new ss-229 r1 aha 4/04/02 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 1 of 9 koa speer electronics, inc. certified noise filters kc series 1. features compact physical dimensions excellent wave reflection control exceptional emi attenuation excellent as impedance matching for signal lines 3. ordering & specifying information type designation shall be as the following form. 2. applications clock output signal line in/out video signal line for super high resolution high speed signal line noise reduction for various signal circuits kc 2af l te 220 n 100 l type size termination packaging capacitance capacitance inductance inductance material value (pf) tolerance value (nh) tolerance 2af l= t: 7" paper tape tw o n: 30% 10nh l: 15% 2a 90% tin (2af only) significant 10% te: 7" embossed digits + lead taping (2a only) no. of 2af: 4,000 pcs/reel zeros 2a: 2,000 pcs/reel 4. internal connection of the parts kc2af kc2a
bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 2 of 9 ss-229 r1 koa speer electronics, inc. dimensions in inches (mm) size l w t g e f 2af 0.078 0.0078 0.049 0.0078 0.031 0.0078 0.0157 0.0118 0.0118 0.0078 n/a (2.0 0.2) (1.25 0.2) (0.8 0.2) (0.4 0.3) (0.3 0.2) 6. dimension 2af item specification operating temperature range -25? ~ +85? (2af) -40? ~ +85? (2a) storage temperature range -40? ~ +85? (after soldering) measuring condition (standard) temperature 15 ~ 35? relative humidity 20 ~ 90% measuring condition (precision) temperature 20? ?? relative humidity 60 ~ 67% 5. rating
bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 3 of 9 ss-229 r1 koa speer electronics, inc. 2a 6. dimension cont. dimensions in inches (mm) size l w t g e f 2a 0.078 0.0078 0.049 0.0078 0.062 0.0078 0.0157 0.0078 0.0039 0.0098 0.0059 (2.0 0.2) (1.25 0.2) (1.6 0.2) (0.4 0.2) (min 0.1) (0.25 0.15)
ss-229 r1 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 4 of 9 koa speer electronics, inc. resist through hole ordering code kc2afl151n16n5l kc2afl700n8n50l kc2al120n6nsl KC2AL180N13NL kc2al350n15nl 25 25 200 200 1000 1000 -25 ~ +85 -40 ~ +85 table-1 cap. (pf) % induct. (nh) % rated voltage dc (v) rated current dc (ma) temp. range (?) 150 30% 70 30% 12 30% 18 30% 35 30% insulation resist. (m ? ) min. 16.5 15% 8.5 15% 6.5 15% 13 15% 15 15% 6. pattern design the land pattern is recommended as follows. connect to ground pattern of mounting side ground pattern back side chip mounting side resist through hole (unit: mm) 2af 2a 50 mhz 100 mhz typical cut-off freq. (att = 3db)
ss-229 r1 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 5 of 9 koa speer electronics, inc. item requirement conditions insulation resistance within the tolerance terminals: voltage: dc25v test time: 60 sec capacitance within the tolerance terminals: frequency: 1mhz voltage: 1v equipment: hp4192a fixture: hp16034e inductance within the tolerance terminals: frequency: 1mhz current: 10ma equipment: hp4192a fixture: hp16034e resistance within the tolerance terminals: (kc2a only) frequency: 1mhz current: 10ma equipment: hp4192a fixture: hp16034e capacitance vs. variation rate of capacitance in operate the capacitance shall be measured at each temperature temperature are shown in below. stage below. the rate shall be calculated characteristics part rate against the capacitance measured at 20? kc2al120n6nsl 10% step temperature KC2AL180N13NL 10% 1 20? kc2al350n15nl 10% 2 -40? 3? 3 20? 485 c 3 c terminal adhesion no physical damage solder a chip to a test strength substrate and then laterally apply a load (5n, 500gf) in the arrow direction. soldering heat appearance: no physical damage flux: 25% rosin resistance capacitance: within tolerance pre-heating: 120 ~ 180 sec dielectric loss: within tolerance pre-heating temp: 150? ~ 200? (kc2af) insulation resistance: within tolerance solder: h60a withstand voltage: no abnormality solder temp: 260? ?? dip time: 5 ?.5 sec 8. characteristics substrate chip force direction
bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 6 of 9 ss-229 r1 koa speer electronics, inc. item requirement conditions solderablility more than 95% of the terminal electrode flux: 25% rosin shall be covered with new solder. solder: h60a solder temp: 235? ?? dip time: 2 ?.5 sec temperature cycle appearance: no physical damage repeat the following heat cycle 10 times: capacitance: within tolerance step temperature time dielectric loss: within tolerance 1 -40? ?? 30 min ? min insulation resistance: within tolerance 2 room temp. 15 min max. withstand voltage: no abnormality 3 85? ?? 