infrared led chip gaalas/gaa s 1. material substrate gaas (n type) epitaxial layer gaala s (p/n type) 2. electrode n(cathode) side gold alloy p(anode) side gold alloy 3. electro-optical parameter s ymbo l min typ max unit condition characteristics forward voltage v f 1.35 v if=250ma reverse voltage v r 5 v ir=10ua radiant power p o 8.5 mw if=250ma p 940 nm if=20ma ? 45 nm if=20ma note : led chip is mounted on to-18 gold header without resin coating. 4. mechanical data (a) emission area -------------------------- - 38.5mil x 38.5mil (b) bottom area -------------------------- - 40.0mil x 40.0mil (c) bonding pad -------------------------- - 120um (d) chip thickness -------------------------- - 11mil (e) junction height -------------------------- - 6.7mil epi epi p n p side electrode n side electrode eoyang factory,513-5 eoyang-dong, iksan, 570-210, korea tel. +82 63 839 1111 fax. +82 63 835 8259 www.auk.co.kr OPA9410EDD auk corp. wavelength (e) (d) substrate
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