write cycle timing chart 1 (/we controlled) t wc t cw t wp t wr address (input) /cs (input) /we (input) i/o (input / output) t dh t whz t aw high impe- dance high impe- dance t ow indefinite data out data in indefinite data out t dw t as /lb, /ub (input) t bw cautions 1. /cs or /we should be fixed to high level during address transition. 2. do not input data to the i/o pins while they are in the output state. remarks 1. write operation is done duri ng the overlap time of a low level /cs, /lb and/or /ub, and a low level /we. 2. when /we is at low level, the i/o pins are always high impedance. when /we is at high level, read operation is executed. t herefore /oe should be at high level to make the i/o pins high impedance.
10 pd444016-y data sheet m15391ej3v0ds write cycle timing chart 2 (/cs controlled) t wc t as t cw t aw t wp t wr t dw t dh address (input) /cs (input) /we (input) /lb, /ub (input) high impedance data in high impedance t bw i/o (input) cautions 1. /cs or /we should be fixed to high level during address transition. 2. do not input data to the i/o pins while they are in the output state. remark write operation is done during the overlap time of a low level /cs, /lb and/or /ub, and a low level /we.
11 pd444016-y data sheet m15391ej3v0ds write cycle timing chart 3 (/lb, /ub controlled) t wc t as t bw t wr t dw t dh address (input) /lb, /ub (input) /we (input) /cs (input) high impedance data in high impedance t cw i/o (input) t aw t wp cautions 1. /cs or /we should be fixed to high level during address transition. 2. do not input data to the i/o pins while they are in the output state. remark write operation is done during the overlap time of a low level /cs, /lb and/or /ub, and a low level /we.
12 pd444016-y data sheet m15391ej3v0ds package drawing 44-pin plastic tsop ( ii ) (10.16 mm (400)) note each lead centerline is located within 0.13 mm of its true position (t.p.) at maximum material condition. item millimeters a c 18.63 max. 0.93 max. 0.1 + ? + ? + ? s44g5-80-7jf5-1 m 44 23 122 s n s k l f e p j g dm c a b h i detail of lead end
13 pd444016-y data sheet m15391ej3v0ds recommended soldering conditions please consult with our sales offi ces for soldering conditions of the pd444016-y. type of surface mount device pd444016g5-7jf : 44-pin plastic tsop (ii) (10.16 mm (400)) (normal bent) pd444016g5-7jf-a : 44-pin plastic tsop (ii) (10.16 mm (400)) (normal bent) quality grade ? a quality grade of the products is ?standard?. ? anti-radioactive design is not implemented in the products. ? semiconductor devices have the possibilit y of unexpected defects by affection of cosmic ray that reach to the ground and so forth.
14 pd444016-y data sheet m15391ej3v0ds revision history edition/ page type of location description date this previous revision (previous edition this edition) edition edition 3rd edition/ p.13 p.13 addition quality grade section of quality grade has been added. sep. 2006
15 pd444016-y data sheet m15391ej3v0ds 1 2 3 4 voltage application waveform at input pin waveform distortion due to input noise or a reflected wave may cause malfunction. if the input of the cmos device stays in the area between v il (max) and v ih (min) due to noise, etc., the device may malfunction. take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between v il (max) and v ih (min). handling of unused input pins unconnected cmos device inputs can be cause of malfunction. if an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd via a resistor if there is a possibility that it will be an output pin. all handling related to unused pins must be judged separately for each device and according to related specifications governing the device. precaution against esd a strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. environmental control must be adequate. when it is dry, a humidifier should be used. it is recommended to avoid using insulators that easily build up static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work benches and floors should be grounded. the operator should be grounded using a wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with mounted semiconductor devices. status before initialization power-on does not necessarily define the initial status of a mos device. immediately after the power source is turned on, devices with reset functions have not yet been initialized. hence, power-on does not guarantee output pin levels, i/o settings or contents of registers. a device is not initialized until the reset signal is received. a reset operation must be executed immediately after power-on for devices with reset functions. power on/off sequence in the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. when switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. the correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. input of signal during power off state do not input signals or an i/o pull-up power supply while the device is not powered. the current injection that results from input of such a signal or i/o pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. notes for cmos devices 5 6
pd444016-y the information in this document is current as of september, 2006. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) (1) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. (2) "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). ? ? ? ? ? ? m8e 02. 11-1

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