30 min ? min 4 room temp. 15 min max. high temperature appearance: no physical damage temp: 70? ?? resistance capacitance: within tolerance bias: dc25v dielectric loss: within tolerance bias: dc200ma insulation resistance: within tolerance test time: 500 hour withstand voltage: no abnormality humidity resistance appearance: no physical damage temp: 85? ?? (unload) capacitance: within tolerance humidity: 85% ?% dielectric loss: within tolerance test time: 500 hour insulation resistance: within tolerance vending substrate appearance: no physical damage after soldering a chip to a test substrate, capacitance: within tolerance bend the substrate by 1 mm and then measure. the substrate is ge4 or based on ge4. humidity resistance appearance: no physical damage temp: 40? ?? (load) capacitance: within tolerance humidity: 90% ~ 95% dielectric loss: within tolerance bias: dc25v insulation resistance: within tolerance bias: dc200ma test time: 500 hour 8. characteristics cont. after temperature cycle test, high temperature resistance test, humidity resistance test or low temperature resistance test, the tested sample should be measured after having left in temperature from 15 to 35? and relative humidity from 20% to 90% for 24 hours. weight 20 displacement substrate 45 2 45 2
ss-229 r1 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 7 of 9 koa speer electronics, inc. 9. packaging specifications 9.1 taping packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. feeding hole chip pocket t1 t2 a b p1 p2 p0 d0 e f w chip component .series a b w f e p1 kc2af 0.061 0.003 0.090 0.003 0.314 0.0078 0.137 0.001 0.068 0.003 0.157 0.003 series (1.55 01) (2.3 0.1) (8.0 0.2) (3.5 0.05) (1.75 0.1) (4.0 0.1) kc2a 0.061 0.003 0.090 0.003 0.314 0.0078 0.137 0.001 0.068 0.003 0.157 0.003 series (1.55 0.1) (2.3 0.1) (8.0 0.2) (3.5 0.05) (1.75 0.1) (4.0 0.1) dimensions in inches (mm) series p2 p0 d0 t1 t2 kc2af 0.078 0.001 0.157 0.003 0.059 ... .... 0.037 0.001 n/a series (2.0 0.05) (4.0 0.1) (1.5 ) (0.95 0.05) kc2a 0.078 0.001 0.157 0.003 0.059 ... .... 0.009 0.001 0.074 0.003 series (2.0 0.05) (4.0 0.1) (1.5 ) (0.25 0.05) (1.9 0.1) + 0.1 -0 + 0.003 -0 + 0.1 -0 + 0.003 -0 dimensions in inches (mm) (1) dimensions of carrier tape
ss-229 r1 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com page 8 of 9 koa speer electronics, inc. (1) dimensions of carrier tape cont. empty top tape 15.75 (400) 6.30 (160) 6.30 (160) empty tape running direction a ? ? .079 (2.0 0.5) w ? 2a embossed carrier (2af size: paper tape) embossed cavity (2) reel dimensions a b c d e w (min) w (max) kc 7.00 0.78 2.36 0.511 0.02 0.83 0.03 0.079 0.02 0.311 0.059 0.429 0.059 series (178 2) (60 min) (13 0.5) (21 0.8) (2 0.5) (7.9 1.5) (10.9 1.5) dimensions in inches (mm) 9.2 construction of packaging on continuous tapes (2af only) packaging of components on continuous tape is complete with carrier tape for putting components and cover tape for sealing. materials reel: polystyrene carrier tape: paper top cover tape: polyester base bottom cover tape: paper
ss-229 r1 bolivar drive p.o. box 547 bradford, pa 16701 usa 814-362-5536 fax 814-362-8883 www.koaspeer.com notice: the information contained in this spec sheet is believed to be accurate and up-to-date. koa speer electronics reserves this right to change these specifications without notice. page 9 of 9 koa speer electronics, inc. 11. recommended soldering conditions 250 c 150 c preheat 120 seconds max. soldering 3-4 seconds max. natural cooling recommended condition for flow soldering 250 c 150 c preheat 180 seconds max. soldering 10 seconds max. natural cooling recommended condition for reflow soldering 120 seconds min. 230 c - 250 c 230 c - 250 c 120 seconds min. 250 c 150 c preheat 120 seconds max. soldering 4 seconds max. natural cooling recommended condition for iron soldering 220 c - 250 c 120 seconds min. 10. general information (1) storage the products must be stored from 10 to 35? and from 30% to 70% rh before soldering. (2) soldering in general, ceramics are very sensitive to thermal shocks. therefore the parts shall not be exposed to a sudden temperature increase, decrease or partial heating. products shall be pre-heated prior to soldering. the temperature difference between the solder temperature and product temperature does not exceed 130?. it is desirable that the soldering temperature be kept 240 - 250? and that soldering time be less than 4 seconds. flux shall be rosin type. do not use strong acid type flux. the tip of the soldering iron shall be 20 w or less, 3?or less, and 220 - 250 c. recommended soldering thermal and time conditions are shown appendix 2. (3) mounting after mounting components on the printed circuit board, do not apply stress through board bending or mishandling.
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